公开(公告)号：US11935700B2

公开(公告)日：2024-03-19

申请号：US17700608

申请日：2022-03-22

Applicant: TDK CORPORATION

Inventor： Noriyuki Saito ,  Osamu Hirose ,  Toru Yoshida ,  Yoshinori Sato ,  Akira Suda ,  Akira Nakamura

IPC: H01G4/232 ,  H01G4/30 ,  H05K1/03 ,  H05K1/05

CPC classification number: H01G4/2325 ,  H01G4/30 ,  H05K1/0306 ,  H05K1/053

Abstract: A laminated electronic component includes an element body formed by laminating an insulating layer and having a bottom surface used as a mounting surface, and a bottom surface electrode formed on the bottom surface of the element body and containing glass and a sintered metal. The bottom surface electrode includes a first electrode layer and a second electrode layer formed on the element body side from the first electrode layer, an edge portion of the second electrode layer is covered with an overcoat layer which is a part of the element body, the first electrode layer is laminated on the second electrode layer with the overcoat layer interposed therebetween, and a content of glass in the first electrode layer is larger than a content of glass in the second electrode layer.

公开(公告)号：US20210327606A1

公开(公告)日：2021-10-21

申请号：US17230521

申请日：2021-04-14

Applicant: TDK CORPORATION

Inventor： Yuya Ishima ,  Masaki Takahashi ,  Akira Suda ,  Takashi Suzuki ,  Hidenobu Umeda

IPC: H01B1/22 ,  H01F27/28 ,  H01F41/04 ,  G03F7/004

Abstract: In a photosensitive conductive paste containing photosensitive organic components, conductor powder, and quartz powder, melting of the quartz powder does not occur or is very unlikely to occur in a heat treatment step, and in the heat treatment step, it functions sufficiently to bring shrinkage rates and shrinkage behaviors of both of a conductor layer and an element body layer closer to each other when they shrink, and thus generation of voids can be inhibited when it is used for manufacturing a laminated coil component.