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    Method of manufacturing electronic component module
    2.
    发明授权
    Method of manufacturing electronic component module 有权

    公开(公告)号：US10529668B2

    公开(公告)日：2020-01-07

    申请号：US15935829

    申请日：2018-03-26

    申请人： TAIYO YUDEN CO., LTD.

    发明人： Kenzo Kitazaki ,  Takehiko Kai ,  Masaya Shimamura ,  Mikio Aoki ,  Jin Mikata ,  Taiji Ito

    IPC分类号： H01L23/552 ,  H01L23/66 ,  H01L21/78 ,  H01L21/56 ,  H01L23/31 ,  H01L23/00

    摘要： Forming a groove in a dicing region so as to expose a conductive pattern material on a side surface, closer to a first side of each of mounting regions, of a substrate; when forming a first sealing portion enclosing a wireless region and a second sealing portion enclosing an antenna region adjacent to the wireless region on a side of a second side of each of the mounting regions, reducing a thickness in a height direction such that a thickness of the second sealing portion becomes smaller in thickness than a thickness of the first sealing portion; forming a shielding film such that a scattered matter made of a conductive material is allowed to pass through an upper surface of the second sealing portion, to be deposited onto the conductive pattern material exposed on a side surface of the substrate; and separating the substrate into the mounting regions individually.

    Circuit module
    3.
    发明授权
    Circuit module 有权
    电路模块

    公开(公告)号：US08897019B1

    公开(公告)日：2014-11-25

    申请号：US14103620

    申请日：2013-12-11

    申请人： Taiyo Yuden Co., Ltd.

    发明人： Masaya Shimamura ,  Kenzo Kitazaki ,  Eiji Mugiya ,  Tetsuo Saji ,  Atsushi Tsunoda ,  Hiroshi Nakamura

    IPC分类号： H05K7/00 ,  H05K9/00

    CPC分类号： H01L24/97 ,  H01L23/3121 ,  H01L23/552 ,  H01L24/13 ,  H01L24/16 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/97 ,  H01L2924/15159 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19105 ,  H05K9/003 ,  H01L2224/81 ,  H01L2924/014 ,  H01L2924/00

    摘要： There is provided a circuit module, including: a circuit substrate including a mount surface; a mounting component mounted on the mount surface; a sealing body that is formed on the mount surface, covers the mounting component, and includes a trench formed from a main surface of the sealing body toward the mount surface, the trench including a first trench portion extending in one of a parallel direction and an orthogonal direction with respect to a direction parallel to the main surface and a second trench portion that is connected to the first trench portion, is parallel to the main surface, and extends in a direction that is not parallel nor orthogonal to the first trench portion; and a shield that covers the sealing body and includes an inner shield portion formed inside the trench and an outer shield portion provided on the main surface and the inner shield portion.

    摘要翻译： 提供了一种电路模块，包括：包括安装表面的电路基板; 安装在安装表面上的安装部件; 形成在安装面上的密封体覆盖安装部件，并且包括由密封体的主表面朝向安装面形成的沟槽，该沟槽包括沿平行方向延伸的第一沟槽部分和 相对于与主表面平行的方向的正交方向和与第一沟槽部分连接的第二沟槽部分平行于主表面，并且在不平行或不垂直于第一沟槽部分的方向上延伸; 以及覆盖所述密封体并且包括形成在所述沟槽内的内屏蔽部和设置在所述主表面和所述内屏蔽部上的外屏蔽部的屏蔽。

    Circuit module and method of manufacturing same
    4.
    发明授权
    Circuit module and method of manufacturing same 有权
    电路模块及其制造方法

    公开(公告)号：US09560740B2

    公开(公告)日：2017-01-31

    申请号：US14861867

    申请日：2015-09-22

    申请人： TAIYO YUDEN CO., LTD.

