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    Method of manufacturing electronic component module
    2.
    发明授权
    Method of manufacturing electronic component module 有权

    公开(公告)号：US10529668B2

    公开(公告)日：2020-01-07

    申请号：US15935829

    申请日：2018-03-26

    申请人： TAIYO YUDEN CO., LTD.

    发明人： Kenzo Kitazaki ,  Takehiko Kai ,  Masaya Shimamura ,  Mikio Aoki ,  Jin Mikata ,  Taiji Ito

    IPC分类号： H01L23/552 ,  H01L23/66 ,  H01L21/78 ,  H01L21/56 ,  H01L23/31 ,  H01L23/00

    摘要： Forming a groove in a dicing region so as to expose a conductive pattern material on a side surface, closer to a first side of each of mounting regions, of a substrate; when forming a first sealing portion enclosing a wireless region and a second sealing portion enclosing an antenna region adjacent to the wireless region on a side of a second side of each of the mounting regions, reducing a thickness in a height direction such that a thickness of the second sealing portion becomes smaller in thickness than a thickness of the first sealing portion; forming a shielding film such that a scattered matter made of a conductive material is allowed to pass through an upper surface of the second sealing portion, to be deposited onto the conductive pattern material exposed on a side surface of the substrate; and separating the substrate into the mounting regions individually.

    ELECTRONIC COMPONENT MODULE AND METHOD OF MANUFACTURING THE SAME
    4.
    发明申请
    ELECTRONIC COMPONENT MODULE AND METHOD OF MANUFACTURING THE SAME 审中-公开

    公开(公告)号：US20180286796A1

    公开(公告)日：2018-10-04

    申请号：US15934757

    申请日：2018-03-23

    申请人： TAIYO YUDEN CO., LTD.

    发明人： Kenzo Kitazaki ,  Takehiko Kai ,  Masaya Shimamura ,  Mikio Aoki ,  Jin Mikata ,  Taiji Ito

    IPC分类号： H01L23/498 ,  H01L23/552 ,  H05K5/00 ,  H05K9/00

    摘要： An electronic component module includes: a substrate including a conductive pattern; an electronic component provided to the substrate; a sealing portion covering the electronic component and substrate, and having an upper surface and a side surface that form an edge portion; a contact portion configured to be electrically connected with the conductive pattern, the contact portion exposed on a vertical surface continuous with the side surface of the sealing portion; a removal portion formed by removing the predetermined edge portion formed by the upper surface and the side surface of the sealing portion; and a shielding film covering the upper surface, the side surface and the contact portion of the sealing portion. The removal portion is a region allowing a conductive material to pass therethrough so that the contact portion is covered with the shielding film, the conductive material being scattered in vacuum atmosphere lower than atmospheric pressure.

    Circuit module and method of producing circuit module
    6.
    发明授权
    Circuit module and method of producing circuit module 有权
    电路模块及其制造方法

    公开(公告)号：US09018039B2

    公开(公告)日：2015-04-28

    申请号：US14517424

    申请日：2014-10-17

    申请人： Taiyo Yuden Co., Ltd.

    发明人： Eiji Mugiya ,  Takehiko Kai ,  Masaya Shimamura ,  Tetsuo Saji ,  Hiroshi Nakamura

    IPC分类号： H01L21/44 ,  H01L21/48 ,  H01L21/50 ,  H01L23/552 ,  H01L21/56 ,  H01L21/52

    CPC分类号： H01L23/552 ,  H01L21/52 ,  H01L21/56 ,  H01L21/561 ,  H01L23/3121 ,  H01L24/97 ,  H01L2924/12042 ,  H01L2924/15159 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/19105 ,  H01L2924/00

    摘要： A circuit module includes a circuit substrate, at least one mount component, sealing bodies, and a shield. The circuit substrate includes a mount surface. The mount component is mounted on the mount surface. The sealing body is formed on the mount surface, covers the mount component and has a first sealing body section having a first thickness and a second sealing body section having a second thickness larger than the first thickness. The shield covers the sealing body and has a first shield section formed on the first sealing body section and having a third thickness and a second shield section formed on the second sealing body section and having a fourth thickness smaller than the third thickness. The sum of the fourth thickness and the second thickness equals to the sum of the first thickness and the third thickness.

    摘要翻译： 电路模块包括电路基板，至少一个安装部件，密封体和屏蔽件。 电路基板包括安装表面。 安装部件安装在安装表面上。 密封体形成在安装表面上，覆盖安装部件，并且具有第一密封体部分和具有第二厚度大于第一厚度的第二密封体部分。 屏蔽罩覆盖密封体，并且具有形成在第一密封体部分上并具有第三厚度的第一屏蔽部分和形成在第二密封体部分上并且具有小于第三厚度的第四厚度的第二屏蔽部分。 第四厚度和第二厚度之和等于第一厚度和第三厚度之和。

    Circuit module and method of producing circuit module
    7.
    发明授权
    Circuit module and method of producing circuit module 有权
    电路模块及其制造方法

    公开(公告)号：US08890309B1

    公开(公告)日：2014-11-18

    申请号：US14102172

    申请日：2013-12-10

    申请人： Taiyo Yuden Co., Ltd.

