公开(公告)号：US20210175196A1

公开(公告)日：2021-06-10

申请号：US16821095

申请日：2020-03-17

Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.

Inventor： Hsin-Yi Liao ,  Cheng-Kai Chang ,  Bo-Hao Ma ,  Chun-Chi Ke

IPC: H01L23/00

Abstract: A method for fabricating an electronic package is provided. A plurality of packaging structures are provided, each of which having a carrier and at least one electronic component disposed on the carrier. The plurality of packaging structures are disposed on a supporting plate. An encapsulation layer is formed on the supporting plate and encapsulates the plurality of packaging structures. Even if there are various types of electronic packages of different specifications in the market, the molds that the encapsulation layer uses can still be developed for a supporting plate of a certain specification. Therefore, the fabrication cost of the electronic package is reduced.

公开(公告)号：US12002737B2

公开(公告)日：2024-06-04

申请号：US16568990

申请日：2019-09-12

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Pin-Jing Su ,  Cheng-Kai Chang

IPC: H01L23/48 ,  H01L21/56 ,  H01L23/00 ,  H01L23/31 ,  H01L23/498

CPC classification number: H01L23/481 ,  H01L21/566 ,  H01L23/3157 ,  H01L23/49811 ,  H01L23/49827 ,  H01L24/33 ,  H01L24/83

Abstract: An electronic package is provided. The electronic package includes an encapsulating layer encapsulating a plurality of conductive pillars and an interposer board that has through-silicon vias. An electronic component is disposed on the encapsulating layer and electrically connected to the conductive pillars and the through-silicon vias. The conductive pillars act as an electric transmission path of a portion of electric functions of the electronic component. Therefore, the number of the through-silicon vias is reduced, and the fabrication time and chemical agent cost are reduced. Also, the through silicon interposer of a large area can be replaced by a smaller one, and the yield is increased. Further, a method of fabricating an electronic package is provided.

公开(公告)号：US11195812B2

公开(公告)日：2021-12-07

申请号：US16821095

申请日：2020-03-17

Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.

Inventor： Hsin-Yi Liao ,  Cheng-Kai Chang ,  Bo-Hao Ma ,  Chun-Chi Ke

IPC: H01L23/00

Abstract: A method for fabricating an electronic package is provided. A plurality of packaging structures are provided, each of which having a carrier and at least one electronic component disposed on the carrier. The plurality of packaging structures are disposed on a supporting plate. An encapsulation layer is formed on the supporting plate and encapsulates the plurality of packaging structures. Even if there are various types of electronic packages of different specifications in the market, the molds that the encapsulation layer uses can still be developed for a supporting plate of a certain specification. Therefore, the fabrication cost of the electronic package is reduced.

公开(公告)号：US11143549B2

公开(公告)日：2021-10-12

申请号：US16585409

申请日：2019-09-27

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Jin-Wei You ,  Cheng-Kai Chang

IPC: H01L25/16 ,  G01J1/02 ,  H04B3/32

Abstract: The present disclosure provides an electronic packaging structure. A photonic die is disposed on an electronic package, and an optical guide die is not disposed on the electronic package. As the optical guide die malfunctions, only the optical guide die, rather than the whole electronic package and the photonic die, which may still function well, needs to be replaced. Therefore, the replacement cost is reduced, and the lifespan of the electronic packaging structure is increased. The present disclosure also provides a method for manufacturing the electronic packaging structure.

公开(公告)号：US20180096967A1

公开(公告)日：2018-04-05

申请号：US15435437

申请日：2017-02-17

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Wen-Jung Tsai ,  Cheng-Kai Chang ,  Yen-Hung Lin ,  Hsin-Lung Chung

IPC: H01L25/065 ,  H01L23/31 ,  H01L23/58 ,  H01L25/00

CPC classification number: H01L25/0652 ,  H01L23/13 ,  H01L23/16 ,  H01L23/3121 ,  H01L23/3128 ,  H01L23/3135 ,  H01L23/49805 ,  H01L23/538 ,  H01L23/552 ,  H01L23/585 ,  H01L25/16 ,  H01L25/50 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/48225 ,  H01L2924/15151 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00014

Abstract: An electronic package structure is provided, which includes: a plurality of first and second electronic components disposed on opposite sides of a carrier; a blocking member formed between adjacent two of the first electronic components; an encapsulant encapsulating the first and second electronic components and the blocking member; and a shielding element formed on the encapsulant to improve the electromagnetic shielding effect. The present disclosure further provides a method for fabricating the electronic package structure.

公开(公告)号：US11114412B2

公开(公告)日：2021-09-07

申请号：US16686995

申请日：2019-11-18

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Hsin-Yi Liao ,  Cheng-Kai Chang

IPC: H01L25/065 ,  H01L23/31 ,  H01L23/538 ,  H01L23/00 ,  H01L21/48 ,  H01L25/00 ,  H01L21/56 ,  H01L25/16 ,  H01L23/498

Abstract: An electronic package is provided, including: a first carrying structure having a first circuit layer; a package module disposed on the first carrying structure and electrically connected to the first circuit layer; a first electronic component disposed on the first carrying structure and electrically connected to the first circuit layer; and a second electronic component stacked on and electrically connected to the first electronic component. As the second electronic component is stacked with the first electronic component, a surface area of the first carrying structure that the first and second electronic components occupy is reduced, and the electronic package can have sufficient space to accommodate the package modules. A method for fabricating an electronic package is also provided.

公开(公告)号：US20210104491A1

公开(公告)日：2021-04-08

申请号：US16686995

申请日：2019-11-18

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Hsin-Yi Liao ,  Cheng-Kai Chang

IPC: H01L25/065 ,  H01L23/538 ,  H01L23/31 ,  H01L23/00 ,  H01L21/48 ,  H01L25/00 ,  H01L21/56 ,  H01L25/16

Abstract: An electronic package is provided, including: a first carrying structure having a first circuit layer; a package module disposed on the first carrying structure and electrically connected to the first circuit layer; a first electronic component disposed on the first carrying structure and electrically connected to the first circuit layer; and a second electronic component stacked on and electrically connected to the first electronic component. As the second electronic component is stacked with the first electronic component, a surface area of the first carrying structure that the first and second electronic components occupy is reduced, and the electronic package can have sufficient space to accommodate the package modules. A method for fabricating an electronic package is also provided.

公开(公告)号：US20210018360A1

公开(公告)日：2021-01-21

申请号：US16585409

申请日：2019-09-27

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Jin-Wei You ,  Cheng-Kai Chang

IPC: G01J1/02 ,  H04B3/32

Abstract: The present disclosure provides an electronic packaging structure. A photonic die is disposed on an electronic package, and an optical guide die is not disposed on the electronic package. As the optical guide die malfunctions, only the optical guide die, rather than the whole electronic package and the photonic die, which may still function well, needs to be replaced. Therefore, the replacement cost is reduced, and the lifespan of the electronic packaging structure is increased. The present disclosure also provides a method for manufacturing the electronic packaging structure.