公开(公告)号：US20230278118A1

公开(公告)日：2023-09-07

申请号：US18008986

申请日：2021-05-27

申请人： Siltronic AG

发明人： Axel Beyer ,  Patrick Berger ,  Wolfgang Dietz ,  Carl Frintert ,  Matthias Guenther

IPC分类号： B23D57/00 ,  B23D59/04 ,  B23D59/00

CPC分类号： B23D57/0023 ,  B23D59/04 ,  B23D59/002 ,  B28D5/0064

摘要： Slices are cut from workpieces during a sequence of cut-off operations by a wire saw, having a wire array. The wire array is tensioned in a plane between two wire guide rollers supported between fixed and floating bearings. During each cut-off operation, a workpiece is fed through the wire array perpendicular to a workpiece axis and the wire array plane. The workpiece is fed with simultaneous axial movement of the floating bearings by adjusting a temperature of the fixed bearings in correlation with a first correction profile, which specifies a travel of the floating bearings in dependence on the depth of cut. In dependence on the depth of cut, operating parameters are set, such as the feed rate, an amount of working fluid fed to the wire array per unit time, a temperature of the working fluid, a wire speed, a wire consumption per cut-off operation, or a wire tension.