公开(公告)号：US11387177B2

公开(公告)日：2022-07-12

申请号：US16442955

申请日：2019-06-17

申请人： TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.

发明人： Chin-Her Chien ,  Po-Hsiang Huang ,  Cheng-Hung Yeh ,  Tai-Yu Wang ,  Ming-Ke Tsai ,  Yao-Hsien Tsai ,  Kai-Yun Lin ,  Chin-Yuan Huang ,  Kai-Ming Liu ,  Fong-Yuan Chang ,  Chin-Chou Liu ,  Yi-Kan Cheng

IPC分类号： H01L23/498 ,  H01L23/31 ,  H01L23/538 ,  H01L21/48 ,  H01L21/56

摘要： A package structure and a method for forming the same are provided. The package structure includes a die, a first molding surrounding the die, a first redistribution layer (RDL), an interposer disposed over the first RDL, a second molding surrounding the interposer, a first via, and a second RDL. The first RDL includes a first dielectric layer disposed over the die and the first molding, and a first interconnect structure surrounded by the first dielectric layer and electrically connected to the die. The interposer is electrically connected to the die through the first interconnect structure. The first via extends through and within the second molding and is adjacent to the interposer. The second RDL includes a second dielectric layer disposed over the interposer and the second molding, and a second interconnect structure surrounded by the second dielectric layer and electrically connected to the via and the interposer.