公开(公告)号：US20040152396A1

公开(公告)日：2004-08-05

申请号：US10358852

申请日：2003-02-04

申请人： Applied Materials, Inc

发明人： Andreas Norbert Wiswesser ,  Manoocher Birang ,  Boguslaw A. Swedek

IPC分类号： B24B049/12

CPC分类号： B24B37/013 ,  B24B49/12

摘要： Methods and apparatus for monitoring a substrate surface during chemical mechanical polishing are disclosed.

摘要翻译： 公开了用于在化学机械抛光期间监测基底表面的方法和装置。

公开(公告)号：US20030207651A1

公开(公告)日：2003-11-06

申请号：US10389911

申请日：2003-03-18

发明人： Seung-Kon Kim ,  Yong -Rim Ko

IPC分类号： B24B049/12

CPC分类号： B24B37/013 ,  B24B49/12

摘要： A polishing endpoint detecting device of a polishing apparatus detects a polishing endpoint of a polishing process by measuring light reflected from a surface of a semiconductor substrate being polished. The apparatus also includes a polishing pad and a rotary plate each of a light-transmitting material. The light is directed onto the surface of the semiconductor substrate through the polishing pad and the rotary plate and is scanned across the surface of the semiconductor substrate along a horizontal line which passes through the centers of the polishing pad and the semiconductor substrate. A light-measuring instrument measures a characteristic of the light reflected from the surface of the semiconductor substrate, and a processor detects the polishing endpoint by analyzing signals produced by the light measuring instrument.

摘要翻译： 抛光装置的抛光终点检测装置通过测量从被抛光的半导体衬底的表面反射的光来检测抛光工艺的抛光终点。 该设备还包括每个透光材料的抛光垫和旋转板。 光通过抛光垫和旋转板被引导到半导体衬底的表面上，并且沿着穿过抛光垫和半导体衬底的中心的水平线扫描半导体衬底的表面。 光测量仪器测量从半导体衬底的表面反射的光的特性，并且处理器通过分析由光测量仪产生的信号来检测抛光终点。

公开(公告)号：US20030134571A1

公开(公告)日：2003-07-17

申请号：US10045781

申请日：2002-01-12

申请人： Taiwan Semiconductor Manufacturing Co., Ltd.

发明人： Rico Cheng ,  Kang-Yung Peng ,  Kevin Lai

IPC分类号： B24B049/12

CPC分类号： B24B37/0053 ,  B24B37/04 ,  Y10S269/903

摘要： A dual semiconductor wafer slippage, or loss, and water-resistant sensor holder for chemical mechanical polishing (CMP) semiconductor fabrication equipment is disclosed. The holder has a body and a cover. The body is designed to hold two wafer slippage sensors at an angle to a vertical plane, such as substantially fifteen degrees, and has a window to allow the sensors to detect wafer slippage. The cover is situated over the window of the body to prevent slurry from spraying and drying onto the sensors during high-pressure rinse cleaning of a platen of the CMP semiconductor fabrication equipment.

摘要翻译： 公开了用于化学机械抛光（CMP）半导体制造设备的双半导体晶片滑移或损失和防水传感器保持器。 支架有一个主体和一个盖子。 主体被设计成将两个晶片滑动传感器保持在垂直平面（例如大致十五度）的角度，并且具有允许传感器检测晶片滑动的窗口。 盖子位于身体的窗口之上，以防止在CMP半导体制造设备的压板的高压冲洗清洁期间浆料喷洒和干燥到传感器上。

公开(公告)号：US20010023167A1

公开(公告)日：2001-09-20

申请号：US09784171

申请日：2001-02-16

发明人： Norio Kimura ,  Katsuya Okumura ,  Hiroyuki Yano

IPC分类号： B24B049/12 ,  B24B007/22

CPC分类号： B24B37/26 ,  B24B37/013 ,  B24B37/205 ,  B24B49/04 ,  B24B49/12

摘要： A polishing apparatus comprises a polishing table having a polishing surface, a top ring for holding a substrate and pressing a surface of the substrate against the polishing surface to polish the surface of the substrate, and at least one optical measuring device disposed adjacent to the outer peripheral portion of the polishing table and below the polishing surface of the polishing table for measuring the thickness of a layer formed on the surface of the substrate. The polishing apparatus further comprises at least one notch formed in the peripheral portion of the polishing table. The notch allows light emitted from the optical measuring device to pass therethrough and be incident on the surface of the substrate and allows light reflected from the surface of the substrate to pass therethrough and be incident on the optical measuring device.

