公开(公告)号：US08829687B2

公开(公告)日：2014-09-09

申请号：US13722138

申请日：2012-12-20

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Mu-Hsuan Chan ,  Wan-Ting Chen ,  Yi-Chian Liao ,  Chun-Tang Lin ,  Yi-Chi Lai

IPC: H01L23/48 ,  H01L21/00 ,  H01L21/78 ,  H01L23/00 ,  H01L23/498

CPC classification number: H01L23/49811 ,  H01L21/486 ,  H01L21/78 ,  H01L23/147 ,  H01L23/49827 ,  H01L24/19 ,  H01L24/96 ,  H01L2224/04105 ,  H01L2924/351 ,  H01L2924/3511 ,  H01L2924/00

Abstract: A semiconductor package is provided, which includes: a semiconductor substrate having opposite first and second surfaces; an adhesive layer formed on the first surface of the semiconductor substrate; at least a semiconductor chip disposed on the adhesive layer; an encapsulant formed on the adhesive layer for encapsulating the semiconductor chip; and a plurality of conductive posts penetrating the first and second surfaces of the semiconductor substrate and the adhesive layer and electrically connected to the semiconductor chip, thereby effectively reducing the fabrication cost, shortening the fabrication time and improving the product reliability.

Abstract translation: 提供一种半导体封装，其包括：具有相反的第一和第二表面的半导体衬底; 形成在所述半导体衬底的第一表面上的粘合剂层; 至少设置在所述粘合剂层上的半导体芯片; 形成在用于封装半导体芯片的粘合剂层上的密封剂; 以及贯穿半导体衬底的第一和第二表面和粘合剂层并且电连接到半导体芯片的多个导电柱，从而有效地降低了制造成本，缩短了制造时间并提高了产品的可靠性。

公开(公告)号：US20140084455A1

公开(公告)日：2014-03-27

申请号：US13722138

申请日：2012-12-20

Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.

Inventor： Mu-Hsuan Chan ,  Wan-Ting Chen ,  Yi-Chian Liao ,  Chun-Tang Lin ,  Yi-Chi Lai

IPC: H01L23/498 ,  H01L21/78

CPC classification number: H01L23/49811 ,  H01L21/486 ,  H01L21/78 ,  H01L23/147 ,  H01L23/49827 ,  H01L24/19 ,  H01L24/96 ,  H01L2224/04105 ,  H01L2924/351 ,  H01L2924/3511 ,  H01L2924/00

Abstract: A semiconductor package is provided, which includes: a semiconductor substrate having opposite first and second surfaces; an adhesive layer formed on the first surface of the semiconductor substrate; at least a semiconductor chip disposed on the adhesive layer; an encapsulant formed on the adhesive layer for encapsulating the semiconductor chip; and a plurality of conductive posts penetrating the first and second surfaces of the semiconductor substrate and the adhesive layer and electrically connected to the semiconductor chip, thereby effectively reducing the fabrication cost, shortening the fabrication time and improving the product reliability.

Abstract translation: 提供一种半导体封装，其包括：具有相反的第一和第二表面的半导体衬底; 形成在所述半导体衬底的第一表面上的粘合剂层; 至少设置在所述粘合剂层上的半导体芯片; 形成在用于封装半导体芯片的粘合剂层上的密封剂; 以及贯穿半导体衬底的第一和第二表面和粘合剂层并且电连接到半导体芯片的多个导电柱，从而有效地降低了制造成本，缩短了制造时间并提高了产品的可靠性。