公开(公告)号：US09771305B2

公开(公告)日：2017-09-26

申请号：US14294734

申请日：2014-06-03

申请人： Sony Corporation

发明人： Kiwamu Adachi

IPC分类号： B29C43/10 ,  C04B35/645 ,  B28B3/02 ,  B28B7/44 ,  B30B11/02 ,  B30B15/34 ,  B30B15/00

CPC分类号： C04B35/645 ,  B28B3/025 ,  B28B7/44 ,  B30B11/027 ,  B30B15/0017 ,  B30B15/34

摘要： A sintering apparatus includes: a non-transportable section mounted in the atmosphere; a transportable section that has a mold capable of accommodating a material to be processed and is loaded detachably with respect to the non-transportable section; and a covering member that envelops the transportable section loaded on the non-transportable section in an almost hermetically sealed state and allows the transportable section to be separated from the non-transportable section with the transportable section enveloped in the almost hermetically sealed state.

公开(公告)号：US11370047B2

公开(公告)日：2022-06-28

申请号：US14270762

申请日：2014-05-06

申请人： Sony Corporation

发明人： Hiizu Ootorii ,  Kiwamu Adachi ,  Takeshi Mizuno

IPC分类号： H01L23/00 ,  B23K1/20 ,  H05K13/04

摘要： A method of manufacturing a mounting substrate, the method includes: transferring part or all of a plurality of devices on a device substrate onto a wiring substrate, and temporarily fixing the transferred devices to the wiring substrate with use of a fixing layer having viscosity, the device substrate including a support substrate and the plurality of devices fixed on the support substrate; and performing a reflow process on the wiring substrate to electrically connect the transferred devices with the wiring substrate, and thereby forming the mounting substrate.

公开(公告)号：US20170287823A1

公开(公告)日：2017-10-05

申请号：US15510430

申请日：2015-09-08

申请人： Sony Corporation

发明人： Kiwamu Adachi ,  Katsuji Matsumoto ,  Takeshi Kodama ,  Shuichi Oka ,  Hiizu Ootorii ,  Kazunari Saitou ,  Kei Satou

IPC分类号： H01L23/498 ,  H01L23/00 ,  H01L21/48 ,  H01L23/12

CPC分类号： H01L23/49811 ,  H01L21/4853 ,  H01L23/12 ,  H01L24/11 ,  H01L24/17 ,  H01L2224/11825 ,  H01L2224/18 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/73259 ,  H01L2224/73267 ,  H01L2224/92244

摘要： A method of manufacturing a mounting substrate according to an embodiment of the present technology includes the following three steps:(1) a step of forming a plurality of electrodes on a semiconductor layer, and thereafter forming one of solder bumps at a position facing each of the electrodes;(2) a step of covering the solder bumps with a coating layer, and thereafter selectively etching the semiconductor layer with use of the coating layer as a mask to separate the semiconductor layer into a plurality of elements; and(3) a step of removing the coating layer, and thereafter mounting the elements on a wiring substrate to direct the solder bumps toward the wiring substrate, thereby forming the mounting substrate.

公开(公告)号：US10483413B2

公开(公告)日：2019-11-19

申请号：US15303111

申请日：2015-04-23

申请人： Sony Corporation

发明人： Hiizu Ootorii ,  Kazunao Oniki ,  Koki Uchino ,  Hideyuki Suzuki ,  Hiroshi Ozaki ,  Kazuki Sano ,  Eiji Otani ,  Shinji Rokuhara ,  Kiwamu Adachi ,  Shuichi Oka ,  Shusaku Yanagawa ,  Hiroshi Morita ,  Takeshi Ogura

IPC分类号： H01L31/0232 ,  G02B6/42

摘要： A photoelectric module of the present disclosure includes an optical device including an optical function element array made of a first base material, and a plurality of light emitting/receiving elements made of a second base material, wherein the optical function element array includes an optical substrate and a plurality of optical function elements, the optical substrate having a first surface and a second surface, and the optical function elements being integrated with the optical substrate and being arranged one-dimensionally or two-dimensionally, and the light emitting/receiving elements and their respective optical function elements face each other with the optical substrate in between to be located on a same axis in a direction perpendicular to the optical substrate, and the light emitting/receiving elements are disposed on the second surface with a space in between while being separated in units of a smaller number than array number in the optical function element array.

