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1.
公开(公告)号:US20100120244A1
公开(公告)日:2010-05-13
申请号:US12693405
申请日:2010-01-25
IPC分类号: H01L21/02
CPC分类号: H01L23/5227 , H01L23/5225 , H01L2924/0002 , H03H2001/0078 , H01L2924/00
摘要: A method of forming an integrated circuit is disclosed. The method includes providing a substrate and forming on the substrate a shield structure comprising a shield member and a ground strap. The shield member comprises a non-metallic portion, and the ground strap comprises a metallic portion.
摘要翻译: 公开了形成集成电路的方法。 该方法包括提供衬底并在衬底上形成包括屏蔽构件和接地带的屏蔽结构。 屏蔽构件包括非金属部分,并且接地带包括金属部分。
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公开(公告)号:US20080284553A1
公开(公告)日:2008-11-20
申请号:US11779892
申请日:2007-07-19
申请人: Chee Chong LIM , Kok Wai CHEW , Kiat Seng YEO , Suh Fei LIM , Manh Anh DO , Lap CHAN
发明人: Chee Chong LIM , Kok Wai CHEW , Kiat Seng YEO , Suh Fei LIM , Manh Anh DO , Lap CHAN
CPC分类号: H01F27/2804 , H01F17/0013 , H01F27/006 , H01F2017/0073 , H01L2924/3011 , Y10T29/4902
摘要: Embodiments of the invention provide a transformer comprising: a first coil element having a transverse axis along a transverse direction, the first coil element having p turns where p is greater than or equal to 1; and a second coil element having a transverse axis generally parallel to the transverse axis of the first coil element, the second coil element having n turns, where n is greater than or equal to 5 p; wherein the first and second coil elements are arranged to provide electromagnetic coupling between the coil elements along a portion of a length of the second coil element in both a transverse direction parallel to the transverse axes and a lateral direction, wherein the lateral direction is a direction normal to the transverse axes.
摘要翻译: 本发明的实施例提供了一种变压器,包括:第一线圈元件,其沿着横向具有横向轴线,所述第一线圈元件具有p匝,其中p大于或等于1; 以及第二线圈元件,其具有大致平行于所述第一线圈元件的横向轴线的横轴,所述第二线圈元件具有n圈,其中n大于或等于5p; 其中所述第一和第二线圈元件布置成沿平行于横向轴线的横向方向和横向方向沿着所述第二线圈元件的长度的一部分在所述线圈元件之间提供电磁耦合,其中所述横向方向是 垂直于横轴。
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3.
公开(公告)号:US20070268093A1
公开(公告)日:2007-11-22
申请号:US11832642
申请日:2007-08-01
申请人: Suh Fei LIM , Kok Wai CHEW , Sanford CHU , Michael CHENG
发明人: Suh Fei LIM , Kok Wai CHEW , Sanford CHU , Michael CHENG
IPC分类号: H03H7/00
CPC分类号: H01L23/5227 , H01L23/5225 , H01L2924/0002 , H03H2001/0078 , H01L2924/00
摘要: Embodiments of the invention provide an integrated circuit structure comprising: a substrate; a shield structure comprising a shield member and a ground strap formed on the substrate, wherein the shield member comprises a non-metallic portion, and the ground strap comprises a metallic portion.
摘要翻译: 本发明的实施例提供一种集成电路结构,包括:基板; 屏蔽结构,其包括形成在所述基板上的屏蔽构件和接地带,其中所述屏蔽构件包括非金属部分,并且所述接地带包括金属部分。
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