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公开(公告)号：US20180061747A1
公开(公告)日：2018-03-01
申请号：US15397927
申请日：2017-01-04
发明人： Shao-Tzu Tang , Jia-Fong Yeh , Chien-Hui Wang , Chung-Yan Huang , Ying-Chou Tsai
IPC分类号： H01L23/498 , H01L21/56 , H01L21/48 , H01L23/60 , H01L23/00
CPC分类号： H01L23/49811 , G06K9/0002 , G06K9/00053 , H01L21/4853 , H01L21/56 , H01L23/49805 , H01L23/562 , H01L23/60 , H01L2224/48091 , H01L2224/73265 , H01L2924/1815 , H01L2924/19107 , H01L2924/00014
摘要： A package structure is provided, including a carrier, an electronic component disposed on the carrier and having a sensing area, an encapsulant formed on the carrier and encapsulating the electronic component and the sensing area, and a conductive layer formed on the encapsulant with the sensing area of the electronic component free from being covered by the conductive layer. The encapsulant prevents a user's finger from being in direct contact with the sensing area so as to protect the sensing area from being damaged and hence ensure normal operation of the electronic component.
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公开(公告)号：US20170294372A1
公开(公告)日：2017-10-12
申请号：US15632669
申请日：2017-06-26
发明人： Chia-Cheng Chen , Chi-Ching Ho , Shao-Tzu Tang , Yu-Che Liu , Ying-Chou Tsai
IPC分类号： H01L23/498 , H01L23/00 , H01L23/31 , H01L21/48 , H01L21/56
CPC分类号： H01L23/49838 , H01L21/4853 , H01L21/56 , H01L21/565 , H01L21/568 , H01L21/6835 , H01L23/3114 , H01L23/3128 , H01L23/49816 , H01L23/49894 , H01L24/16 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/81 , H01L24/83 , H01L24/85 , H01L2221/68345 , H01L2224/05554 , H01L2224/16227 , H01L2224/16238 , H01L2224/2929 , H01L2224/29339 , H01L2224/32225 , H01L2224/45144 , H01L2224/48159 , H01L2224/48227 , H01L2224/48247 , H01L2224/49173 , H01L2224/73204 , H01L2224/73265 , H01L2224/81005 , H01L2224/81193 , H01L2224/81424 , H01L2224/81447 , H01L2224/83005 , H01L2224/85005 , H01L2924/00014 , H01L2924/10162 , H01L2924/181 , H01L2924/35121 , H01L2224/13099 , H01L2924/00015 , H01L2224/05599 , H01L2924/00012 , H01L2924/00
摘要： A semiconductor package is provided, which includes: a dielectric layer made of a material used for fabricating built-up layer structures; a conductive trace layer formed on the dielectric layer; a semiconductor chip is mounted on and electrically connected to the conductive trace layer; and an encapsulant formed over the dielectric layer to encapsulate the semiconductor chip and the conductive trace layer. Since a strong bonding is formed between the dielectric layer and the conductive trace layer, the present invention can prevent delamination between the dielectric layer and the conductive trace layer from occurrence, thereby improving reliability and facilitating the package miniaturization by current fabrication methods.
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公开(公告)号：US20230027120A1
公开(公告)日：2023-01-26
申请号：US17411322
申请日：2021-08-25
发明人： Shao-Tzu Tang , Wen-Jung Tsai , Chih-Hsien Chiu , Ko-Wei Chang , Yu-Wei Yeh , Yu-Cheng Pai , Chuan-Yi Pan , Chi-Rui Wu
IPC分类号： H01Q1/22 , H01L23/552
摘要： An electronic package is provided, in which a carrier structure provided with electronic components is disposed onto an antenna structure, where a stepped portion is formed at an edge of the antenna structure, so that a shielding body is arranged along a surface of the stepped portion. Therefore, the shielding body only covers a part of the surface of the antenna structure to prevent the shielding body from interfering with operation of the antenna structure.
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公开(公告)号：US20210066173A1
公开(公告)日：2021-03-04
申请号：US17096359
申请日：2020-11-12
发明人： Shao-Tzu Tang , Jia-Fong Yeh , Yi-Hsuan Liu , Mei-Chi Chen , Ying-Chou Tsai
IPC分类号： H01L23/495 , H01L23/498 , H01L21/56 , H01L23/00 , H01L23/31
摘要： A package structure and a method for fabricating the same are provided. An electronic component such as a sensing chip and a conductive element such as a bonding wire are mounted to a carrier, encapsulated by an encapsulant, and electrically connected through a conductive layer. As such, the electronic component can further be electrically connected to the carrier through the conductive layer and the conductive element. Therefore, the sensing chip can be packaged through current packaging processes, thereby reducing the fabrication cost, shortening the fabrication time and improving the product yield.
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公开(公告)号：US10224243B2
公开(公告)日：2019-03-05
申请号：US15704388
申请日：2017-09-14
发明人： Shao-Tzu Tang , Chang-Yi Lan , Ying-Chou Tsai
摘要： An electronic package is provided, which includes: an electronic element having an active surface with a plurality of electrode pads, an inactive surface opposite to the active surface, and a side surface adjacent to and connecting the active and inactive surfaces; a plurality of conductive elements formed on the electrode pads of the electronic element; and an encapsulant covering the active and side surfaces of the electronic element and portions of side surfaces of the conductive elements and exposing the inactive surface of the electronic element. Therefore, the invention enhances the structural strength of the active surface of the electronic element so as to prevent cracking of the electronic element and hence avoid delamination of the conductive elements from the electronic element.
