公开(公告)号：US10035286B2

公开(公告)日：2018-07-31

申请号：US14655659

申请日：2013-12-18

申请人： TCTech Sweden AB

发明人： Jan Jäderberg ,  Lars Jäderberg

IPC分类号： B29C35/12 ,  B29C35/08 ,  B29C43/52 ,  B29C33/06 ,  B29C45/73 ,  B29C35/02 ,  B29C59/02 ,  B29C33/02 ,  B29C33/38

摘要： The present disclosure relates to a tool such as an injection molding tool or an embossing tool. A heating device including a stack of layers is provided for heating a tool surface. The stack may include a coil carrier layer with a number of wound coils for generating a magnetic field, and a conductive top layer, being adjacent to the tool surface currents are induced in the top layer to heat the surface. Efficient heating may be provided by solutions involving low resistivity layers that lead currents to the top layer without themselves developing heat to any greater extent. A conduction frame device can be provided beneath the top layer and around the perimeter thereof to provide reliable contact with a backing layer. A thermal resistance layer may placed between the intermediate layer and the top layer, and may comprise a heat resistive plastic material such as a polyimide.

公开(公告)号：US20150321388A1

公开(公告)日：2015-11-12

申请号：US14655659

申请日：2013-12-18

申请人： TCTECH SWEDEN AB

发明人： Jan Jäderberg ,  Lars Jäderberg

IPC分类号： B29C35/08

CPC分类号： B29C35/0805 ,  B29C33/06 ,  B29C33/3828 ,  B29C35/02 ,  B29C43/52 ,  B29C45/73 ,  B29C59/02 ,  B29C2033/023 ,  B29C2035/0811 ,  B29C2035/0816 ,  B29K2879/08 ,  B29K2905/12 ,  B29K2995/0005 ,  B29K2995/0015

摘要： The present disclosure relates to a tool such as an injection moulding tool or an embossing tool. A heating device including a stack of layers is provided for heating a tool surface. The stack may include a coil carrier layer with a number of wound coils for generating a magnetic field, and a conductive top layer, being adjacent to the tool surface currents are induced in the top layer to heat the surface. Efficient heating may be provided by solutions involving low resistivity layers that lead currents to the top layer without themselves developing heat to any greater extent. A conduction frame device can be provided beneath the top layer and around the perimeter thereof to provide reliable contact with a backing layer. A thermal resistance layer may placed between the intermediate layer and the top layer, and may comprise a heat resistive plastic material such as a polyimide

摘要翻译： 本公开涉及诸如注射成型工具或压花工具的工具。 提供包括一叠层的加热装置用于加热工具表面。 叠层可以包括具有多个用于产生磁场的缠绕线圈的线圈载体层，并且邻近工具的导电顶层在顶层中感应电流以加热表面。 可以通过涉及低电阻率层的溶液来提供有效的加热，所述低电阻层将电流引导到顶层，而没有自身发展到更大的程度。 导电框架装置可以设置在顶层下方并且围绕其周边以提供与背衬层的可靠接触。 热阻层可以放置在中间层和顶层之间，并且可以包括诸如聚酰亚胺之类的耐热塑性材料