公开(公告)号：US09929199B2

公开(公告)日：2018-03-27

申请号：US14908319

申请日：2014-08-21

申请人： SONY CORPORATION

发明人： Takahiro Igarashi ,  Izuho Hatada ,  Takeshi Kodama ,  Kiwamu Adachi ,  Shuichi Oka ,  Shun Mitarai ,  Hiizu Ootorii ,  Shusaku Yanagawa ,  Katsuji Matsumoto

IPC分类号： H01L27/146

CPC分类号： H01L27/14629 ,  H01L27/14663 ,  H01L27/14685

摘要： There is provided a radiation detector including: a plurality of photoelectric conversion devices, each photoelectric conversion device formed at least partially within an embedding layer and having a light receiving surface situated at least partially outside of the embedding layer, and a plurality of scintillator crystals, at least a first scintillator crystal of the plurality of scintillator crystals in contact with at least one light receiving surface at a proximal end, wherein a cross-section of the first scintillator crystal at the proximal end is smaller than a cross-section of the first scintillator crystal at a distal end.

公开(公告)号：US20150047971A1

公开(公告)日：2015-02-19

申请号：US14387027

申请日：2013-02-25

申请人： Sony Corporation

发明人： Kiwamu Adachi ,  Shusaku Yanagawa

IPC分类号： C23C14/34 ,  C04B35/64 ,  C04B35/468 ,  H01J37/34 ,  C23C14/06

CPC分类号： C23C14/3414 ,  C04B35/4682 ,  C04B35/64 ,  C04B35/645 ,  C04B2235/3206 ,  C04B2235/3217 ,  C04B2235/3239 ,  C04B2235/3241 ,  C04B2235/3251 ,  C04B2235/3262 ,  C04B2235/3265 ,  C04B2235/3418 ,  C04B2235/786 ,  C23C14/06 ,  C23C14/088 ,  H01G4/1227 ,  H01G4/33 ,  H01J37/3426 ,  H01J37/3429 ,  H01J37/3491 ,  H01J2237/332

摘要： A sputtering target includes a conductive barium titanate sintered material with generation density of crystal grain aggregate (12) having a grain diameter of 10 μm or more on a cleavage surface of less than 0.2 piece/cm2.

摘要翻译： 溅射靶包括在小于0.2片/ cm 2的劈裂面上具有10μm以上的粒径的结晶粒子集合体（12）的发生密度的导电性钛酸钡烧结体。

公开(公告)号：US20130149464A1

公开(公告)日：2013-06-13

申请号：US13686479

申请日：2012-11-27

申请人： Sony Corporation

发明人： Shinji Rokuhara ,  Kiwamu Adachi ,  Shuichi Oka ,  Katsuji Matsumoto ,  Shusaku Yanagawa ,  Satoshi Horiuchi

IPC分类号： H05K3/02

CPC分类号： H05K3/02 ,  H05K1/0259 ,  H05K1/162 ,  H05K2203/175

摘要： A method of manufacturing a circuit board, the method includes: forming a capacitive device and a short-circuit section with use of a capacitive device material including a dielectric film and a conductive film in this order on metallic foil, the capacitive device including a first electrode layer and a second electrode layer with the dielectric film interposed therebetween, and the short-circuit section short-circuiting the first electrode layer and the second electrode layer; forming an upper-layer wiring above the capacitive device and the short-circuit section; and removing or cutting the short-circuit section after the forming of the upper-layer wiring.