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6.发明公开公开(公告)号：US20230282972A1
公开(公告)日：2023-09-07
申请号：US17748957
申请日：2022-05-19
发明人： Shao-Tzu Tang , Chih-Hsien Chiu , Wen-Jung Tsai , Ko-Wei Chang , Chia-Chu LAI
摘要： An antenna module is provided with a plurality of antenna structures and a shielding structure arranged on a plate body, and the shielding structure is located between two adjacent antenna structures, where the shielding structure includes a concave portion formed on the plate body and a dielectric material formed between the concave portion and the antenna structure to generate different impedance characteristics, thereby improving the antenna isolation.
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公开(公告)号：US10201090B2
公开(公告)日：2019-02-05
申请号：US15615158
申请日：2017-06-06
发明人： Shao-Tzu Tang , Ying-Chou Tsai
摘要： A circuit structure is provided, which includes a plurality of conductive posts, and a plurality of first and second conductive pads formed on two opposite end surfaces of the conductive posts, respectively. A length of each of the first conductive pads is greater than a width of the first conductive pad so as to reduce an occupation area of the first conductive pad along the width and increase a distance between adjacent first conductive pads, thereby increasing the wiring density and meeting the wiring demand.
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公开(公告)号：US20180342446A1
公开(公告)日：2018-11-29
申请号：US15720552
申请日：2017-09-29
发明人： Shao-Tzu Tang , Jia-Fong Yeh , Yi-Hsuan Liu , Mei-Chi Chen , Ying-Chou Tsai
IPC分类号： H01L23/495 , H01L23/498 , H01L21/56 , H01L23/00
摘要： A package structure and a method for fabricating the same are provided. An electronic component such as a sensing chip and a conductive element such as a bonding wire are mounted to a carrier, encapsulated by an encapsulant, and electrically connected through a conductive layer. As such, the electronic component can further be electrically connected to the carrier through the conductive layer and the conductive element. Therefore, the sensing chip can be packaged through current packaging processes, thereby reducing the fabrication cost, shortening the fabrication time and improving the product yield.
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公开(公告)号：US09978673B2
公开(公告)日：2018-05-22
申请号：US15397927
申请日：2017-01-04
发明人： Shao-Tzu Tang , Jia-Fong Yeh , Chien-Hui Wang , Chung-Yan Huang , Ying-Chou Tsai
CPC分类号： H01L23/49811 , G06K9/0002 , G06K9/00053 , H01L21/4853 , H01L21/56 , H01L23/49805 , H01L23/562 , H01L23/60 , H01L2224/48091 , H01L2224/73265 , H01L2924/1815 , H01L2924/19107 , H01L2924/00014
摘要： A package structure is provided, including a carrier, an electronic component disposed on the carrier and having a sensing area, an encapsulant formed on the carrier and encapsulating the electronic component and the sensing area, and a conductive layer formed on the encapsulant with the sensing area of the electronic component free from being covered by the conductive layer. The encapsulant prevents a user's finger from being in direct contact with the sensing area so as to protect the sensing area from being damaged and hence ensure normal operation of the electronic component.
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公开(公告)号：US20160133593A1
公开(公告)日：2016-05-12
申请号：US14624642
申请日：2015-02-18
发明人： Shao-Tzu Tang , Chang-Yi Lan , Ying-Chou Tsai
CPC分类号： H01L21/78 , H01L21/561 , H01L21/568 , H01L22/12 , H01L23/3114 , H01L23/3157 , H01L24/11 , H01L24/13 , H01L24/16 , H01L24/81 , H01L24/92 , H01L24/94 , H01L24/96 , H01L2221/68381 , H01L2224/04105 , H01L2224/1148 , H01L2224/1191 , H01L2224/12105 , H01L2224/13022 , H01L2224/13024 , H01L2224/131 , H01L2224/16227 , H01L2224/92 , H01L2224/94 , H01L2224/96 , H01L2924/00015 , H01L2924/1816 , H01L2924/3512 , H01L2924/35121 , H01L2924/37001 , H01L2224/03 , H01L2224/11 , H01L2924/014 , H01L2224/20 , H01L21/56 , H01L21/304 , H01L2224/81
摘要： An electronic package is provided, which includes: an electronic element having an active surface with a plurality of electrode pads, an inactive surface opposite to the active surface, and a side surface adjacent to and connecting the active and inactive surfaces; a plurality of conductive elements formed on the electrode pads of the electronic element;and an encapsulant covering the active and side surfaces of the electronic element and portions of side surfaces of the conductive elements and exposing the inactive surface of the electronic element. Therefore, the invention enhances the structural strength of the active surface of the electronic element so as to prevent cracking of the electronic element and hence avoid delamination of the conductive elements from the electronic element.
摘要翻译： 提供一种电子封装，其包括：具有多个电极焊盘的活性表面的电子元件，与该有源表面相对的非活性表面以及与该活性表面和非活性表面相邻并连接的侧表面; 形成在电子元件的电极焊盘上的多个导电元件; 以及覆盖电子元件的有源和侧表面以及导电元件的侧表面的部分并且暴露电子元件的非活性表面的密封剂。 因此，本发明提高了电子元件的有效表面的结构强度，以防止电子元件的破裂，从而避免导电元件与电子元件分层。
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