公开(公告)号：US09929199B2

公开(公告)日：2018-03-27

申请号：US14908319

申请日：2014-08-21

Applicant: SONY CORPORATION

Inventor： Takahiro Igarashi ,  Izuho Hatada ,  Takeshi Kodama ,  Kiwamu Adachi ,  Shuichi Oka ,  Shun Mitarai ,  Hiizu Ootorii ,  Shusaku Yanagawa ,  Katsuji Matsumoto

IPC: H01L27/146

CPC classification number: H01L27/14629 ,  H01L27/14663 ,  H01L27/14685

Abstract: There is provided a radiation detector including: a plurality of photoelectric conversion devices, each photoelectric conversion device formed at least partially within an embedding layer and having a light receiving surface situated at least partially outside of the embedding layer, and a plurality of scintillator crystals, at least a first scintillator crystal of the plurality of scintillator crystals in contact with at least one light receiving surface at a proximal end, wherein a cross-section of the first scintillator crystal at the proximal end is smaller than a cross-section of the first scintillator crystal at a distal end.

公开(公告)号：US20170287823A1

公开(公告)日：2017-10-05

申请号：US15510430

申请日：2015-09-08

Applicant: Sony Corporation

Inventor： Kiwamu Adachi ,  Katsuji Matsumoto ,  Takeshi Kodama ,  Shuichi Oka ,  Hiizu Ootorii ,  Kazunari Saitou ,  Kei Satou

IPC: H01L23/498 ,  H01L23/00 ,  H01L21/48 ,  H01L23/12

CPC classification number: H01L23/49811 ,  H01L21/4853 ,  H01L23/12 ,  H01L24/11 ,  H01L24/17 ,  H01L2224/11825 ,  H01L2224/18 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/73259 ,  H01L2224/73267 ,  H01L2224/92244

Abstract: A method of manufacturing a mounting substrate according to an embodiment of the present technology includes the following three steps:(1) a step of forming a plurality of electrodes on a semiconductor layer, and thereafter forming one of solder bumps at a position facing each of the electrodes;(2) a step of covering the solder bumps with a coating layer, and thereafter selectively etching the semiconductor layer with use of the coating layer as a mask to separate the semiconductor layer into a plurality of elements; and(3) a step of removing the coating layer, and thereafter mounting the elements on a wiring substrate to direct the solder bumps toward the wiring substrate, thereby forming the mounting substrate.

公开(公告)号：US10134662B2

公开(公告)日：2018-11-20

申请号：US15510430

申请日：2015-09-08

Applicant: Sony Corporation

Inventor： Kiwamu Adachi ,  Katsuji Matsumoto ,  Takeshi Kodama ,  Shuichi Oka ,  Hiizu Ootorii ,  Kazunari Saitou ,  Kei Satou

IPC: H01L21/44 ,  H01L23/498 ,  H01L23/12 ,  H01L21/48 ,  H01L23/00

Abstract: A method of manufacturing a mounting substrate according to an embodiment of the present technology includes the following three steps: (1) a step of forming a plurality of electrodes on a semiconductor layer, and thereafter forming one of solder bumps at a position facing each of the electrodes; (2) a step of covering the solder bumps with a coating layer, and thereafter selectively etching the semiconductor layer with use of the coating layer as a mask to separate the semiconductor layer into a plurality of elements; and (3) a step of removing the coating layer, and thereafter mounting the elements on a wiring substrate to direct the solder bumps toward the wiring substrate, thereby forming the mounting substrate.

公开(公告)号：US20160163754A1

公开(公告)日：2016-06-09

申请号：US14908319

申请日：2014-08-21

Applicant: SONY CORPORATION

Inventor： Takahiro Igarashi ,  Izuho Hatada ,  Takeshi Kodama ,  Kiwamu Adachi ,  Shuichi Oka ,  Shun Mitarai ,  Hiizu Ootoril ,  Shusaku Yanagawa ,  Katsuji Matsumoto

IPC: H01L27/146

CPC classification number: H01L27/14629 ,  H01L27/14663 ,  H01L27/14685

Abstract: There is provided a radiation detector including: a plurality of photoelectric conversion devices, each photoelectric conversion device formed at least partially within an embedding layer and having a light receiving surface situated at least partially outside of the embedding layer, and a plurality of scintillator crystals, at least a first scintillator crystal of the plurality of scintillator crystals in contact with at least one light receiving surface at a proximal end, wherein a cross-section of the first scintillator crystal at the proximal end is smaller than a cross-section of the first scintillator crystal at a distal end.

Abstract translation: 提供了一种辐射检测器，包括：多个光电转换装置，每个光电转换装置至少部分地形成在嵌入层内并且具有至少部分位于嵌入层外部的光接收表面，以及多个闪烁体晶体， 所述多个闪烁器晶体中的至少第一闪烁体晶体与近端的至少一个光接收表面接触，其中所述第一闪烁体晶体在所述近端处的横截面小于所述第一闪烁体晶体的截面， 闪烁体晶体在远端。