-
公开(公告)号：US10587041B2
公开(公告)日：2020-03-10
申请号：US15596113
申请日：2017-05-16
发明人： Chih-Yuan Shih , Chih-Hsien Chiu , Yueh-Chiung Chang , Tsung-Li Lin , Chi-Pin Tsai , Chien-Cheng Lin , Tsung-Hsien Tsai , Heng-Cheng Chu , Ming-Fan Tsai
IPC分类号： H01L23/552 , H01Q1/52 , H01Q9/42 , H01Q1/24 , H01L21/56 , H01L23/31 , H01L23/498 , H01L23/66 , H01Q1/22 , H01Q1/48
摘要： An electronic package structure is provided, including a substrate with an electronic component, an antenna element and a shielding element disposed on the substrate. The shielding element is positioned between the antenna element and the electronic component to prevent electromagnetic interference (EMI) from occurring between the antenna element and the electronic component. A method for fabricating the electronic package structure is also provided.
-
公开(公告)号：US10230152B2
公开(公告)日：2019-03-12
申请号：US14098490
申请日：2013-12-05
IPC分类号： H01Q1/24 , H01Q1/22 , H01Q1/52 , H01L23/552
摘要： An electronic package is provided, which includes: a substrate; at least an electronic element disposed on the substrate; an antenna structure disposed on the substrate; and an encapsulant formed on the substrate for encapsulating the electronic element and the antenna structure. Therein, the antenna structure has an extension portion and a plurality of support portions connected to the extension portion for supporting the extension portion over the substrate so as to save the surface area of the substrate, thereby meeting the miniaturization requirement of the electronic package.
-
公开(公告)号：US09997477B2
公开(公告)日：2018-06-12
申请号：US15094125
申请日：2016-04-08
发明人： Tsung-Hsien Tsai , Heng-Cheng Chu , Chien-Cheng Lin , Chih-Hsien Chiu , Hsin-Lung Chung , Yude Chu
IPC分类号： H01L23/66 , H01L49/02 , H01L23/64 , H01L23/00 , H01L25/16 , H01L25/00 , H01L21/56 , H01L23/31
CPC分类号： H01L23/66 , H01L21/56 , H01L23/3128 , H01L23/3135 , H01L23/64 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/85 , H01L25/16 , H01L25/50 , H01L28/00 , H01L2223/6661 , H01L2224/32225 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48106 , H01L2224/48227 , H01L2224/73265 , H01L2924/00014 , H01L2924/15311 , H01L2924/181 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/19103 , H01L2924/19105 , H01L2924/00 , H01L2924/00012 , H01L2224/45015 , H01L2924/207
摘要： A semiconductor package and a method of manufacturing the same are provided. The semiconductor package includes: a substrate having a plurality of conductive lands and a plurality of bonding pads surrounding the conductive lands formed on a surface thereof; a plurality of passive devices mounted on the conductive lands; an insulation layer formed on the surface and having a portion of the passive devices embedded therein; a semiconductor chip mounted on a top surface of the insulation layer; a plurality of bonding wires electrically connecting the semiconductor chip and the bonding pads; an encapsulant formed on the surface of the substrate to encapsulate the insulation layer, the bonding wires and the semiconductor chip, wherein a region of the semiconductor chip projected onto the substrate covers a portion of an outermost one of the passive devices. Therefore, the mounting density of the passive devices is improved.
-
公开(公告)号：US20200161756A1
公开(公告)日：2020-05-21
申请号：US16750459
申请日：2020-01-23
发明人： Chih-Yuan Shih , Chih-Hsien Chiu , Yueh-Chiung Chang , Tsung-Li Lin , Chi-Pin Tsai , Chien-Cheng Lin , Tsung-Hsien Tsai , Heng-Cheng Chu , Ming-Fan Tsai
IPC分类号： H01Q1/52 , H01Q1/48 , H01Q1/22 , H01L23/66 , H01L23/552 , H01L23/498 , H01L23/31 , H01L21/56 , H01Q1/24 , H01Q9/42
摘要： An electronic package structure is provided, including a substrate with an electronic component, an antenna element and a shielding element disposed on the substrate. The shielding element is positioned between the antenna element and the electronic component to prevent electromagnetic interference (EMI) from occurring between the antenna element and the electronic component. A method for fabricating the electronic package structure is also provided.
