公开(公告)号：US08828796B1

公开(公告)日：2014-09-09

申请号：US14085168

申请日：2013-11-20

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Chieh-Yuan Chi ,  Wei-Yu Chen ,  Hung-Wen Liu ,  Yan-Heng Chen ,  Hsi-Chang Hsu

IPC: H01L21/44 ,  H01L23/02 ,  H01L23/498

CPC classification number: H01L23/5383 ,  H01L21/561 ,  H01L21/568 ,  H01L23/49816 ,  H01L23/5384 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/96 ,  H01L24/97 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2924/3511 ,  H01L2924/00

Abstract: A semiconductor package and a method of manufacturing the same are provided, the semiconductor package including a first package unit having a first encapsulant and a first semiconductor element, a second package unit having a second encapsulant and a second semiconductor element, a supporting member interposed between the first and second encapsulant, a plurality of conductors penetrating the first encapsulant, the supporting member and the second encapsulant, and redistribution structures disposed on the first and second encapsulants, wherein the first and second encapsulants are coupled with each other by the supporting member to provide sufficient support and protection to enhance the structure strength of the first and second package units.

Abstract translation: 提供一种半导体封装及其制造方法，所述半导体封装包括具有第一密封剂和第一半导体元件的第一封装单元，具有第二密封剂的第二封装单元和第二半导体元件， 所述第一和第二密封剂，穿过所述第一密封剂，所述支撑构件和所述第二密封剂的多个导体以及设置在所述第一和第二密封剂上的再分配结构，其中所述第一和第二密封剂通过所述支撑构件彼此联接， 提供足够的支撑和保护以增强第一和第二包装单元的结构强度。