Diffusion bonding heat exchanger
    1.
    发明授权

    公开(公告)号:US12092401B2

    公开(公告)日:2024-09-17

    申请号:US17295928

    申请日:2019-11-20

    IPC分类号: F28F9/26 F28D9/00

    摘要: An object of the present invention is to provide a diffusion bonding heat exchanger with which it is possible to reduce a thermal stress that is generated due to heat exchange between fluids significantly different from each other in temperature even in a case where the number of stacked heat transfer plates is made large. A diffusion bonding heat exchanger (100) includes a core (1) in which a plurality of heat transfer plates (HP) are stacked and diffusion-bonded to each other. The core includes a plurality of flow path blocks (40) each of which is configured to include a plurality of flow path layers (30) and a partition wall layer (50) that divides the plurality of flow path blocks. A thickness (t3) of the partition wall layer in a stacking direction is larger than an interval (t2) between flow paths arranged in the stacking direction.

    Heat exchanger
    3.
    发明授权

    公开(公告)号:US11022376B2

    公开(公告)日:2021-06-01

    申请号:US16339453

    申请日:2016-10-07

    摘要: A heat exchanger includes a first flow path through which a first fluid flows, a second flow path through which a second fluid flows, and an adjustment layer disposed between the first flow path and the second flow path adjacent to each other and that adjusts an amount of heat exchange between the first flow path and the second flow path. The adjustment layer includes a first portion and a second portion having a heat transfer performance lower than that of the first portion, and has a heat transfer performance varied depending on a position in the adjustment layer.