摘要翻译： 抛光装置包括具有抛光表面的抛光台，用于保持基板的顶环，并将基板的表面压靠在抛光表面上以抛光基板的表面;以及至少一个光学测量装置，其邻近外部设置 抛光台的周边部分和抛光台的抛光表面下方，用于测量在基板表面上形成的层的厚度。 抛光装置还包括形成在抛光台的周边部分中的至少一个凹口。 该凹口允许从光学测量装置发射的光通过，并且入射到基板的表面上，并允许从基板的表面反射的光通过，并入射到光学测量装置上。

公开(公告)号：US20030216107A1

公开(公告)日：2003-11-20

申请号：US10146494

申请日：2002-05-14

申请人： Strasbaugh, Inc.

发明人： Greg Barbour

IPC分类号： B24B049/12

CPC分类号： B24B37/205 ,  B24B49/12

摘要： A polishing pad having an optical assembly that does not cause excess wear on a wafer workpiece. The optical assembly is disposed within the pad such that it may move in response to forces applied to the optical assembly.

摘要翻译： 一种抛光垫，具有不会对晶片工件造成过度磨损的光学组件。 光学组件设置在垫内，使得其可以响应于施加到光学组件的力而移动。

公开(公告)号：US20030176148A1

公开(公告)日：2003-09-18

申请号：US10125551

申请日：2002-04-19

申请人： LG. Philips LCD Co., Ltd.

发明人： Kyung-Su Chae ,  Hun-Jun Choo ,  Jong Go Lim

IPC分类号： B24B049/12

CPC分类号： B24B49/12 ,  G02F1/133351

摘要： An indicator for deciding a grinding amount of a liquid crystal display panel and a method for detecting grinding failure using the same are disclosed in the present invention. The indicator includes at least one alignment mark formed at a gate pad unit and a data pad unit of a liquid crystal display panel, and at least one pattern for detecting a grinding amount between a first end portion of the gate pad unit and the alignment mark, and a second end portion of the data pad unit and the alignment mark.

摘要翻译： 本发明公开了一种用于决定液晶显示面板的磨削量的指示器和使用该液晶显示面板的磨削破坏检测方法。 指示器包括形成在栅极焊盘单元和液晶显示面板的数据焊盘单元的至少一个对准标记，以及用于检测栅极焊盘单元的第一端部与对准标记之间的磨削量的至少一个图案 ，以及数据垫单元的第二端部和对准标记。

公开(公告)号：US20030124956A1

公开(公告)日：2003-07-03

申请号：US10035391

申请日：2001-12-28

申请人： APPLIED MATERIALS, INC.

发明人： Andreas Norbert Wiswesser ,  Boguslaw A. Swedek

IPC分类号： B24B049/12

CPC分类号： B24B37/205

摘要： A polishing solution is dispensed onto a polishing pad that has a polishing surface, a substrate is brought into contact with the polishing surface, relative motion is created between the substrate and the polishing pad, a light beam is directed through a window in the polishing pad to impinge the substrate, and an intensity of a reflected light beam from the substrate is monitored. The polishing solution has a first refractive index, and the window has a second index of refraction that is approximately equal to the first index of refraction.

摘要翻译： 将抛光液分配到具有研磨面的研磨垫上，使基板与研磨面接触，在基板和研磨垫之间产生相对运动，将光束朝向抛光垫中的窗口 以撞击基板，并且监测来自基板的反射光束的强度。 抛光溶液具有第一折射率，并且窗口具有大致等于第一折射率的第二折射率。

公开(公告)号：US20020090887A1

公开(公告)日：2002-07-11

申请号：US09970252

申请日：2001-09-29

发明人： David G. Halley ,  Gregory L. Barbour ,  Ben Smedley ,  Stephen H. Wolf

IPC分类号： B24B007/22 ,  B24B049/12

CPC分类号： B24B37/205 ,  B24B37/013 ,  B24B49/12

摘要： An optical sensor that includes a light source and a detector is located within a cavity in a polishing pad so as to face the surface that is being polished. Light from the light source is reflected from the surface being polished and the detector detects the reflected light. The electrical signal produced by the detector is conducted to a hub located at the central aperture of the polishing pad. The disposable polishing pad is removably connected, both mechanically and electrically to the hub. The hub contains electronic circuitry that is concerned with supplying power to the optical sensor and with transmitting the electrical signal to a non-rotating station. Several techniques are described for accomplishing these tasks. The system permits continuous monitoring of an optical characteristic of a surface that is being polished, even while the polishing machine is in operation, and permits the end point of the polishing process to be determined.