-
公开(公告)号：US20190214352A1
公开(公告)日：2019-07-11
申请号：US16028798
申请日：2018-07-06
IPC分类号： H01L23/66 , H01L23/498 , H01L23/31 , H01L23/552 , H01L23/04 , H01Q1/22 , H01Q1/24 , H01Q1/52
摘要： The disclosure provides an electronic package, including a carrier, an electronic component disposed on the carrier, a buffer, and an antenna structure, wherein the antenna structure includes a metal frame disposed on the carrier and a wire disposed on the carrier and electrically connected to the metal frame, and the buffer covers the wire so as to reduce the emission wave speed of the wire and thus the wavelength is shorten, thereby satisfying the length requirement of the antenna within the limited space of the carrier and achieving an operating frequency radiated as required.
-
公开(公告)号：US10062582B2
公开(公告)日：2018-08-28
申请号：US14817624
申请日：2015-08-04
CPC分类号： H01L21/4853 , H01L21/561 , H01L21/563 , H01L21/78 , H01L23/552 , H01L24/19 , H01L24/20 , H01L24/97 , H01L2224/0401 , H01L2224/04105 , H01L2224/16225 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73267 , H01L2224/92244 , H01L2224/97 , H01L2924/01029 , H01L2924/15311 , H01L2924/181 , H01L2924/3025 , H01L2224/85 , H01L2224/81 , H01L2224/19 , H01L2224/82 , H01L2224/83 , H01L2924/00 , H01L2924/00012
摘要： A package having ESD (electrostatic discharge) and EMI (electromagnetic interference) preventing functions includes: a substrate unit having a ground structure and an I/O structure disposed therein; at least a semiconductor component disposed on a surface of the substrate unit and electrically connected to the ground structure and the I/O structure; an encapsulant covering the surface of the substrate unit and the semiconductor component; and a metal layer disposed on exposed surfaces of the encapsulant and side surfaces of the substrate unit and electrically insulated from the ground structure, thereby protecting the semiconductor component against ESD and EMI so as to improve the product yield and reduce the risk of short circuits.
-
公开(公告)号：US20150145747A1
公开(公告)日：2015-05-28
申请号：US14146163
申请日：2014-01-02
发明人： Hsin-Lung Chung , Hao-Ju Fang , Chih-Hsien Chiu , Yude Chu , Tsung-Hsien Tsai
CPC分类号： H01Q1/40 , H01L23/66 , H01L2223/6677 , H01L2224/16227 , H01L2224/48091 , H01L2224/48227 , H01L2924/19105 , H01L2924/19107 , H01Q9/42 , H01Q23/00 , H01L2924/00014
摘要： An electronic package is disclosed, which includes: a substrate; at least an electronic element disposed on the substrate; an encapsulant formed on the substrate and encapsulating the electronic element; and an antenna body embedded in the encapsulant without contacting with the substrate and exposed from a surface of the encapsulant. Since the antenna body is not disposed on the substrate, the surface area of the substrate can be reduced to meet the miniaturization requirement of the electronic package.
