公开(公告)号：US11380978B2

公开(公告)日：2022-07-05

申请号：US15961103

申请日：2018-04-24

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Shi-Min Zhou ,  Han-Hung Chen ,  Rung-Jeng Lin ,  Kuo-Hua Yu ,  Chang-Fu Lin

IPC: H01L23/28 ,  H01Q1/22 ,  H05K1/18 ,  H05K3/36 ,  H05K3/34 ,  H05K3/28 ,  H05K1/14 ,  H05K1/02 ,  H01L23/00

Abstract: An electronic package and a method for fabricating the same are provided. The method includes stacking an antenna board on a circuit board, and disposing between the antenna board and the circuit board a supporting body securing the antenna board and the circuit board. As such, during a packaging process, the distance between the antenna board and the circuit board is kept unchanged due to the supporting body, thus ensuring that the antenna board operates properly and improving the product yield.

公开(公告)号：US11289794B2

公开(公告)日：2022-03-29

申请号：US16859009

申请日：2020-04-27

Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.

Inventor： Rung-Jeng Lin ,  Han-Hung Chen ,  Shi-Min Zhou ,  Kuo-Hua Yu ,  Chang-Fu Lin

IPC: H05K7/00 ,  H01Q1/22 ,  H01L23/498 ,  H01L23/00 ,  H01L23/66

Abstract: An electronic package is disclosed. An antenna board is stacked on a circuit board. A frame is formed on the circuit board. A supporter disposed between the antenna board and the circuit board is secured in the frame. In a packaging process, the frame ensures that the antenna board and the circuit board are separated at a distance that complies with a requirement, and that the antenna function of the antenna board can function normally.

公开(公告)号：US20210203057A1

公开(公告)日：2021-07-01

申请号：US16859009

申请日：2020-04-27

Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.

Inventor： Rung-Jeng Lin ,  Han-Hung Chen ,  Shi-Min Zhou ,  Kuo-Hua Yu ,  Chang-Fu Lin

IPC: H01Q1/22 ,  H01L23/498 ,  H01L23/66 ,  H01L23/00

Abstract: An electronic package is disclosed. An antenna board is stacked on a circuit board. A frame is formed on the circuit board. A supporter disposed between the antenna board and the circuit board is secured in the frame. In a packaging process, the frame ensures that the antenna board and the circuit board are separated at a distance that complies with a requirement, and that the antenna function of the antenna board can function normally.

公开(公告)号：US20190123424A1

公开(公告)日：2019-04-25

申请号：US15961103

申请日：2018-04-24

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Shi-Min Zhou ,  Han-Hung Chen ,  Rung-Jeng Lin ,  Kuo-Hua Yu ,  Chang-Fu Lin

IPC: H01Q1/22 ,  H05K1/14 ,  H05K1/18 ,  H05K3/36 ,  H05K3/34 ,  H05K3/28

Abstract: An electronic package and a method for fabricating the same are provided. The method includes stacking an antenna board on a circuit board, and disposing between the antenna board and the circuit board a supporting body securing the antenna board and the circuit board. As such, during a packaging process, the distance between the antenna board and the circuit board is kept unchanged due to the supporting body, thus ensuring that the antenna board operates properly and improving the product yield.