公开(公告)号：US20220351876A1

公开(公告)日：2022-11-03

申请号：US17413563

申请日：2020-01-17

Applicant: Soltrium Advanced Materials Technology, Ltd.

Inventor： Weiteng Feng ,  Fengzhen Sun ,  Delin LI

IPC: H01B1/22 ,  C08K3/08 ,  C08K7/18

Abstract: An acrylic conductive paste is provided, based on 100 parts by weight, including: 30-84 parts of conductive particles, 15˜45 parts of acrylate, 0.5˜2.5 parts of adhesion promoter, 0.5˜3 parts of initiator. The conductive particles include three-dimensional dendritic conductive particles; and the adhesion promoter is a mixture of a silane coupling agent and a phosphate ester. The conductive paste of the present disclosure has good electrical conductivity, short curing time, strong adhesion, and can be used for a long-time room temperature operation. The present disclosure also provides a method for preparing the above-mentioned acrylic conductive paste, which is convenient for operation and industrial application; at the same time, it shows that the acrylic conductive paste of the present disclosure can be applied to semiconductor components for packaging a semiconductor device.