摘要翻译： 公开了一种电子封装，其包括：基板; 至少设置在所述基板上的电子元件; 形成在所述基板上并封装所述电子元件的密封剂; 以及嵌入所述密封剂中而不与所述基板接触并从所述密封剂的表面露出的天线体。 由于天线体不设置在基板上，所以可以减小基板的表面积，以满足电子封装的小型化要求。
-
公开(公告)号：US20140353850A1
公开(公告)日：2014-12-04
申请号：US13971189
申请日：2013-08-20
发明人： Chih-Hsien Chiu , Tsung-Hsien Tsai , Chao-Ya Yang , Chia-Yang Chen , Chih-Ming Cheng , Yude Chu
CPC分类号： H01L24/85 , H01L23/3121 , H01L23/4334 , H01L23/552 , H01L23/66 , H01L24/32 , H01L24/48 , H01L24/73 , H01L25/0657 , H01L2224/04042 , H01L2224/2919 , H01L2224/32014 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48145 , H01L2224/48227 , H01L2224/73265 , H01L2224/83191 , H01L2224/8592 , H01L2224/92247 , H01L2225/0651 , H01L2225/06575 , H01L2924/00014 , H01L2924/181 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/19103 , H01L2924/19104 , H01L2924/19105 , H01L2924/00012 , H01L2224/45099 , H01L2924/00 , H01L2224/85399 , H01L2224/05599
摘要： A semiconductor package is disclosed, which includes: a circuit board; a carrier disposed on the circuit board; an RF chip disposed on the carrier; a plurality of high level bonding wires electrically connecting electrode pads of the RF chip and the circuit board; and an encapsulant formed on the circuit board for encapsulating the carrier, the high level bonding wires and the RF chip. The present invention positions the RF chip at a high level so as to facilitate element arrangement and high frequency wiring on the circuit board, thereby achieving a highly integrated wireless SiP (System in Package) module.
摘要翻译： 公开了一种半导体封装，其包括：电路板; 布置在电路板上的载体; 布置在载体上的RF芯片; 电连接RF芯片的电极焊盘和电路板的多个高级焊接线; 以及形成在电路板上用于封装载体，高电平接合线和RF芯片的密封剂。 本发明将RF芯片定位在高水平，以便于电路板上的元件布置和高频布线，从而实现高度集成的无线SiP（系统级封装）模块。
-
公开(公告)号：US20140210672A1
公开(公告)日：2014-07-31
申请号：US14107446
申请日：2013-12-16
发明人： Chih-Hsien Chiu , Heng-Cheng Chu , Chien-Cheng Lin , Tsung-Hsien Tsai , Chao-Ya Yang , Yude Chu
IPC分类号： H01Q1/38
摘要： An electronic package structure is provided, including a substrate, a package encapsulant disposed on the substrate, and an antenna structure corresponding to a disposing area of the package encapsulant and having a first extension layer, a second extension layer disposed on the substrate, and a connection portion disposed between and electrically connected to the first extension layer and the second extension layer. Through the formation of the antenna structure on the disposing area of the package encapsulant, the substrate is not required to be widen, and, as such, the electronic package structure meets the miniaturization requirement.
摘要翻译： 提供一种电子封装结构，包括基板，设置在基板上的封装密封剂，以及对应于封装密封剂的布置区域的天线结构，并具有第一延伸层，设置在基板上的第二延伸层和 连接部分设置在第一延伸层和第二延伸层之间并且电连接到第一延伸层和第二延伸层。 通过在封装密封剂的配置区域上形成天线结构，不需要扩大基板，因此电子封装结构满足小型化要求。
-
公开(公告)号：US11476572B2
公开(公告)日：2022-10-18
申请号：US16750459
申请日：2020-01-23
发明人： Chih-Yuan Shih , Chih-Hsien Chiu , Yueh-Chiung Chang , Tsung-Li Lin , Chi-Pin Tsai , Chien-Cheng Lin , Tsung-Hsien Tsai , Heng-Cheng Chu , Ming-Fan Tsai
IPC分类号： H01Q1/52 , H01Q9/42 , H01Q1/24 , H01L21/56 , H01L23/31 , H01L23/498 , H01L23/552 , H01L23/66 , H01Q1/22 , H01Q1/48
摘要： An electronic package structure is provided, including a substrate with an electronic component, an antenna element and a shielding element disposed on the substrate. The shielding element is positioned between the antenna element and the electronic component to prevent electromagnetic interference (EMI) from occurring between the antenna element and the electronic component. A method for fabricating the electronic package structure is also provided.
-
-
-
-
-
-
-
-
-
搜索结果
31 条记录 (耗时 0.02 秒)
