Heat treatment method and components treated according to the method
    5.
    发明授权
    Heat treatment method and components treated according to the method 有权
    按照该方法处理的热处理方法和组分

    公开(公告)号:US08668790B2

    公开(公告)日:2014-03-11

    申请号:US11620884

    申请日:2007-01-08

    IPC分类号: C22F1/10 C21D6/02

    摘要: Disclosed herein is a method of treating a component comprising solution treating the component for a period of about 4 to about 10 hours at a temperature of about 1750 to about 1850° F.; cooling the component to a temperature of about 1490 to about 1520° F. at an average rate of 1° F./min to about 25° F./min; stabilizing the component at about 1450 to about 1520° F. for a period of from about 1 to about 10 hours; cooling the component to room temperature; precipitation aging the component by heating the component to a first precipitation aging temperature of about 1275 to about 1375° F. for about 3 to about 15 hours; cooling the component at an average rate of 50 to about 150° F./hour to a second precipitation aging temperature of about 1100 to about 1200° F. for a time period of about 2 to about 15 hours; and cooling the component.

    摘要翻译: 本文公开了一种处理组分的方法,所述组分包括在约1750至约1850°F的温度下处理该组分约4至约10小时的溶液; 以约1°F / min至约25°F / min的平均速率将组分冷却至约1490至约1520°F的温度; 将组分稳定在约1450至约1520°F约1至约10小时; 将组分冷却至室温; 通过将组分加热至约1275至约1375°F的第一沉淀熟化温度,使组分沉淀老化约3至约15小时; 将组分以50至150°F /小时的平均速率冷却至约1100至约1200°F的第二沉淀时效温度约2至约15小时; 并冷却组件。

    Heat Treatment Method and Components Treated According to the Method
    6.
    发明申请
    Heat Treatment Method and Components Treated According to the Method 有权
    根据该方法处理的热处理方法和部件

    公开(公告)号:US20080163963A1

    公开(公告)日:2008-07-10

    申请号:US11620897

    申请日:2007-01-08

    IPC分类号: C21D1/18

    CPC分类号: C21D1/18 F01D5/02

    摘要: Disclosed herein is a method of treating a component comprising solution treating the component for a period of about 4 to about 10 hours at a temperature of about 1750 to about 1850° F.; cooling the component to a temperature of about 1580 to about 1650° F. at an average rate of 1° F./min to about 25° F./min; stabilizing the component at about 1580 to about 1650° F. for a period of about 1 to about 10 hours; cooling the component to room temperature; precipitation aging the component at a first precipitation aging temperature of about 1275 to about 1375° F. for about 3 to about 15 hours; cooling the component at an average rate of 50 to about 150° F./hour to a second precipitation aging temperature of about 1100 to about 1200° F. for a time period of about 2 to about 15 hours; and cooling the component.

    摘要翻译: 本文公开了一种处理组分的方法,所述组分包括在约1750至约1850°F的温度下处理该组分约4至约10小时的溶液; 以约1°F / min至约25°F / min的平均速率将组分冷却至约1580至约1650°F的温度; 将组分稳定在约1580至约1650°F约1至约10小时; 将组分冷却至室温; 在约1275至约1375°F的第一沉淀老化温度下使组分沉淀老化约3至约15小时; 将组分以50至150°F /小时的平均速率冷却至约1100至约1200°F的第二沉淀时效温度约2至约15小时; 并冷却组件。

    Heat treatment method and components treated according to the method
    7.
    发明授权
    Heat treatment method and components treated according to the method 有权
    按照该方法处理的热处理方法和组分

    公开(公告)号:US08663404B2

    公开(公告)日:2014-03-04

    申请号:US11620897

    申请日:2007-01-08

    IPC分类号: C22F1/10 C21D6/02

    CPC分类号: C21D1/18 F01D5/02

    摘要: Disclosed herein is a method of treating a component comprising solution treating the component for a period of about 4 to about 10 hours at a temperature of about 1750 to about 1850°F.; cooling the component to a temperature of about 1580 to about 1650°F. at an average rate of 1°F./min to about 25°F./min; stabilizing the component at about 1580 to about 1650°F. for a period of about 1 to about 10 hours; cooling the component to room temperature; precipitation aging the component at a first precipitation aging temperature of about 1275 to about 1375°F. for about 3 to about 15 hours; cooling the component at an average rate of 50 to about 150°F./hour to a second precipitation aging temperature of about 1100 to about 1200°F. for a time period of about 2 to about 15 hours; and cooling the component.

    摘要翻译: 本文公开了一种处理组分的方法,所述组分包括在约1750至约1850°F的温度下处理该组分约4至约10小时的溶液; 将组分冷却至约1580至约1650°F的温度。 平均速率为1°F / min至约25°F / min; 使组分稳定在约1580至约1650°F。 约1至约10小时; 将组分冷却至室温; 在第一降水老化温度约1275至约1375°F时沉淀老化组分。 约3至15小时; 将组分以50至150°F /小时的平均速率冷却至约1100至约1200°F的第二沉淀时效温度。 时间约2至15小时; 并冷却组件。

    Heat Treatment Method and Components Treated According to the Method
    8.
    发明申请
    Heat Treatment Method and Components Treated According to the Method 有权
    根据该方法处理的热处理方法和部件

    公开(公告)号:US20100276041A1

    公开(公告)日:2010-11-04

    申请号:US11620884

    申请日:2007-01-08

    IPC分类号: C22F1/00 C21D1/00 C22F1/10

    摘要: Disclosed herein is a method of treating a component comprising solution treating the component for a period of about 4 to about 10 hours at a temperature of about 1750 to about 1850° F.; cooling the component to a temperature of about 1490 to about 1520° F. at an average rate of 1° F./min to about 25° F./min; stabilizing the component at about 1450 to about 1520° F. for a period of from about 1 to about 10 hours; cooling the component to room temperature; precipitation aging the component by heating the component to a first precipitation aging temperature of about 1275 to about 1375° F. for about 3 to about 15 hours; cooling the component at an average rate of 50 to about 150° F./hour to a second precipitation aging temperature of about 1100 to about 1200° F. for a time period of about 2 to about 15 hours; and cooling the component.

    摘要翻译: 本文公开了一种处理组分的方法,所述组分包括在约1750至约1850°F的温度下处理该组分约4至约10小时的溶液; 以约1°F / min至约25°F / min的平均速率将组分冷却至约1490至约1520°F的温度; 将组分稳定在约1450至约1520°F约1至约10小时; 将组分冷却至室温; 通过将组分加热至约1275至约1375°F的第一沉淀熟化温度,使组分沉淀老化约3至约15小时; 将组分以50至150°F /小时的平均速率冷却至约1100至约1200°F的第二沉淀时效温度约2至约15小时; 并冷却组件。