摘要:
A silicon direct bonding (SDB) method by which void formation caused by gases is suppressed. The SDB method includes: preparing two silicon substrates having corresponding bonding surfaces; forming trenches having a predetermined depth in at least one bonding surface of the two silicon substrates; forming gas discharge outlets connected to the trenches on at least one of the two silicon substrates to vertically penetrate the bonding surface; cleaning the two silicon substrates; closely contacting the two silicon substrates to each other; and thermally treating the two substrates to bond them to each other. The trenches are formed along at least a part of a plurality of dicing lines, and both ends of the trenches are clogged. Gases generated during a thermal treatment process can be smoothly and easily discharged through the trenches and the gas discharge outlet such that a void is prevented from being formed in the junctions of the two silicon substrates due to the gases.
摘要:
A silicon direct bonding (SDB) method by which void formation caused by gases is suppressed. The SDB method includes: preparing two silicon substrates having corresponding bonding surfaces; forming trenches having a predetermined depth in at least one bonding surface of the two silicon substrates; forming gas discharge outlets connected to the trenches on at least one of the two silicon substrates to vertically penetrate the bonding surface; cleaning the two silicon substrates; closely contacting the two silicon substrates to each other; and thermally treating the two substrates to bond them to each other. The trenches are formed along at least a part of a plurality of dicing lines, and both ends of the trenches are clogged. Gases generated during a thermal treatment process can be smoothly and easily discharged through the trenches and the gas discharge outlet such that a void is prevented from being formed in the junctions of the two silicon substrates due to the gases.
摘要:
A silicon direct bonding method including preparing two silicon substrates having corresponding bonding surfaces, forming a trench in at least one bonding surface of the two silicon substrates, and thermally bonding the two silicon substrates to one another. The trench may be along a dicing line. The trench may communicate with an outer edge of the bonded substrates.
摘要:
A piezoelectric actuator of an inkjet head and a method of forming the piezoelectric actuator. The piezoelectric actuator is formed on a vibration plate to provide a driving force to each of a plurality of pressure chambers. The piezoelectric actuator includes a lower electrode formed on the vibration plate, a piezoelectric layer formed on the lower electrode at a position corresponding to each of the pressure chambers, a supporting pad formed on the lower electrode, the supporting pad contacting one end of the piezoelectric layer and extending away from the one end of the piezoelectric layer, and an upper electrode extending from a top surface of the piezoelectric layer to a top surface of the supporting pad. The upper electrode is bonded to a driving circuit above the supporting pad to receive a voltage from the driving circuit. The piezoelectric layer may have substantially the same length as the pressure chamber. The supporting pad may be formed of a photosensitive polymer and may have substantially the same height as the piezoelectric layer. The upper electrode may include a first portion formed on the piezoelectric layer and a second portion formed on the supporting pad, and the second portion may be wider than the first portion.
摘要:
A method of forming nozzles in an inkjet printhead including forming ink inlets in a first surface of a substrate, polishing a second surface of the substrate after the forming of the ink inlets, and forming ink outlets in the second surface of the substrate after the polishing of the second surface, the ink outlets communicating with the ink inlets.
摘要:
A method of forming a piezoelectric actuator of an inkjet head formed on a vibrating plate to provide a driving power for ejecting ink to each of pressure chambers is provided. The method includes forming a lower electrode on a vibrating plate, forming a piezoelectric layer on the lower electrode to be located above each of pressure chambers, forming a protecting layer covering the lower electrode and the piezoelectric layer, exposing an upper surface of the piezoelectric layer by decreasing a thickness of the protecting layer and the piezoelectric layer, forming an upper electrode on the upper surface of the piezoelectric layer, removing the protecting layer. According to the present invention, since the piezoelectric layer having a flat upper surface is formed in uniform figure, area and thickness of the upper electrode formed thereon is uniformly controlled.
摘要:
A piezoelectric ink-jet printhead and a method for manufacturing the same, wherein the piezoelectric ink-jet printhead is formed by stacking three monocrystalline silicon substrates on one another and adhering them to one another. The three substrates include an upper substrate, through which an ink supply hole is formed and a pressure chamber is formed on a bottom surface thereof; an intermediate substrate, in which an ink reservoir and a damper are formed; and a lower substrate, in which a nozzle is formed. A piezoelectric actuator is monolithically formed on the upper substrate. A restrictor, which connects the ink reservoir to the pressure chamber in flow communication, may be formed on the upper substrate or intermediate substrate.
摘要:
A method of forming a piezoelectric actuator on a vibration plate to provide a driving force to each of a plurality of pressure chambers includes forming a lower electrode on the vibration plate, forming a piezoelectric layer on the lower electrode at a position corresponding to each of the pressure chambers, forming a supporting pad on the lower electrode, the supporting pad contacting one end of the piezoelectric layer and extending away from the one end of the piezoelectric layer, forming an upper electrode extending from a top surface of the piezoelectric layer to a top surface of the supporting pad, and bonding the upper electrode to a driving circuit above the supporting pad to receive a voltage from the driving circuit.
摘要:
A piezoelectric actuator of an inkjet head and a method of forming the piezoelectric actuator. The piezoelectric actuator is formed on a vibration plate to provide a driving force to each of a plurality of pressure chambers. The piezoelectric actuator includes a lower electrode formed on the vibration plate, a piezoelectric layer formed on the lower electrode at a position corresponding to each of the pressure chambers, a supporting pad formed on the lower electrode, the supporting pad contacting one end of the piezoelectric layer and extending away from the one end of the piezoelectric layer, and an upper electrode extending from a top surface of the piezoelectric layer to a top surface of the supporting pad. The upper electrode is bonded to a driving circuit above the supporting pad to receive a voltage from the driving circuit. The piezoelectric layer may have substantially the same length as the pressure chamber. The supporting pad may be formed of a photosensitive polymer and may have substantially the same height as the piezoelectric layer. The upper electrode may include a first portion formed on the piezoelectric layer and a second portion formed on the supporting pad, and the second portion may be wider than the first portion.
摘要:
In a piezoelectric ink-jet printhead, and a method of manufacturing a nozzle plate, the piezoelectric ink-jet printhead includes a flow path plate having an ink flow path including pressure chambers to be filled with ink to be ejected, a piezoelectric actuator formed on an upper surface of the flow path plate and for supplying a driving force for ink ejection to the pressure chambers, and a nozzle plate bonded to a lower surface of the flow path plate including nozzles for ejecting ink from the pressure chambers bored through the nozzle plate. The printhead may further include a heater formed on a lower surface of the nozzle plate for heating ink in the ink flow path and/or a temperature detector formed on a lower surface of the nozzle plate or on an upper surface of the flow path plate.