公开(公告)号：US20230375952A1

公开(公告)日：2023-11-23

申请号：US18231416

申请日：2023-08-08

Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.

Inventor： Yu-Chih HUANG ,  Yu-Kai CHIOU ,  Chieh-Jen CHENG ,  Li-Jui CHEN

IPC: G03F7/00

CPC classification number: G03F7/70925

Abstract: Cleaning equipment for an EUV wafer chuck or clamp, which removes particles that have accumulated between burls on the surface of the wafer chuck. The equipment includes a spinning bi-polar electrode placed in proximity to the surface, which can attract and adsorb the charged particle residue therefrom using its generated symmetric electric field when the wafer chuck is not in use.

公开(公告)号：US20230305381A1

公开(公告)日：2023-09-28

申请号：US17833823

申请日：2022-06-06

Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.

Inventor： Wei-Shuo SU ,  Yu-Tse LAI ,  Sheng-Min WANG ,  Ken-Hsien HSIEH ,  Chieh-Jen CHENG ,  Ya Hui CHANG

IPC: G03F1/24 ,  G03F1/42

CPC classification number: G03F1/24 ,  G03F1/42

Abstract: A photo mask for an extreme ultraviolet (EUV) lithography includes a mask alignment mark for aligning the photo mask to an EUV lithography tool, and sub-resolution assist patterns disposed around the mask alignment mark. A dimension of the sub-resolution assist patterns is in a range from 10 nm to 50 nm.

公开(公告)号：US20220308465A1

公开(公告)日：2022-09-29

申请号：US17487006

申请日：2021-09-28

Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.

Inventor： Yu-Chih HUANG ,  Yu-Kai CHIOU ,  Chieh-Jen CHENG ,  Li-Jui CHEN

IPC: G03F7/20

Abstract: Cleaning equipment for an EUV wafer chuck or clamp, which removes particles that have accumulated between burls on the surface the wafer chuck. The equipment includes a spinning bi-polar electrode placed in proximity to the surface, which can attract and adsorb the charged particle residue therefrom using its generated symmetric electric field when the wafer chuck is not in use.