公开(公告)号：US20140225241A1

公开(公告)日：2014-08-14

申请号：US13922904

申请日：2013-06-20

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Cheng-Yu Chiang ,  Wen-Jung Chiang ,  Hsing-Hung Lee

IPC: H01L23/495

CPC classification number: H01L23/495 ,  H01L23/49548 ,  H01L23/49589 ,  H01L23/49827 ,  H01L23/50 ,  H01L2224/32245 ,  H01L2224/48247 ,  H01L2224/49109 ,  H01L2224/73265 ,  H01L2924/00

Abstract: A package structure is disclosed, which includes: a carrier having a recessed portion formed on a lower side thereof and filled with a dielectric material; a semiconductor element disposed on an upper side of the carrier and electrically connected to the carrier; and an encapsulant formed on the upper side of the carrier for encapsulating the semiconductor element. Therein, the dielectric material is exposed from the encapsulant. As such, when the carrier is disposed on a circuit board, the dielectric material is sandwiched between the lower side of the carrier and the circuit board to form a decoupling capacitor, thereby improving the power integrity.

Abstract translation: 公开了一种封装结构，其包括：具有形成在其下侧并填充有电介质材料的凹部的载体; 半导体元件，其设置在所述载体的上侧并电连接到所述载体; 以及密封剂，其形成在用于封装半导体元件的载体的上侧。 其中，电介质材料从密封剂暴露出来。 因此，当载体设置在电路板上时，电介质材料夹在载体的下侧和电路板之间以形成去耦电容器，从而提高电力完整性。

公开(公告)号：US08981540B2

公开(公告)日：2015-03-17

申请号：US13922904

申请日：2013-06-20

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Cheng-Yu Chiang ,  Wen-Jung Chiang ,  Hsing-Hung Lee

IPC: H01L23/495

CPC classification number: H01L23/495 ,  H01L23/49548 ,  H01L23/49589 ,  H01L23/49827 ,  H01L23/50 ,  H01L2224/32245 ,  H01L2224/48247 ,  H01L2224/49109 ,  H01L2224/73265 ,  H01L2924/00

Abstract: A package structure is disclosed, which includes: a carrier having a recessed portion formed on a lower side thereof and filled with a dielectric material; a semiconductor element disposed on an upper side of the carrier and electrically connected to the carrier; and an encapsulant formed on the upper side of the carrier for encapsulating the semiconductor element. Therein, the dielectric material is exposed from the encapsulant. As such, when the carrier is disposed on a circuit board, the dielectric material is sandwiched between the lower side of the carrier and the circuit board to form a decoupling capacitor, thereby improving the power integrity.

Abstract translation: 公开了一种封装结构，其包括：具有形成在其下侧并填充有电介质材料的凹部的载体; 半导体元件，其设置在所述载体的上侧并电连接到所述载体; 以及密封剂，其形成在用于封装半导体元件的载体的上侧。 其中，电介质材料从密封剂暴露出来。 因此，当载体设置在电路板上时，电介质材料夹在载体的下侧和电路板之间以形成去耦电容器，从而提高电力完整性。