公开(公告)号：US20080170379A1

公开(公告)日：2008-07-17

申请号：US11622870

申请日：2007-01-12

申请人： Suresh Basoor ,  Wai Ming Beh ,  Wee Sin Tan ,  Park Hong Yee

发明人： Suresh Basoor ,  Wai Ming Beh ,  Wee Sin Tan ,  Park Hong Yee

IPC分类号： H05K9/00

CPC分类号： H05K9/0058

摘要： An apparatus having a die, a carrier, and a plurality of shielding wires. The die has a top surface through which EMI is received. The carrier has a first surface on which the die is mounted by attaching the die to the first surface using a surface of the die other than the top surface. The carrier also includes a plurality of electrical traces, the die being connected to two of the traces. The shielding wires cross the top surface of the die and are connected to a shielding trace in the carrier. The shielding trace is held at a constant potential. The shielding wires are positioned such that the EMI received by the die is reduced below the level that would be received without the shielding wires. The die could include a light detector.

摘要翻译： 具有管芯，载体和多个屏蔽线的装置。 模具具有接收EMI的顶表面。 载体具有第一表面，模具安装在该第一表面上，所述第一表面通过使用除了顶表面之外的模具的表面将模具附接到第一表面。 载体还包括多个电迹线，该管芯连接到两个迹线。 屏蔽线穿过管芯的顶表面并连接到载体中的屏蔽迹线。 屏蔽迹线保持恒定电位。 屏蔽线被定位成使得由芯片接收的EMI降低到低于未被屏蔽线接收的电平。 模具可以包括光检测器。