公开(公告)号：US20030109196A1

公开(公告)日：2003-06-12

申请号：US10303621

申请日：2002-11-25

申请人： Strasbaugh

发明人： Stephan H. Wolf

IPC分类号： B24B049/12

CPC分类号： B24B37/205 ,  B24B37/013 ,  B24B49/12

摘要： An wafer polishing pad assembly for use in CMP includes an optical sensor for sensing reflectivity of the wafer during polishing, and produces a corresponding signal, and transmits the signal from the rotating pad to a stationary portion of the assembly. The signal is transmitting off the pad through non-contact couplings such inductive coupling or optical couplings after being converted into signal formats enabling non-contact transmission.

公开(公告)号：US20040229545A1

公开(公告)日：2004-11-18

申请号：US10785393

申请日：2004-02-23

申请人： Strasbaugh

发明人： Stephan H. Wolf

IPC分类号： B24B049/00

CPC分类号： B24B37/205 ,  B24B37/013 ,  B24B49/12

摘要： An wafer polishing pad assembly for use in CMP includes an optical sensor for sensing reflectivity of the wafer during polishing, and produces a corresponding signal, and transmits the signal from the rotating pad to a stationary portion of the assembly. The signal is transmitting off the pad through non-contact couplings such inductive coupling or optical couplings after being converted into signal formats enabling non-contact transmission.

摘要翻译： 用于CMP的晶片抛光垫组件包括用于在抛光过程中感测晶片的反射率的光学传感器，并产生相应的信号，并将该信号从旋转焊盘传输到组件的固定部分。 信号通过非接触耦合，如感性耦合或光耦合，在被转换为能够进行非接触传输的信号格式之后传输掉。