公开(公告)号：US20240038775A1

公开(公告)日：2024-02-01

申请号：US17622884

申请日：2021-12-17

Applicant: Huizhou China Star Optoelectronics Display Co., Ltd. ,  TCL China Star Optoelectronics Technology Co., Ltd.

Inventor： Bin ZHAO ,  Juncheng XIAO ,  Xiaodan LIN

IPC: H01L27/12 ,  H01L25/16

CPC classification number: H01L27/124 ,  H01L25/167 ,  H01L27/1259

Abstract: A display panel and a method for manufacturing the same are provided. The display panel includes a first bonding area and a second bonding area connected to the first bonding area. The display panel further includes a substrate and a bonding wiring layer. A thickness of a part of the substrate in the second bonding area is less than a thickness of a part of the substrate in the first bonding area. The bonding wiring layer is disposed on surfaces of the parts of the substrate in the first bonding area and the second bonding area. A side surface of the bonding wiring layer away from the first bonding area and a side surface of the substrate away from the first bonding area are located on a same plane.

公开(公告)号：US20240162400A1

公开(公告)日：2024-05-16

申请号：US17772772

申请日：2022-04-22

Applicant: TCL CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD.

Inventor： Bin ZHAO ,  Juncheng XIAO ,  Xiaodan LIN

IPC: H01L33/62 ,  H01L25/075 ,  H01L25/16 ,  H01L27/12

CPC classification number: H01L33/62 ,  H01L25/0753 ,  H01L25/167 ,  H01L27/1244 ,  H01L2933/0016 ,  H01L2933/0066

Abstract: The present application provides a manufacturing method of an array substrate, an array substrate, and a display panel. The manufacturing method of the array substrate includes providing a base substrate; forming a conductive layer and a photoresist layer on the base substrate; patterning the photoresist layer and the conductive layer to form a conductive area and an electroplating area electrically connected to each other; removing the photoresist layer; forming an electroplating layer; and disconnecting the electroplating area from the conductive area. In the present application, the photoresist layer has a less thickness to reduce manufacturing costs of the array substrate.

公开(公告)号：US20230058797A1

公开(公告)日：2023-02-23

申请号：US17605252

申请日：2021-08-27

Applicant: TCL China Star Optoelectronics Technology Co., Ltd.,

Inventor： Bin ZHAO ,  Juncheng XIAO ,  Xiaodan LIN

IPC: G02F1/13357

Abstract: The present invention relates to a backlight module and a preparation method therefor, and a display panel. According to the present invention, solid white ink is attached to a second base plate, and then the solid white ink corresponding to positions of bonding pad units is removed by means of laser engraving, so as to prevent the screen-printing white ink from damaging the second base plate. Aligned assembling is performed on a first assembly and a second assembly using a vacuum pairing device. The vacuum pairing device may be reused in other preparation processes of the display panel. Therefore, the device investment can be reduced, and the production costs can be lowered.