摘要翻译： 一种电路板的制造方法，其特征在于，包括：在金属箔上依次使用包含电介质膜和导电膜的电容性器件材料形成电容器件和短路部，所述电容器件包括第一 电极层和介于其间的第二电极层，并且所述短路部分使所述第一电极层和所述第二电极层短路; 在电容器件和短路部分上形成上层布线; 以及在形成上层布线之后去除或切割短路部分。

公开(公告)号：US10134662B2

公开(公告)日：2018-11-20

申请号：US15510430

申请日：2015-09-08

申请人： Sony Corporation

发明人： Kiwamu Adachi ,  Katsuji Matsumoto ,  Takeshi Kodama ,  Shuichi Oka ,  Hiizu Ootorii ,  Kazunari Saitou ,  Kei Satou

IPC分类号： H01L21/44 ,  H01L23/498 ,  H01L23/12 ,  H01L21/48 ,  H01L23/00

摘要： A method of manufacturing a mounting substrate according to an embodiment of the present technology includes the following three steps: (1) a step of forming a plurality of electrodes on a semiconductor layer, and thereafter forming one of solder bumps at a position facing each of the electrodes; (2) a step of covering the solder bumps with a coating layer, and thereafter selectively etching the semiconductor layer with use of the coating layer as a mask to separate the semiconductor layer into a plurality of elements; and (3) a step of removing the coating layer, and thereafter mounting the elements on a wiring substrate to direct the solder bumps toward the wiring substrate, thereby forming the mounting substrate.

公开(公告)号：US20160163754A1

公开(公告)日：2016-06-09

申请号：US14908319

申请日：2014-08-21

申请人： SONY CORPORATION

发明人： Takahiro Igarashi ,  Izuho Hatada ,  Takeshi Kodama ,  Kiwamu Adachi ,  Shuichi Oka ,  Shun Mitarai ,  Hiizu Ootoril ,  Shusaku Yanagawa ,  Katsuji Matsumoto

IPC分类号： H01L27/146

CPC分类号： H01L27/14629 ,  H01L27/14663 ,  H01L27/14685

摘要： There is provided a radiation detector including: a plurality of photoelectric conversion devices, each photoelectric conversion device formed at least partially within an embedding layer and having a light receiving surface situated at least partially outside of the embedding layer, and a plurality of scintillator crystals, at least a first scintillator crystal of the plurality of scintillator crystals in contact with at least one light receiving surface at a proximal end, wherein a cross-section of the first scintillator crystal at the proximal end is smaller than a cross-section of the first scintillator crystal at a distal end.

摘要翻译： 提供了一种辐射检测器，包括：多个光电转换装置，每个光电转换装置至少部分地形成在嵌入层内并且具有至少部分位于嵌入层外部的光接收表面，以及多个闪烁体晶体， 所述多个闪烁器晶体中的至少第一闪烁体晶体与近端的至少一个光接收表面接触，其中所述第一闪烁体晶体在所述近端处的横截面小于所述第一闪烁体晶体的截面， 闪烁体晶体在远端。

公开(公告)号：US20140367251A1

公开(公告)日：2014-12-18

申请号：US14294734

申请日：2014-06-03

申请人： Sony Corporation

发明人： Kiwamu Adachi

IPC分类号： C23C14/34

CPC分类号： C04B35/645 ,  B28B3/025 ,  B28B7/44 ,  B30B11/027 ,  B30B15/0017 ,  B30B15/34

摘要： A sintering apparatus includes: a non-transportable section mounted in the atmosphere; a transportable section that has a mold capable of accommodating a material to be processed and is loaded detachably with respect to the non-transportable section; and a covering member that envelops the transportable section loaded on the non-transportable section in an almost hermetically sealed state and allows the transportable section to be separated from the non-transportable section with the transportable section enveloped in the almost hermetically sealed state.

摘要翻译： 烧结装置包括：安装在大气中的不可运输部分; 可移动部分，其具有能够容纳待处理材料的模具，并且相对于不可运输部分可拆卸地装载; 以及覆盖部件，其以几乎气密的状态包封装载在不可运输部分上的可运输部分，并且允许可运输部分与不可运输部分分离，其中运输部分被包封在几乎密封的状态。