公开(公告)号：US20100108366A1

公开(公告)日：2010-05-06

申请号：US12613360

申请日：2009-11-05

申请人： So-Won KIM ,  Woo-Ram LEE ,  Sang-Ho KIM

发明人： So-Won KIM ,  Woo-Ram LEE ,  Sang-Ho KIM

IPC分类号： H05K3/00 ,  B32B15/02 ,  B32B15/04 ,  H05K1/09

CPC分类号： H05K1/092 ,  B05D5/12 ,  C08K3/22 ,  C08K9/04 ,  C09D5/24 ,  C09D7/62 ,  C09D7/68 ,  C09D7/69 ,  C09D11/52 ,  C23C18/1262 ,  C23C18/127 ,  C23C18/1295 ,  C23C18/40 ,  H05K1/097 ,  H05K3/1291 ,  H05K2203/1126 ,  H05K2203/1157

摘要： A method for preparing an electroconductive patterned copper layer, comprising mixing copper-based particles with a reducing agent, and then adding a solvent thereto to prepare a reducing agent-containing copper-based particle dispersion solution; printing on or filling in the reducing agent-containing copper-based particle dispersion solution a substrate in a predetermined shape to form a reducing agent-containing copper-based particle patterned layer; and firing the reducing agent-containing copper-based particle patterned layer in the air, which allows forming a patterned copper layer with excellent electric conductivity even in the air, thereby being industrially very useful.

摘要翻译： 一种制备导电图案化铜层的方法，包括将铜基颗粒与还原剂混合，然后向其中加入溶剂以制备含还原剂的铜基颗粒分散溶液; 在含有还原剂的铜基颗粒分散液中印刷或填充预定形状的基材以形成含还原剂的铜基颗粒图案层; 并且在空气中焙烧含还原剂的铜基颗粒图案层，这允许即使在空气中也形成具有优异导电性的图案化铜层，从而在工业上非常有用。