COOLING MODULE
    1.
    发明申请

    公开(公告)号:US20220272878A1

    公开(公告)日:2022-08-25

    申请号:US17541370

    申请日:2021-12-03

    IPC分类号: H05K7/20 F28F9/00 F28F9/007

    摘要: A cooling module includes a first casing, a second casing, and a cooling unit. The first casing includes a lower chamber filled with at least one working fluid. The first casing includes a heat source connecting face. The second casing includes an upper chamber. The cooling unit is located between the first and second casings. The cooling unit includes a plurality of tubes. Each of the plurality of tubes includes an end intercommunicating with the lower chamber and another end intercommunicating with the upper chamber, thereby the lower and upper chambers intercommunicate with each other. A plurality of cooling fin units is coupled to outer peripheries of the plurality of tubes. An angle between each of the plurality of tubes and the heat source connecting face is larger than 0° and smaller than 90°, or each of the plurality of tubes is parallel to the heat source connecting face.

    CEILING FAN MOTOR
    2.
    发明申请
    CEILING FAN MOTOR 审中-公开

    公开(公告)号:US20190267873A1

    公开(公告)日:2019-08-29

    申请号:US16410074

    申请日:2019-05-13

    摘要: A ceiling fan motor with a reduced height includes a stator, a rotor and a circuit unit. The stator includes an iron core and a shaft. The iron core has an assembly hole. The shaft is non-rotatable and extends through the assembly hole in an extending direction. The rotor is rotatably coupled with an outer periphery of the shaft and has a housing. The rotor rotates about the shaft. The circuit unit is arranged between the iron core and the housing of the rotor in a radial direction of the shaft perpendicular to the extending direction of the shaft. The housing delimits a compartment where the stator and the circuit unit are received.

    IMMERSION COOLING SYSTEM
    3.
    发明申请

    公开(公告)号:US20220264768A1

    公开(公告)日:2022-08-18

    申请号:US17536267

    申请日:2021-11-29

    IPC分类号: H05K7/20

    摘要: An immersion cooling system includes a sealed tank having a chamber. A circulating layer and a working layer are respectively formed by first and second working liquids filled in the chamber and are contiguous to each other. The boiling point of the second working liquid is higher than that of the first working liquid. The density of the second working liquid is lower than that of the first working liquid. The first and second working liquids do not dissolve in each other. A circulating cooling module includes a circulating pipeline having first and second ports located in the chamber. The circulating pipeline also has a heat absorbing section and a condensation section located between the first and second ports. The heat absorbing section is located in the working layer. The first working liquid flows into the circulating pipeline from the first port and circulates in the circulating pipeline.