公开(公告)号：US20050144816A1

公开(公告)日：2005-07-07

申请号：US10753886

申请日：2004-01-07

申请人： Spero Payton

发明人： Spero Payton

IPC分类号： E01H5/02

CPC分类号： E01H5/02

摘要： The present invention relates to a push-type, manual snowplowing device with a wooden blade of adequate size and structure to efficiently remove snowfalls of four and one-half inches or less. The invention encompasses a manual snowplowing device avoiding the physical strain associated with shoveling while remaining cost effective, relatively maintenance free, and amenable to storage and user assembly.

摘要翻译： 本发明涉及具有足够尺寸和结构的木制叶片的推式手动除雪装置，以有效地去除四个半英寸或更小的降雪。 本发明包括手动除雪装置，其避免与铲铲相关的物理应变，同时保持成本有效，相对免维护，并且易于存储和使用者组装。

公开(公告)号：US20070186450A1

公开(公告)日：2007-08-16

申请号：US11738295

申请日：2007-04-20

申请人： Spero Payton

发明人： Spero Payton

IPC分类号： E01H5/02

CPC分类号： E01H5/02

摘要： The present invention relates to a push-type, manual snowplowing device with a wooden blade of adequate size and structure to efficiently remove snowfalls of four and one-half inches or less. The invention encompasses a manual snowplowing device avoiding the physical strain associated with shoveling while remaining cost effective, relatively maintenance free, and amenable to storage and user assembly.

摘要翻译： 本发明涉及具有足够尺寸和结构的木制叶片的推式手动除雪装置，以有效地去除四个半英寸或更小的降雪。 本发明包括手动除雪装置，其避免与铲铲相关的物理应变，同时保持成本有效，相对免维护，并且易于存储和使用者组装。

公开(公告)号：US4958214A

公开(公告)日：1990-09-18

申请号：US184780

申请日：1988-04-22

申请人： Richard D. Ries ,  Dewey W. Smith ,  Spero Payton

发明人： Richard D. Ries ,  Dewey W. Smith ,  Spero Payton

IPC分类号： H01R33/97 ,  H01L21/50 ,  H01L21/52 ,  H01L21/66 ,  H01L21/673 ,  H01L23/28 ,  H01L23/32 ,  H01L25/10 ,  H01L25/18

CPC分类号： H05K7/103

摘要： An assembly is disclosed for releasably mounting a semiconductor package with respect to a rigid carrier, in a predetermined alignment with the carrier to protect the package leads and position the leads for electrical testing. Two substantially identical dielectric frames are positioned on opposite sides of the leads and fastened in a sandwich arrangement enclosing remote end portions of the leads. Registration openings, provided at opposed corners of the frames, receive registration pins projected from the carrier, thus to positionally align the package and carrier in transverse directions. Spring-loaded retainers engage a central body of the semiconductor package to retain the package against longitudinal movement relative to the carrier.