公开(公告)号：US20180151766A1

公开(公告)日：2018-05-31

申请号：US15363901

申请日：2016-11-29

Applicant: SolarCity Corporation

Inventor： Christoph G. Erben ,  Milan Padilla ,  Zhi-Wen Sun

IPC: H01L31/048 ,  H01L31/02 ,  H01L31/0747 ,  H01L31/0224 ,  H01L31/18

Abstract: A system for fabricating a photovoltaic module is provided. During operation, the system can obtain a plurality of photovoltaic structures. A respective photovoltaic structure can include first and second metallic grids on first and second surfaces, respectively. The system can then encapsulates the photovoltaic structures between a first cover and a second cover using an encapsulant having a moisture vapor transmission rate (MVTR) less than a predetermined value, thereby preventing oxidation and corrosion of the metallic grids during the service life of the photovoltaic module.

公开(公告)号：US20180198008A1

公开(公告)日：2018-07-12

申请号：US15400874

申请日：2017-01-06

Applicant: SolarCity Corporation

Inventor： Scott Tripp ,  Milan Padilla

IPC: H01L31/0224 ,  H01L31/02 ,  H01L31/0352 ,  H01L31/05

CPC classification number: H01L31/0512 ,  H01L31/0201 ,  H01L31/0508 ,  Y02E10/50

Abstract: One embodiment can provide an electrode grid of a photovoltaic structure. The electrode grid can include a plurality of finger lines and a busbar coupled to the finger lines. The busbar can include one or more stress-release structures, thereby reducing stress caused by thermal expansion mismatch between the busbar and underlying layers of the photovoltaic structure.