    发明人： Kenzo Kitazaki ,  Eiji Mugiya ,  Masaya Shimamura

    IPC分类号： H05K7/00 ,  H05K1/02 ,  H05K9/00 ,  H05K3/28 ,  H05K3/00

    CPC分类号： H05K1/0216 ,  H01L2224/16225 ,  H01L2924/181 ,  H05K3/0052 ,  H05K3/284 ,  H05K9/0024 ,  H05K2201/0715 ,  H01L2924/00012

    摘要： A circuit module, including: a substrate having electronic components mounted thereon and further having a conductive pattern that defines respective shielded areas where the electronic components are mounted; a sealing layer covering the substrate and the electronic components, the sealing layer having grooves formed therein along the conductive pattern; and a conductive shield, including: a first shielding section covering a top surface of the sealing layer; a second shielding section covering side faces of the sealing layer; and a third shielding section filling the grooves in the sealing layer, wherein the grooves are shaped such that the third shielding section has at least one end thereof connected to the second shielding section, the third shielding section thereby acting as shielding walls partitioning the respective shielded areas, and that said at least one end of the third shielding section has a width wider than other portions of the third shielding section.

    摘要翻译： 一种电路模块，包括：具有安装在其上的电子部件并且还具有限定电子部件安装的相应屏蔽区域的导电图案的基板; 覆盖所述基板和所述电子部件的密封层，所述密封层沿着所述导电图案形成在其中; 以及导电屏蔽，包括：覆盖所述密封层的顶表面的第一屏蔽部分; 覆盖所述密封层的侧面的第二遮蔽部; 以及填充所述密封层中的凹槽的第三屏蔽部分，其中所述凹槽成形为使得所述第三屏蔽部分的至少一端连接到所述第二屏蔽部分，所述第三屏蔽部分用作屏蔽壁， 并且所述第三屏蔽部分的至少一端的宽度比所述第三屏蔽部分的其它部分宽。

    Circuit module and method of producing circuit module
    6.
    发明授权
    Circuit module and method of producing circuit module 有权
    电路模块及其制造方法

    公开(公告)号：US09018039B2

    公开(公告)日：2015-04-28

    申请号：US14517424

    申请日：2014-10-17

    申请人： Taiyo Yuden Co., Ltd.

    发明人： Eiji Mugiya ,  Takehiko Kai ,  Masaya Shimamura ,  Tetsuo Saji ,  Hiroshi Nakamura

    IPC分类号： H01L21/44 ,  H01L21/48 ,  H01L21/50 ,  H01L23/552 ,  H01L21/56 ,  H01L21/52

    CPC分类号： H01L23/552 ,  H01L21/52 ,  H01L21/56 ,  H01L21/561 ,  H01L23/3121 ,  H01L24/97 ,  H01L2924/12042 ,  H01L2924/15159 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/19105 ,  H01L2924/00

    摘要： A circuit module includes a circuit substrate, at least one mount component, sealing bodies, and a shield. The circuit substrate includes a mount surface. The mount component is mounted on the mount surface. The sealing body is formed on the mount surface, covers the mount component and has a first sealing body section having a first thickness and a second sealing body section having a second thickness larger than the first thickness. The shield covers the sealing body and has a first shield section formed on the first sealing body section and having a third thickness and a second shield section formed on the second sealing body section and having a fourth thickness smaller than the third thickness. The sum of the fourth thickness and the second thickness equals to the sum of the first thickness and the third thickness.

    摘要翻译： 电路模块包括电路基板，至少一个安装部件，密封体和屏蔽件。 电路基板包括安装表面。 安装部件安装在安装表面上。 密封体形成在安装表面上，覆盖安装部件，并且具有第一密封体部分和具有第二厚度大于第一厚度的第二密封体部分。 屏蔽罩覆盖密封体，并且具有形成在第一密封体部分上并具有第三厚度的第一屏蔽部分和形成在第二密封体部分上并且具有小于第三厚度的第四厚度的第二屏蔽部分。 第四厚度和第二厚度之和等于第一厚度和第三厚度之和。

    Circuit module and method of producing circuit module
    7.
    发明授权
    Circuit module and method of producing circuit module 有权
    电路模块及其制造方法

    公开(公告)号：US08890309B1

    公开(公告)日：2014-11-18

    申请号：US14102172

    申请日：2013-12-10

    申请人： Taiyo Yuden Co., Ltd.

