公开(公告)号：US20250010340A1

公开(公告)日：2025-01-09

申请号：US18548099

申请日：2023-07-31

Applicant: TCL ZHONGHUAN RENEWABLE ENERGY TECHNOLOGY CO., LTD.

Inventor： Yilin XU ,  Rui WU ,  Zhijun WU ,  Zhengmin CAO ,  Ruipeng LI ,  Dawei WANG ,  Yao WAN

IPC: B08B1/16 ,  B08B1/30 ,  B08B13/00 ,  H01L21/02

Abstract: A residue scraper is provided, which includes a machine frame, which is provided with a clamping unit for fastening a material holder; a scraper unit for cleaning residues on a to-be-cleaned surface of the material holder, and a driving unit that drives the scraper unit to reciprocate along a long side direction of the material holder. In the present invention, the scraper unit is driven by the driving unit to scrape off the residues, thereby achieving a high efficiency to remove the residues.

公开(公告)号：US20250010412A1

公开(公告)日：2025-01-09

申请号：US18548076

申请日：2023-07-31

Applicant: TCL ZHONGHUAN RENEWABLE ENERGY TECHNOLOGY CO., LTD.

Inventor： Yilin XU ,  Rui WU ,  Zhijun WU ,  Zhengmin CAO ,  Ruipeng LI ,  Dawei WANG ,  Yao WAN

IPC: B23K37/04 ,  B23K26/38 ,  B23K101/40 ,  B23K103/00

Abstract: A worktable for cutting a monocrystalline silicon wafer may include a worktable, a control panel is fixedly mounted on an outer wall of the worktable, a recess is formed on an upper surface of the worktable, a rotatable table is disposed in the recess, a shaft is fixedly connected to a middle portion of the rotatable table, a mounting plate is fixedly connected to each of upper and lower sides of the rotatable table, a clamper is disposed on the mounting plate, a scraper plate is disposed on each of upper and lower surfaces of the rotatable table, and the shaft is rotatably mounted in the recess in the worktable.

公开(公告)号：US20250029867A1

公开(公告)日：2025-01-23

申请号：US18548535

申请日：2023-07-31

Applicant: TCL ZHONGHUAN RENEWABLE ENERGY TECHNOLOGY CO., LTD.

Inventor： Mengcheng QU ,  Rui WU ,  Dawei BAI ,  Zhijun WU ,  Zhengmin CAO ,  Ruipeng LI ,  Dawei WANG ,  Yao WAN ,  Xianzheng YIN ,  Chen YANG

IPC: H01L21/687

Abstract: A material frame unlocking device may include a material frame and an insert slot, a clamping mechanism for clamping a silicon wafer is arranged on the material frame, and an unlocking mechanism for fitting the clamping mechanism is arranged on the insert slot. The clamping mechanism includes two clamping rods capable of opening and closing movements, an end of each of the two clamping rods is provided with a connecting rod, a middle portion of the connecting rod is provided with a hinge point, and an elastic assembly is arranged at one end of the connecting rod away from respective clamping rod, when the elastic assembly is controlled by the unlocking mechanism, the connecting rod rotates around the hinge point, and the two clamping rods are opened to separate the two clamping rods from each other.