公开(公告)号：US20080170379A1

公开(公告)日：2008-07-17

申请号：US11622870

申请日：2007-01-12

申请人： Suresh Basoor ,  Wai Ming Beh ,  Wee Sin Tan ,  Park Hong Yee

发明人： Suresh Basoor ,  Wai Ming Beh ,  Wee Sin Tan ,  Park Hong Yee

IPC分类号： H05K9/00

CPC分类号： H05K9/0058

摘要： An apparatus having a die, a carrier, and a plurality of shielding wires. The die has a top surface through which EMI is received. The carrier has a first surface on which the die is mounted by attaching the die to the first surface using a surface of the die other than the top surface. The carrier also includes a plurality of electrical traces, the die being connected to two of the traces. The shielding wires cross the top surface of the die and are connected to a shielding trace in the carrier. The shielding trace is held at a constant potential. The shielding wires are positioned such that the EMI received by the die is reduced below the level that would be received without the shielding wires. The die could include a light detector.

摘要翻译： 具有管芯，载体和多个屏蔽线的装置。 模具具有接收EMI的顶表面。 载体具有第一表面，模具安装在该第一表面上，所述第一表面通过使用除了顶表面之外的模具的表面将模具附接到第一表面。 载体还包括多个电迹线，该管芯连接到两个迹线。 屏蔽线穿过管芯的顶表面并连接到载体中的屏蔽迹线。 屏蔽迹线保持恒定电位。 屏蔽线被定位成使得由芯片接收的EMI降低到低于未被屏蔽线接收的电平。 模具可以包括光检测器。

公开(公告)号：US20060016994A1

公开(公告)日：2006-01-26

申请号：US10896829

申请日：2004-07-22

申请人： Suresh Basoor ,  Peng Ng ,  Wee Tan ,  Wong Loong

发明人： Suresh Basoor ,  Peng Ng ,  Wee Tan ,  Wong Loong

IPC分类号： G01J5/00

CPC分类号： H03K17/9631 ,  G01V8/12 ,  H03K17/941 ,  H03K2217/94108 ,  H03K2217/96015

摘要： According to at least one embodiment of the invention, a method includes mounting a transmitting device and a receiving device on a circuit board, wherein the circuit board includes a layer that blocks waves (e.g., light waves) emitted from the transmitting device, and wherein the transmitting device and the receiving device are mounted in an area defined by the layer. The method further includes manipulating a structure to form a first compartment for the transmitting device and a second compartment for the receiving device, wherein the compartments are separated by a common wall such that each compartment is continuous with at least part of the common wall. The method further comprises mounting the structure on the circuit board. According to this embodiment, the transmitter and the receiver may be part of a proximity sensor, and the layer that blocks waves, the first and second compartments, and the common wall (which may be a folded double wall) operate to prevent cross-talk between the transmitter and the receiver.

摘要翻译： 根据本发明的至少一个实施例，一种方法包括将发送装置和接收装置安装在电路板上，其中电路板包括阻挡从发送装置发射的波（例如，光波）的层，并且其中 发送装置和接收装置安装在由该层限定的区域中。 该方法还包括操纵结构以形成用于传送装置的第一隔室和用于接收装置的第二隔室，其中隔室由公共壁隔开，使得每个隔室与公共墙壁的至少一部分连续。 该方法还包括将该结构安装在电路板上。 根据该实施例，发射器和接收器可以是接近传感器的一部分，并且阻挡波的层，第一和第二隔室以及公共壁（其可以是折叠的双壁）操作以防止串扰 在发射机和接收机之间。

公开(公告)号：US20090159900A1

公开(公告)日：2009-06-25

申请号：US11962535

申请日：2007-12-21

申请人： Suresh Basoor ,  Peng Yam Ng ,  Deng Peng Chen

发明人： Suresh Basoor ,  Peng Yam Ng ,  Deng Peng Chen

IPC分类号： H01L33/00 ,  H01L21/71

CPC分类号： G01S17/026 ,  G01S7/4813 ,  H01L24/48 ,  H01L2224/48 ,  H01L2924/00014 ,  H01L2924/12043 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： Disclosed are various embodiments of an infrared proximity sensor package comprising an infrared transmitter die, an infrared receiver die, a housing comprising outer sidewalls, a first recess, a second recess and a partitioning divider disposed between the first and second recesses. The transmitter doe is positioned in the first recess, the receiver die is positioned within the second recess, and at least the partitioning divider of the housing comprises liquid crystal polymer (LCP) such that infrared light internally-reflected within the housing in the direction of the partitioning divider is substantially attenuated or absorbed by the LCP contained therein.