    发明人： Eiji Mugiya ,  Takehiko Kai ,  Masaya Shimamura ,  Tetsuo Saji ,  Hiroshi Nakamura

    IPC分类号： H01L23/12 ,  H01L23/02 ,  H01L21/52 ,  H01L23/552 ,  H01L21/56

    CPC分类号： H01L23/552 ,  H01L21/52 ,  H01L21/56 ,  H01L21/561 ,  H01L23/3121 ,  H01L24/97 ,  H01L2924/12042 ,  H01L2924/15159 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/19105 ,  H01L2924/00

    摘要： A circuit module includes a circuit substrate, at least one mount component, sealing bodies, and a shield. The circuit substrate includes a mount surface. The mount component is mounted on the mount surface. The sealing body is formed on the mount surface, covers the mount component and has a first sealing body section having a first thickness and a second sealing body section having a second thickness larger than the first thickness. The shield covers the sealing body and has a first shield section formed on the first sealing body section and having a third thickness and a second shield section formed on the second sealing body section and having a fourth thickness smaller than the third thickness. The sum of the fourth thickness and the second thickness equals to the sum of the first thickness and the third thickness.

    摘要翻译： 电路模块包括电路基板，至少一个安装部件，密封体和屏蔽件。 电路基板包括安装表面。 安装部件安装在安装表面上。 密封体形成在安装表面上，覆盖安装部件，并且具有第一密封体部分和具有第二厚度大于第一厚度的第二密封体部分。 屏蔽罩覆盖密封体，并且具有形成在第一密封体部分上并具有第三厚度的第一屏蔽部分和形成在第二密封体部分上并且具有小于第三厚度的第四厚度的第二屏蔽部分。 第四厚度和第二厚度之和等于第一厚度和第三厚度之和。

    Electronic component module and method of manufacturing the same
    8.
    发明授权
    Electronic component module and method of manufacturing the same 有权

    公开(公告)号：US10756024B2

    公开(公告)日：2020-08-25

    申请号：US15934757

    申请日：2018-03-23

    申请人： TAIYO YUDEN CO., LTD.

    发明人： Kenzo Kitazaki ,  Takehiko Kai ,  Masaya Shimamura ,  Mikio Aoki ,  Jin Mikata ,  Taiji Ito

    IPC分类号： H01L23/552 ,  H01L23/498 ,  H05K9/00 ,  H05K5/00 ,  H01L25/16

    摘要： An electronic component module includes: a substrate including a conductive pattern; an electronic component provided to the substrate; a sealing portion covering the electronic component and substrate, and having an upper surface and a side surface that form an edge portion; a contact portion configured to be electrically connected with the conductive pattern, the contact portion exposed on a vertical surface continuous with the side surface of the sealing portion; a removal portion formed by removing the predetermined edge portion formed by the upper surface and the side surface of the sealing portion; and a shielding film covering the upper surface, the side surface and the contact portion of the sealing portion. The removal portion is a region allowing a conductive material to pass therethrough so that the contact portion is covered with the shielding film, the conductive material being scattered in vacuum atmosphere lower than atmospheric pressure.

    Wireless module and method for manufacturing wireless module
    9.
    发明授权
    Wireless module and method for manufacturing wireless module 有权

    公开(公告)号：US10665936B2

    公开(公告)日：2020-05-26

    申请号：US15828191

    申请日：2017-11-30

    申请人： TAIYO YUDEN CO., LTD.

    发明人： Jin Mikata ,  Masaya Shimamura ,  Mikio Aoki ,  Takehiko Kai ,  Taiji Ito

    IPC分类号： H01Q1/52 ,  H01Q1/38 ,  H01L23/552 ,  H01L23/66 ,  H01Q1/22 ,  H01L23/31

    摘要： A wireless module, including: a substrate; an electronic circuit mounted in a first region on a one face of the substrate; a conductive pattern formed in a second region on another face of the substrate, the conductive pattern being connected to a radio communication section of the electronic circuit, and the conductive pattern serving as an antenna when transmitting/receiving radio wave, the second region being different from the first region; a resin layer sealing the electronic circuit in the first region; a shielding layer formed on a surface of the resin layer; and a shield disposed in either one of a top layer of the substrate and an inner layer of the substrate, the shield being for shielding noise radiated from the electronic circuit.