公开(公告)号：US12002737B2

公开(公告)日：2024-06-04

申请号：US16568990

申请日：2019-09-12

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Pin-Jing Su ,  Cheng-Kai Chang

IPC: H01L23/48 ,  H01L21/56 ,  H01L23/00 ,  H01L23/31 ,  H01L23/498

CPC classification number: H01L23/481 ,  H01L21/566 ,  H01L23/3157 ,  H01L23/49811 ,  H01L23/49827 ,  H01L24/33 ,  H01L24/83

Abstract: An electronic package is provided. The electronic package includes an encapsulating layer encapsulating a plurality of conductive pillars and an interposer board that has through-silicon vias. An electronic component is disposed on the encapsulating layer and electrically connected to the conductive pillars and the through-silicon vias. The conductive pillars act as an electric transmission path of a portion of electric functions of the electronic component. Therefore, the number of the through-silicon vias is reduced, and the fabrication time and chemical agent cost are reduced. Also, the through silicon interposer of a large area can be replaced by a smaller one, and the yield is increased. Further, a method of fabricating an electronic package is provided.