公开(公告)号：US20240377434A1

公开(公告)日：2024-11-14

申请号：US18196665

申请日：2023-05-12

Applicant: TAIWAN MASK CORPORATION

Inventor： SHANG-KUANG WU ,  YU-TSUNG FU ,  MING-WEI HUANG

IPC: G01R1/073 ,  B81B1/00 ,  G01R1/067

Abstract: A micro-electromechanical system (MEMS) probe module structure is provided, including: a ceramic carrier and a plurality of probes fixed on the ceramic carrier; the ceramic carrier has a top surface, a side surface, and a bottom surface, and a window in the center; the ceramic carrier is provided with a plurality of lead wires, each lead wires are distributed on the top surface, the side surface and the bottom surface and connected together; the bottom surface is provided with a plurality of bonding areas, and each lead wire is connected to a corresponding bonding area; each of the probes includes a needle tip and the needle arm, the needle tup is arranged at one end of the needle arm, and the needle arm is welded to the bonding area, so that the needle arm extends below the window like a cantilever and the needle tip faces downward.

公开(公告)号：US20240174512A1

公开(公告)日：2024-05-30

申请号：US17994471

申请日：2022-11-28

Applicant: TAIWAN MASK CORPORATION

Inventor： SHANG-KUANG WU ,  YU-TSUNG FU ,  MING-WEI HUANG

IPC: B81C1/00

CPC classification number: B81C1/00055 ,  B81C2201/0133 ,  B81C2201/0142 ,  B81C2201/0159

Abstract: A MEMS probe and manufacturing method thereof are provided. The method is mainly to form connected first-level, second-level, and third-level pin grooves on both sides of the silicon substrate through an etching process, followed by two electroplating processes to deposit nickel-cobalt-phosphorus alloy in the first-level pin groove to form the tip of the microprobe, and to deposit nickel-cobalt alloy in the second-level pin groove and the third-level pin to form the pin head and pin arm, thereby forming a three-level microprobe. A circuit substrate made of ceramic material is disposed with at least one window, the surface of the circuit substrate adjacent to the window is provided with a plurality of circuit pads, and the circuit substrate is abutted to the pin arm of the microprobe. The silicon substrate is then removed, to form a plurality of cantilever microprobes made of nickel-cobalt-phosphorus alloy and nickel-cobalt alloy on the circuit substrate.