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公开(公告)号:US20150357180A1
公开(公告)日:2015-12-10
申请号:US14734693
申请日:2015-06-09
IPC分类号: H01L21/02 , H01L21/306
CPC分类号: H01L21/02052 , H01L21/02024
摘要: Methods for cleaning semiconductor substrates with cleaning baths including ammonium hydroxide, hydrogen peroxide and a non-ionic surfactant are disclosed. The methods may result in reduced re-adhesion of released particles during cleaning which produces cleaner substrates.
摘要翻译: 公开了使用包括氢氧化铵,过氧化氢和非离子表面活性剂的清洗浴来清洗半导体衬底的方法。 这些方法可能导致在清洁期间释放的颗粒的再附着减少,这产生更清洁的基底。