公开(公告)号：US10903167B2

公开(公告)日：2021-01-26

申请号：US16285813

申请日：2019-02-26

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Jun-Chang Ding ,  Hong-Da Chang ,  Hsi-Chang Hsu

IPC: H01L21/56 ,  H01L23/538 ,  H01L23/498 ,  H01L23/532 ,  H01L23/00 ,  H01L23/31

Abstract: An electronic package, a packaging substrate, and methods for fabricating the same are disposed. The electronic package includes a circuit structure having a first side and a second side opposing the first side, an electronic component disposed on the first side of the circuit structure, an encapsulation layer formed on the first side of the circuit structure and encapsulating the electronic component, a metal structure disposed on the second side of the circuit structure, and a plurality of conductive elements disposed on the metal structure. The plurality of conductive elements are disposed on the metal structure, rather than disposed on the circuit structure directly. Therefore, the bonding between the conductive elements and the circuit structure is improved, to avoid the plurality of conductive elements from being peeled.

公开(公告)号：US11600571B2

公开(公告)日：2023-03-07

申请号：US17125195

申请日：2020-12-17

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Jun-Chang Ding ,  Hong-Da Chang ,  Hsi-Chang Hsu

IPC: H01L23/538 ,  H01L23/498 ,  H01L23/532 ,  H01L21/56 ,  H01L23/00 ,  H01L23/31

Abstract: An electronic package, a packaging substrate, and methods for fabricating the same are disposed. The electronic package includes a circuit structure having a first side and a second side opposing the first side, an electronic component disposed on the first side of the circuit structure, an encapsulation layer formed on the first side of the circuit structure and encapsulating the electronic component, a metal structure disposed on the second side of the circuit structure, and a plurality of conductive elements disposed on the metal structure. The plurality of conductive elements are disposed on the metal structure, rather than disposed on the circuit structure directly. Therefore, the bonding between the conductive elements and the circuit structure is improved, to avoid the plurality of conductive elements from being peeled.

公开(公告)号：US20210104465A1

公开(公告)日：2021-04-08

申请号：US17125195

申请日：2020-12-17

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Jun-Chang Ding ,  Hong-Da Chang ,  Hsi-Chang Hsu

IPC: H01L23/538 ,  H01L23/498 ,  H01L23/532 ,  H01L21/56 ,  H01L23/00 ,  H01L23/31

Abstract: An electronic package, a packaging substrate, and methods for fabricating the same are disposed. The electronic package includes a circuit structure having a first side and a second side opposing the first side, an electronic component disposed on the first side of the circuit structure, an encapsulation layer formed on the first side of the circuit structure and encapsulating the electronic component, a metal structure disposed on the second side of the circuit structure, and a plurality of conductive elements disposed on the metal structure. The plurality of conductive elements are disposed on the metal structure, rather than disposed on the circuit structure directly. Therefore, the bonding between the conductive elements and the circuit structure is improved, to avoid the plurality of conductive elements from being peeled.