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10 条记录 (耗时 0.012 秒)

    Textured silicone tubing for electrical pacing leads
    6.
    发明授权
    Textured silicone tubing for electrical pacing leads 有权
    用于电起搏导线的纹理硅胶管

    公开(公告)号：US06438425B1

    公开(公告)日：2002-08-20

    申请号：US09416971

    申请日：1999-10-12

    申请人： Jennifer P. Miller ,  Michael J. Ebert ,  Joseph J. Klein ,  Richard D. Ries

    发明人： Jennifer P. Miller ,  Michael J. Ebert ,  Joseph J. Klein ,  Richard D. Ries

    IPC分类号： A61N105

    CPC分类号： A61N1/056

    摘要： An implantable lead having a silicone rubber lead body which has a reduced coefficient of friction on an internal or external surface. The reduction in coefficient of friction is accomplished by extruding a tubular lead body to define a plurality of small parallel longitudinally extending grooves on the inner or outer surface of the lead body. The grooves may be formed by means of a die having inwardly or outwardly directed projections that form the grooves during the extrusion process. The formation of the grooves during extrusion provides a lead body having a lower coefficient of friction without the necessity of additional manufacturing process steps and without additional manufacturing costs.

    摘要翻译： 具有硅橡胶引线体的可植入引线，其在内表面或外表面上具有减小的摩擦系数。 摩擦系数的降低通过挤压管状引线体来在引线体的内表面或外表面上限定多个小的平行的纵向延伸的凹槽来实现。 凹槽可以通过具有在挤出过程中形成凹槽的向内或向外指向的突起的模具形成。 在挤出期间形成凹槽提供具有较低摩擦系数的引线体，而不需要额外的制造工艺步骤，而不需要额外的制造成本。

    Protective carrier for semiconductor packages
    9.
    发明授权
    Protective carrier for semiconductor packages 失效
    半导体封装的保护载体

    公开(公告)号：US4958214A

    公开(公告)日：1990-09-18

    申请号：US184780

    申请日：1988-04-22

    申请人： Richard D. Ries ,  Dewey W. Smith ,  Spero Payton

    发明人： Richard D. Ries ,  Dewey W. Smith ,  Spero Payton

    IPC分类号： H01R33/97 ,  H01L21/50 ,  H01L21/52 ,  H01L21/66 ,  H01L21/673 ,  H01L23/28 ,  H01L23/32 ,  H01L25/10 ,  H01L25/18

    CPC分类号： H05K7/103

    摘要： An assembly is disclosed for releasably mounting a semiconductor package with respect to a rigid carrier, in a predetermined alignment with the carrier to protect the package leads and position the leads for electrical testing. Two substantially identical dielectric frames are positioned on opposite sides of the leads and fastened in a sandwich arrangement enclosing remote end portions of the leads. Registration openings, provided at opposed corners of the frames, receive registration pins projected from the carrier, thus to positionally align the package and carrier in transverse directions. Spring-loaded retainers engage a central body of the semiconductor package to retain the package against longitudinal movement relative to the carrier.