公开(公告)号：US09839136B2

公开(公告)日：2017-12-05

申请号：US15250595

申请日：2016-08-29

Applicant: TAIMIDE TECHNOLOGY INCORPORATION

Inventor： Paul S. C. Wu ,  Chun-Ting Lai ,  Yen-Po Huang ,  Sheng-Yu Huang

IPC: H05K1/00 ,  H05K3/00 ,  H05K3/02 ,  H05K3/28

CPC classification number: H05K3/007 ,  H05K3/022 ,  H05K3/281 ,  H05K2201/0154 ,  H05K2203/0264

Abstract: The present disclosure relates, according to some embodiments, to the fabrication of a flexible circuit board, which includes forming a base layer comprising polyimide, forming a polyimide layer on the base layer, the polyimide layer having a first surface and a second surface opposite to each other, the first surface being peelably adhered in contact with the base layer, forming a metal layer on the second surface of the polyimide layer, and peeling the base layer from the polyimide layer with the metal layer remaining on the second surface of the polyimide layer.