摘要翻译： 公开了红外接近传感器封装的各种实施例，其包括红外发射器管芯，红外接收器管芯，包括外侧壁的壳体，第一凹部，第二凹部和布置在第一凹部和第二凹部之间的分隔分隔件。 发射器臂定位在第一凹部中，接收器模具定位在第二凹槽内，并且壳体的至少隔离分隔件包括液晶聚合物（LCP），使得在壳体内部反射的红外光沿着 分隔分隔器被其中包含的LCP基本上衰减或吸收。

公开(公告)号：US08217482B2

公开(公告)日：2012-07-10

申请号：US11962535

申请日：2007-12-21

申请人： Suresh Basoor ,  Peng Yam Ng ,  Deng Peng Chen

发明人： Suresh Basoor ,  Peng Yam Ng ,  Deng Peng Chen

IPC分类号： H01L31/0232 ,  H01L21/00

CPC分类号： G01S17/026 ,  G01S7/4813 ,  H01L24/48 ,  H01L2224/48 ,  H01L2924/00014 ,  H01L2924/12043 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： Disclosed are various embodiments of an infrared proximity sensor package comprising an infrared transmitter die, an infrared receiver die, a housing comprising outer sidewalls, a first recess, a second recess and a partitioning divider disposed between the first and second recesses. The transmitter die is positioned in the first recess, the receiver die is positioned within the second recess, and at least the partitioning divider of the housing comprises liquid crystal polymer (LCP) such that infrared light internally-reflected within the housing in the direction of the partitioning divider is substantially attenuated or absorbed by the LCP contained therein.

摘要翻译： 公开了红外接近传感器封装的各种实施例，其包括红外发射器管芯，红外接收器管芯，包括外侧壁的壳体，第一凹部，第二凹部和布置在第一凹部和第二凹部之间的分隔分隔件。 发射器管芯位于第一凹部中，接收器管芯位于第二凹槽内，并且壳体的至少隔离分隔件包括液晶聚合物（LCP），使得在壳体内部反射的红外光沿着 分隔分隔器被其中包含的LCP基本上衰减或吸收。

公开(公告)号：US20060045530A1

公开(公告)日：2006-03-02

申请号：US10930578

申请日：2004-08-31

申请人： Sin Lim ,  Wee Tan ,  Peng Ng ,  Suresh Basoor ,  Kuldeep Saxena

发明人： Sin Lim ,  Wee Tan ,  Peng Ng ,  Suresh Basoor ,  Kuldeep Saxena

IPC分类号： H04B10/00

CPC分类号： H04B10/43 ,  H01L2224/48091 ,  H01L2224/48247 ,  H05K1/181 ,  H05K2201/10121 ,  H05K2203/1572 ,  Y02P70/611 ,  H01L2924/00014

摘要： An optical transceiver includes a substrate having first and second sides. A light emitter mounted to the first side. A light receiver is mounted to the first side and comprises a dielectric totally internally reflecting concentrator directing light to a photodetector. Amplification circuits are mounted to the second side and are electrically connected to the light emitter and the light receiver through the substrate. The light emitter and the light receiver are housed in separate molded housings. A DTIRC is used to provide a good link distance and a wide field of view.

摘要翻译： 光收发器包括具有第一和第二侧面的基板。 安装在第一侧的发光体。 光接收器安装到第一侧，并且包括将光引导到光电检测器的电介质全内反射集中器。 放大电路安装到第二侧，并通过基板与发光体和光接收器电连接。 光发射器和光接收器容纳在单独的模制外壳中。 DTIRC用于提供良好的链路距离和广泛的视野。