    发明人： Eiji Mugiya ,  Takehiko Kai ,  Masaya Shimamura ,  Tetsuo Saji ,  Hiroshi Nakamura

    IPC分类号： H01L23/12 ,  H01L23/02 ,  H01L21/52 ,  H01L23/552 ,  H01L21/56

    CPC分类号： H01L23/552 ,  H01L21/52 ,  H01L21/56 ,  H01L21/561 ,  H01L23/3121 ,  H01L24/97 ,  H01L2924/12042 ,  H01L2924/15159 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/19105 ,  H01L2924/00

    摘要： A circuit module includes a circuit substrate, at least one mount component, sealing bodies, and a shield. The circuit substrate includes a mount surface. The mount component is mounted on the mount surface. The sealing body is formed on the mount surface, covers the mount component and has a first sealing body section having a first thickness and a second sealing body section having a second thickness larger than the first thickness. The shield covers the sealing body and has a first shield section formed on the first sealing body section and having a third thickness and a second shield section formed on the second sealing body section and having a fourth thickness smaller than the third thickness. The sum of the fourth thickness and the second thickness equals to the sum of the first thickness and the third thickness.

    摘要翻译： 电路模块包括电路基板，至少一个安装部件，密封体和屏蔽件。 电路基板包括安装表面。 安装部件安装在安装表面上。 密封体形成在安装表面上，覆盖安装部件，并且具有第一密封体部分和具有第二厚度大于第一厚度的第二密封体部分。 屏蔽罩覆盖密封体，并且具有形成在第一密封体部分上并具有第三厚度的第一屏蔽部分和形成在第二密封体部分上并且具有小于第三厚度的第四厚度的第二屏蔽部分。 第四厚度和第二厚度之和等于第一厚度和第三厚度之和。

    Electronic component module and method of manufacturing the same
    8.
    发明授权
    Electronic component module and method of manufacturing the same 有权

    公开(公告)号：US10756024B2

    公开(公告)日：2020-08-25

    申请号：US15934757

    申请日：2018-03-23

    申请人： TAIYO YUDEN CO., LTD.

    发明人： Kenzo Kitazaki ,  Takehiko Kai ,  Masaya Shimamura ,  Mikio Aoki ,  Jin Mikata ,  Taiji Ito

    IPC分类号： H01L23/552 ,  H01L23/498 ,  H05K9/00 ,  H05K5/00 ,  H01L25/16

    摘要： An electronic component module includes: a substrate including a conductive pattern; an electronic component provided to the substrate; a sealing portion covering the electronic component and substrate, and having an upper surface and a side surface that form an edge portion; a contact portion configured to be electrically connected with the conductive pattern, the contact portion exposed on a vertical surface continuous with the side surface of the sealing portion; a removal portion formed by removing the predetermined edge portion formed by the upper surface and the side surface of the sealing portion; and a shielding film covering the upper surface, the side surface and the contact portion of the sealing portion. The removal portion is a region allowing a conductive material to pass therethrough so that the contact portion is covered with the shielding film, the conductive material being scattered in vacuum atmosphere lower than atmospheric pressure.

    Wireless module and method for manufacturing wireless module
    9.
    发明授权
    Wireless module and method for manufacturing wireless module 有权

    公开(公告)号：US10665936B2

    公开(公告)日：2020-05-26

    申请号：US15828191

    申请日：2017-11-30

    申请人： TAIYO YUDEN CO., LTD.

    发明人： Jin Mikata ,  Masaya Shimamura ,  Mikio Aoki ,  Takehiko Kai ,  Taiji Ito

    IPC分类号： H01Q1/52 ,  H01Q1/38 ,  H01L23/552 ,  H01L23/66 ,  H01Q1/22 ,  H01L23/31

    摘要： A wireless module, including: a substrate; an electronic circuit mounted in a first region on a one face of the substrate; a conductive pattern formed in a second region on another face of the substrate, the conductive pattern being connected to a radio communication section of the electronic circuit, and the conductive pattern serving as an antenna when transmitting/receiving radio wave, the second region being different from the first region; a resin layer sealing the electronic circuit in the first region; a shielding layer formed on a surface of the resin layer; and a shield disposed in either one of a top layer of the substrate and an inner layer of the substrate, the shield being for shielding noise radiated from the electronic circuit.