公开(公告)号：US10529668B2

公开(公告)日：2020-01-07

申请号：US15935829

申请日：2018-03-26

Applicant: TAIYO YUDEN CO., LTD.

Inventor： Kenzo Kitazaki ,  Takehiko Kai ,  Masaya Shimamura ,  Mikio Aoki ,  Jin Mikata ,  Taiji Ito

IPC: H01L23/552 ,  H01L23/66 ,  H01L21/78 ,  H01L21/56 ,  H01L23/31 ,  H01L23/00

Abstract: Forming a groove in a dicing region so as to expose a conductive pattern material on a side surface, closer to a first side of each of mounting regions, of a substrate; when forming a first sealing portion enclosing a wireless region and a second sealing portion enclosing an antenna region adjacent to the wireless region on a side of a second side of each of the mounting regions, reducing a thickness in a height direction such that a thickness of the second sealing portion becomes smaller in thickness than a thickness of the first sealing portion; forming a shielding film such that a scattered matter made of a conductive material is allowed to pass through an upper surface of the second sealing portion, to be deposited onto the conductive pattern material exposed on a side surface of the substrate; and separating the substrate into the mounting regions individually.

公开(公告)号：US10756024B2

公开(公告)日：2020-08-25

申请号：US15934757

申请日：2018-03-23

Applicant: TAIYO YUDEN CO., LTD.

Inventor： Kenzo Kitazaki ,  Takehiko Kai ,  Masaya Shimamura ,  Mikio Aoki ,  Jin Mikata ,  Taiji Ito

IPC: H01L23/552 ,  H01L23/498 ,  H05K9/00 ,  H05K5/00 ,  H01L25/16

Abstract: An electronic component module includes: a substrate including a conductive pattern; an electronic component provided to the substrate; a sealing portion covering the electronic component and substrate, and having an upper surface and a side surface that form an edge portion; a contact portion configured to be electrically connected with the conductive pattern, the contact portion exposed on a vertical surface continuous with the side surface of the sealing portion; a removal portion formed by removing the predetermined edge portion formed by the upper surface and the side surface of the sealing portion; and a shielding film covering the upper surface, the side surface and the contact portion of the sealing portion. The removal portion is a region allowing a conductive material to pass therethrough so that the contact portion is covered with the shielding film, the conductive material being scattered in vacuum atmosphere lower than atmospheric pressure.

公开(公告)号：US10665936B2

公开(公告)日：2020-05-26

申请号：US15828191

申请日：2017-11-30

Applicant: TAIYO YUDEN CO., LTD.

Inventor： Jin Mikata ,  Masaya Shimamura ,  Mikio Aoki ,  Takehiko Kai ,  Taiji Ito

IPC: H01Q1/52 ,  H01Q1/38 ,  H01L23/552 ,  H01L23/66 ,  H01Q1/22 ,  H01L23/31

Abstract: A wireless module, including: a substrate; an electronic circuit mounted in a first region on a one face of the substrate; a conductive pattern formed in a second region on another face of the substrate, the conductive pattern being connected to a radio communication section of the electronic circuit, and the conductive pattern serving as an antenna when transmitting/receiving radio wave, the second region being different from the first region; a resin layer sealing the electronic circuit in the first region; a shielding layer formed on a surface of the resin layer; and a shield disposed in either one of a top layer of the substrate and an inner layer of the substrate, the shield being for shielding noise radiated from the electronic circuit.

公开(公告)号：US10714822B2

公开(公告)日：2020-07-14

申请号：US15828178

申请日：2017-11-30

Applicant: TAIYO YUDEN CO., LTD.

Inventor： Jin Mikata ,  Masaya Shimamura ,  Mikio Aoki ,  Takehiko Kai ,  Taiji Ito

IPC: H01Q1/38 ,  H01L23/31 ,  H01Q1/22 ,  H01Q9/42 ,  H01Q1/52 ,  H01L23/552 ,  H01L21/56 ,  B32B15/08 ,  H01Q23/00

Abstract: A wireless module, including: a substrate; an electronic circuit mounted in a first region on a one face of the substrate; a conductive pattern formed in a second region on another face of the substrate and serving as an antenna; a resin layer sealing the electronic circuit in the first region; and a shielding layer formed on a surface of the resin layer and having conductivity.

公开(公告)号：US20180286796A1

公开(公告)日：2018-10-04

申请号：US15934757

申请日：2018-03-23

Applicant: TAIYO YUDEN CO., LTD.

Inventor： Kenzo Kitazaki ,  Takehiko Kai ,  Masaya Shimamura ,  Mikio Aoki ,  Jin Mikata ,  Taiji Ito

IPC: H01L23/498 ,  H01L23/552 ,  H05K5/00 ,  H05K9/00

Abstract: An electronic component module includes: a substrate including a conductive pattern; an electronic component provided to the substrate; a sealing portion covering the electronic component and substrate, and having an upper surface and a side surface that form an edge portion; a contact portion configured to be electrically connected with the conductive pattern, the contact portion exposed on a vertical surface continuous with the side surface of the sealing portion; a removal portion formed by removing the predetermined edge portion formed by the upper surface and the side surface of the sealing portion; and a shielding film covering the upper surface, the side surface and the contact portion of the sealing portion. The removal portion is a region allowing a conductive material to pass therethrough so that the contact portion is covered with the shielding film, the conductive material being scattered in vacuum atmosphere lower than atmospheric pressure.