公开(公告)号：US20180063966A1

公开(公告)日：2018-03-01

申请号：US15607872

申请日：2017-05-30

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Chih-Hsien Chiu ,  Chen-Wen Huang ,  Hsin-Lung Chung ,  Wen-Jung Tsai ,  Jia-Huei Hung ,  Fu-Tang Huang

IPC: H05K3/32 ,  H01L23/00 ,  H01L23/373 ,  H01L21/48

CPC classification number: H05K3/323 ,  H01L21/4853 ,  H01L23/373 ,  H01L24/73

Abstract: An electronic package structure is provided, which includes: a carrier; at least one electronic component and a plurality of conductive elements disposed on the carrier; a metal frame bonded to the conductive elements; and an encapsulant formed on the carrier and the metal frame and encapsulating the electronic component and the conductive elements. The metal frame is exposed from the encapsulant to serve as an electrical contact. As such, instead of using a mold having a particular size corresponding to the electronic package structure as in the prior art, the present disclosure can use a common mold to form the encapsulant, thereby reducing the fabrication cost. The present disclosure further provides a method for fabricating the electronic package structure.

公开(公告)号：US09907186B1

公开(公告)日：2018-02-27

申请号：US15607872

申请日：2017-05-30

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Chih-Hsien Chiu ,  Chen-Wen Huang ,  Hsin-Lung Chung ,  Wen-Jung Tsai ,  Jia-Huei Hung ,  Fu-Tang Huang

IPC: H01L23/495 ,  H05K3/32 ,  H01L23/00 ,  H01L23/373 ,  H01L21/48

CPC classification number: H05K3/323 ,  H01L21/4853 ,  H01L23/373 ,  H01L24/73

Abstract: An electronic package structure is provided, which includes: a carrier; at least one electronic component and a plurality of conductive elements disposed on the carrier; a metal frame bonded to the conductive elements; and an encapsulant formed on the carrier and the metal frame and encapsulating the electronic component and the conductive elements. The metal frame is exposed from the encapsulant to serve as an electrical contact. As such, instead of using a mold having a particular size corresponding to the electronic package structure as in the prior art, the present disclosure can use a common mold to form the encapsulant, thereby reducing the fabrication cost. The present disclosure further provides a method for fabricating the electronic package structure.

公开(公告)号：US20180247886A1

公开(公告)日：2018-08-30

申请号：US15590174

申请日：2017-05-09

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Chih-Hsien Chiu ,  Tsung-Hsien Tsai ,  Hsin-Lung Chung ,  Chen-Wen Huang ,  Fang-Hsien Shen

IPC: H01L23/495 ,  H01L23/31 ,  H01L21/56

Abstract: The disclosure provides a method for manufacturing an electronic package structure, including disposing on a carrier an electronic component and a conductive frame including a plurality of conductive pads and supporting parts; and covering the electronic component and the supporting parts of the conductive frame with an encapsulating layer while allowing the conductive pads to be exposed from the encapsulating layer, thereby increasing the efficiency and reducing the cost of manufacturing processes with the design of the conductive frame. The disclosure further provides the electronic package structure as described above.