公开(公告)号：US07709373B1

公开(公告)日：2010-05-04

申请号：US11553220

申请日：2006-10-26

申请人： Srikanteswara Dakshina-Murthy ,  Bhanwar Singh ,  Khoi A Phan

发明人： Srikanteswara Dakshina-Murthy ,  Bhanwar Singh ,  Khoi A Phan

IPC分类号： H01L21/4763

CPC分类号： G03F7/0002 ,  B82Y10/00 ,  B82Y40/00 ,  H01L21/76807 ,  H01L21/76817 ,  H01L2221/1021

摘要： A system and method are provided to facilitate dual damascene interconnect integration in a single imprint step. The method provides for creation of a translucent imprint mold with three-dimensional features comprising the dual damascene pattern to be imprinted. The imprint mold is brought into contact with a photopolymerizable organosilicon imaging layer deposited upon a transfer layer which is spin coated or otherwise deposited upon a dielectric layer of a substrate. When the photopolymerizable layer is exposed to a source of illumination, it cures with a structure matching the dual damascene pattern of the imprint mold. A halogen breakthrough etch followed by oxygen transfer etch transfer the vias from the imaging layer into the transfer layer. A second halogen breakthrough etch followed by a second oxygen transfer etch transfer the trenches from the imaging layer into the transfer layer. A dielectric etch transfers the pattern from the transfer layer into the dielectric layer. A metal fill process then fills the dual damascene openings of the dielectric layer with metal.

摘要翻译： 提供了一种系统和方法，以便在单个压印步骤中促进双镶嵌互连集成。 该方法提供了具有三维特征的半透明压印模具的创建，该三维特征包括要印刷的双镶嵌图案。 压印模具与沉积在转移层上的可光聚合的有机硅成像层接触，转移层被旋涂或以其它方式沉积在基底的电介质层上。 当可光聚合层暴露于照明源时，它可以用匹配印模的双镶嵌图案的结构固化。 卤素穿透蚀刻随后氧传递蚀刻将通孔从成像层转移到转移层中。 第二个卤素穿透蚀刻，随后是第二次氧转移蚀刻，将沟槽从成像层转移到转移层中。 电介质蚀刻将图案从转印层转移到电介质层中。 然后，金属填充过程用金属填充介电层的双镶嵌开口。

公开(公告)号：US07381278B1

公开(公告)日：2008-06-03

申请号：US11555564

申请日：2006-11-01

申请人： Ramkumar Subramanian ,  Bhanwar Singh ,  Khoi A Phan ,  Srikanteswara Dakshina-Murthy

发明人： Ramkumar Subramanian ,  Bhanwar Singh ,  Khoi A Phan ,  Srikanteswara Dakshina-Murthy

IPC分类号： G03B27/42

CPC分类号： G03F7/2041 ,  G03F7/70341 ,  G03F7/70925

摘要： Disclosed are immersion lithography methods involving irradiating a first photoresist through a lens and an immersion liquid, the immersion liquid contacting the lens and the first photoresist in a first apparatus; contacting the lens with a supercritical fluid in a second apparatus; and irradiating a second photoresist through the lens and an immersion liquid, the immersion liquid contacting the lens and the second photoresist in the first apparatus.

摘要翻译： 公开了浸没式光刻方法，包括通过透镜和浸没液体照射第一光致抗蚀剂，浸没液体在第一装置中与透镜和第一光致抗蚀剂接触; 在第二装置中使透镜与超临界流体接触; 以及通过所述透镜和浸没液体照射第二光致抗蚀剂，所述浸没液体与所述透镜和所述第二光致抗蚀剂接触。