摘要翻译： 包括光源和检测器的光学传感器位于抛光垫的空腔内，以面对被抛光的表面。 来自光源的光从被抛光的表面反射并且检测器检测到反射光。 由检测器产生的电信号被传导到位于抛光垫的中心孔处的毂。 一次性抛光垫可机械地和电气地连接到轮毂上。 集线器包含电子电路，其涉及向光学传感器供电并且将电信号传送到非旋转站。 描述了几种完成这些任务的技术。 该系统即使在抛光机工作时也允许连续监测正被抛光的表面的光学特性，并允许确定抛光过程的终点。

公开(公告)号：US20040229546A1

公开(公告)日：2004-11-18

申请号：US10807401

申请日：2004-03-24

发明人： Jesper Romer Hansen

IPC分类号： B24B049/00 ,  B24B049/12

CPC分类号： B24B49/12 ,  B24B37/04

摘要： Apparatus for inline measurement of material removal during a polishing or grinding process including: a. a substantially circular rotatable grinding or polishing pad; and b. a sample holder; and c. a sample with a top, a bottom and one or more side surfaces; the sample holder being arranged to hold the bottom surface of the sample in contact with the pad and the sample holder being connected to a moving device to move the sample to a position at least partially over the rim of the pad, during at least a part of the process, the apparatus also including a detecting device for sampling the distances between a reference mark and a target area in the sample and a plane defined by the bottom surface of the sample during the process.

摘要翻译： 用于在抛光或研磨过程中在线测量材料去除的装置，包括：a。 大致圆形的可旋转研磨或抛光垫; 和b。 样品架 和c。 具有顶部，底部和一个或多个侧表面的样品; 所述样品保持器被布置成保持所述样品的底表面与所述垫接触，并且所述样品保持器连接到移动装置，以在至少一部分中至少部分地超过所述垫的边缘的位置移动所述样品 该装置还包括用于对样品中的参考标记和目标区域之间的距离进行采样的检测装置以及在该过程期间由样品的底部表面限定的平面。

公开(公告)号：US20040203321A1

公开(公告)日：2004-10-14

申请号：US10820782

申请日：2004-04-09

申请人： TRECENTI TECHNOLOGIES, INC

发明人： Hirofumi Tsuchiyama ,  Shinji Nishihara ,  Masahiro Aoyagi

IPC分类号： B24B049/12

CPC分类号： B24B37/345 ,  B24B49/02 ,  B24B51/00

摘要： In a semiconductor manufacturing process such as the CMP process with the large ratio of manual work, the automation is promoted in order to achieve the rationalization and the manpower reduction, the improvement of the processing ability, the reduction of the investment amount, and the improvement of the indirect operation efficiency. By just downloading the process recipe of the product wafer from the host computer to the CMP apparatus in the CMP process, the dummy wafer is processed under the predetermined process condition before processing the product wafer. In this manner, the unmanned operation can be achieved. In addition, the measurement data of the film thickness measuring device mounted to the unmanned CMP apparatus is transmitted together with such process data as the polishing time from the CMP apparatus to the host computer. By doing so, the recipe condition of the CMP apparatus can be changed based on the latest data, and the process condition of the subsequent process is used in the feedforward manner based on the film thickness measurement data. In this manner, it is possible to eliminate the measurement process in the subsequent process.

摘要翻译： 在手工作业比例大的CMP工艺等半导体制造工艺中，为了实现合理化和人力的降低，加工能力的提高，投入量的减少和改善，实现了自动化 的间接运营效率。 通过在CMP工艺中将主产品晶片的工艺配方下载到CMP装置，在处理产品晶片之前，在预定的工艺条件下处理虚设晶片。 以这种方式，可以实现无人操作。 此外，安装到无人化CMP装置的膜厚测量装置的测量数据与从CMP装置到主计算机的抛光时间的处理数据一起发送。 通过这样做，可以基于最新数据改变CMP装置的配方条件，并且基于膜厚测量数据以前馈方式使用后续处理的处理条件。 以这种方式，可以消除后续处理中的测量过程。