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公开(公告)号：US11720035B2
公开(公告)日：2023-08-08
申请号：US17459749
申请日：2021-08-27
发明人： Chih-Ping Yen , Yen-Shuo Su , Jui-Pin Wu , Chun-Lin Chang , Han-Lung Chang , Heng-Hsin Liu
CPC分类号： G03F7/70925 , G03F7/70025 , G03F7/70033 , G03F7/70916 , G03F7/70975
摘要： In order to prevent observed long-term energy decay of power amplifiers and correspondingly increase the lifespan of CO2 lasers employing them, a hydrogen-doped mixing gas is supplied from an external pipeline during operation or periodic maintenance in order to effectively remove solid contaminants that build-up over time on a surface of a catalyst disposed within the power amplifier.
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公开(公告)号：US12130555B2
公开(公告)日：2024-10-29
申请号：US18142500
申请日：2023-05-02
发明人： Chih-Ping Yen , Yen-Shuo Su , Chieh Hsieh , Shang-Chieh Chien , Chun-Lin Chang , Li-Jui Chen , Heng-Hsin Liu
CPC分类号： G03F7/70033 , H05G2/006 , H05G2/008
摘要： An extreme ultra violet (EUV) lithography method includes receiving an EUV light by a scanner from an EUV light source, the EUV light passing through an intermediate focus disposed in the scanner and at a junction of the EUV light source and the scanner; directing the EUV light by the scanner to a reticle in the scanner; and deflecting nanoparticles from the EUV light source away from the reticle by generating a gas flow using a gas jet disposed entirely in the scanner and proximate to an interface of the scanner and the intermediate focus such that the gas jet does not block the EUV light.
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公开(公告)号：US11675272B2
公开(公告)日：2023-06-13
申请号：US17460121
申请日：2021-08-27
发明人： Chih-Ping Yen , Yen-Shuo Su , Chieh Hsieh , Shang-Chieh Chien , Chun-Lin Chang , Li-Jui Chen , Heng-Hsin Liu
CPC分类号： G03F7/70033 , H05G2/006 , H05G2/008
摘要： Supersonic gas jets are provided near the immediate focus of a lithography apparatus in order to deflect tin debris generated by the lithography process away from a scanner side and towards a debris collection device. The gas jets can be positioned in a variety of useful orientations, with adjustable gas flow velocity and gas density in order to prevent up to nearly 100% of the tin debris from migrating to the reticle on the scanner side.
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