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公开(公告)号:US20090031733A1
公开(公告)日:2009-02-05
申请号:US11830890
申请日:2007-07-31
申请人: Stanton Earl Weaver, JR. , Mehmet Arik , James William Bray , Ahmed Elasser , Robert John Wojnarowski , Mark Wayne Wilson , Jason Knud Klindtworth , Surajit Atha
发明人: Stanton Earl Weaver, JR. , Mehmet Arik , James William Bray , Ahmed Elasser , Robert John Wojnarowski , Mark Wayne Wilson , Jason Knud Klindtworth , Surajit Atha
IPC分类号: F25B21/02
CPC分类号: F25B21/00 , F25B2321/003 , Y02B30/66
摘要: A refrigeration system is provided. The refrigeration system includes at least one thermal blocking thermotunneling device. The thermal blocking thermotunneling device comprises a first and a second surface separated by a nanoscale gap of less than about 20 nm, such that tunneling of electrons causes a unidirectional transfer of heat from the first surface to the second surface. Further, the at least one thermal blocking thermotunneling device has a thermal back path of less than about 70 percent.
摘要翻译: 提供制冷系统。 制冷系统包括至少一个热阻热电火花钻孔装置。 热阻焊热电火焰装置包括由小于约20nm的纳米尺度间隙分开的第一和第二表面,使得电子的隧穿导致热量从第一表面到第二表面的单向转移。 此外,所述至少一个热阻焊热电火花钻孔装置具有小于约70%的热回路径。