公开(公告)号：US11081444B2

公开(公告)日：2021-08-03

申请号：US16207041

申请日：2018-11-30

Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.

Inventor： Chiao-Han Lee ,  Hsien-Yuan Liao ,  Ying-Ta Lu ,  Chi-Hsien Lin ,  Ho-Hsiang Chen ,  Tzu-Jin Yeh

IPC: H01L23/522 ,  H01L49/02 ,  H01L23/58 ,  H01L23/528 ,  H01L23/00 ,  H01L23/64

Abstract: An integrated circuit includes an inductor over a substrate and a guard ring surrounding the inductor. The guard ring includes a first staggered line, a first metal line extending in a first direction and a second metal line extending in a second direction different from the first direction. The first staggered line has a first end coupled to the first metal line, and a second end coupled to the second metal line. The first staggered line includes a first set of vias, a first set of metal lines in a first metal layer and a second set of metal lines in a second metal layer different from the first metal layer. The first set of vias coupling the first set of metal lines with the second of second metal lines.

公开(公告)号：US10163779B2

公开(公告)日：2018-12-25

申请号：US14303206

申请日：2014-06-12

Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.

Inventor： Chiao-Han Lee ,  Hsien-Yuan Liao ,  Ying-Ta Lu ,  Chi-Hsien Lin ,  Ho-Hsiang Chen ,  Tzu-Jin Yeh

IPC: H01L23/528 ,  H01L23/00 ,  H01L23/58 ,  H01L23/64 ,  H01L23/522 ,  H01L49/02

Abstract: An integrated circuit comprises an inductor over a substrate and a guard ring surrounding the inductor. The guard ring comprises a plurality of first metal lines extending in a first direction and a plurality of second metal lines extending in a second direction. The second metal lines of the plurality of second metal lines are each coupled with at least one first metal line of the plurality of first metal lines. The guard ring also comprises a staggered line comprising a connected subset of at least one first metal line of the plurality of first metal lines and at least one second metal line of the plurality of second metal lines. The first metal lines of the plurality of first metal lines outside of the connected subset, the second metal lines of the plurality of second metal lines outside of the connected subset, and the staggered line surround the inductor.

公开(公告)号：US11817385B2

公开(公告)日：2023-11-14

申请号：US17389795

申请日：2021-07-30

Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.

Inventor： Chiao-Han Lee ,  Chi-Hsien Lin ,  Ho-Hsiang Chen ,  Hsien-Yuan Liao ,  Tzu-Jin Yeh ,  Ying-Ta Lu

IPC: H01L23/522 ,  H01L23/58 ,  H01L23/64 ,  H01L49/02 ,  H01L23/528 ,  H01L23/00

CPC classification number: H01L23/5227 ,  H01L23/528 ,  H01L23/5286 ,  H01L23/562 ,  H01L23/585 ,  H01L23/645 ,  H01L28/10 ,  H01L2924/0002 ,  H01L2924/0002 ,  H01L2924/00

Abstract: An integrated circuit includes an inductor that includes a first set of conductive lines in a first metal layer, and is over a substrate, and a guard ring. The guard ring includes a first conductive line in a second metal layer, and extending in a first direction, a second conductive line extending in a second direction, and a first staggered line coupled between the first conductive line and the second conductive line. The first staggered line includes a second set of conductive lines in the second metal layer, and extends in the first direction, a third set of conductive lines in a third metal layer, and extends in the second direction, and a first set of vias coupling the second and third set of conductive lines together. All metal lines in the third metal layer that are part of the guard ring extend in the second direction.