公开(公告)号：US20090140761A1

公开(公告)日：2009-06-04

申请号：US12255850

申请日：2008-10-22

申请人： Sung-Ok KIM ,  Ae-Yong CHUNG ,  Se-Rae CHO ,  Chul-Min LEE ,  Eun-Seok LEE

发明人： Sung-Ok KIM ,  Ae-Yong CHUNG ,  Se-Rae CHO ,  Chul-Min LEE ,  Eun-Seok LEE

IPC分类号： G01R31/26

CPC分类号： G01R31/01 ,  G01R31/2894 ,  G01R31/31718

摘要： A method of testing a semiconductor device, which can reduce a period of time for testing a packaged semiconductor chip. First, semiconductor chips to be tested are classified in a lot unit. The semiconductor chips are fist tested in units of lots. The defective semiconductor chips among the semiconductor chips of a predetermined number of lots that are first time tested are collectively retested. First test data regarding the semiconductor chips may be classified and stored for each respective lot. Retest data regarding the semiconductor chips may be classified and stored for each respective lot. Test data regarding the semiconductor chips may be classified and stored into first test data and retest data for each respective lot.

摘要翻译： 一种测试半导体器件的方法，其可以减少用于测试封装的半导体芯片的时间段。 首先，要测试的半导体芯片分为多个单元。 半导体芯片以单位批量进行了测试。 首次测试的预定数量批次的半导体芯片中的有缺陷的半导体芯片被集体重新测试。 关于半导体芯片的第一测试数据可以针对每个批次进行分类和存储。 关于半导体芯片的重新测试数据可以针对每个批次进行分类和存储。 可以将关于半导体芯片的测试数据分类并存储到第一测试数据中并且对于每个批次重新测试数据。