公开(公告)号：US20030146464A1

公开(公告)日：2003-08-07

申请号：US10072656

申请日：2002-02-07

Applicant: Superconductor Technologies, Inc.

Inventor： Eric M. Prophet

IPC: H01L027/108 ,  H01L029/76 ,  H01L029/94 ,  H01L031/119

CPC classification number: B81B3/001 ,  B81C2201/112 ,  H01L29/66181

Abstract: The present invention alleviates stiction between a suspended beam or microstructure and an underlying substrate by providing a patterned passivation layer on the substrate underneath the beam. The passivation layer is patterned to provide a substrate surface that differs substantially from the bottom surface of the beam. The difference between these two surfaces reduces the potential contact area between the beam and the substrate when the beam is pulled down, thereby reducing adhesive forces between the beam and the substrate and reducing the likelihood of stiction. In one embodiment, the passivation layer is patterned to form a substrate surface comprising a plurality of protuberances. In another embodiment, the passivation layer is patterned to form a substrate surface having a mesh pattern.

Abstract translation: 本发明通过在光束下方的衬底上提供图案化的钝化层来减轻悬挂梁或微结构和下层衬底之间的粘结。 钝化层被图案化以提供基本上与梁的底表面不同的衬底表面。 这两个表面之间的差异减小了当光束被拉下时光束和基板之间的潜在接触面积，从而减小光束与基板之间的粘合力，并降低粘结的可能性。 在一个实施例中，钝化层被图案化以形成包括多个突起的衬底表面。 在另一个实施例中，对钝化层进行图案化以形成具有网格图案的衬底表面。