公开(公告)号：US10998129B2

公开(公告)日：2021-05-04

申请号：US15895039

申请日：2018-02-13

Applicant: TDK CORPORATION

Inventor： Yuya Ishima ,  Shinichi Kondo ,  Shunji Aoki ,  Yasushi Matsuyama ,  Yusuke Onezawa ,  Hajime Azuma

IPC: H01F7/06 ,  H01F41/04 ,  H01F27/28 ,  H01F41/02 ,  B32B37/00 ,  B32B38/00

Abstract: A method for manufacturing a laminated coil component including an element and a conductor configuring a coil in the element includes a step of forming a conductor pattern including a configuration material of the conductor on a first base material by a photolithography method, a step of forming an element pattern including a configuration material of the element on a second base material by a photolithography method, the element pattern being formed such that a shape corresponding to a shape of the conductor pattern has been removed, a step of laminating the conductor pattern and the element pattern in a predetermined direction by repeatedly transferring the conductor pattern and the element pattern onto a support, and a step of performing thermal treatment for a laminate obtained by the step of laminating.

公开(公告)号：US10886063B2

公开(公告)日：2021-01-05

申请号：US15906589

申请日：2018-02-27

Applicant: TDK CORPORATION

Inventor： Yuya Ishima ,  Shunji Aoki ,  Shinichi Kondo ,  Yasushi Matsuyama ,  Hajime Azuma ,  Yusuke Onezawa

IPC: H01F27/28 ,  H01F41/04 ,  G03F7/20 ,  B32B38/00 ,  G03F7/26 ,  B32B37/10 ,  H01F41/10 ,  H01F27/29

Abstract: An electronic-component manufacturing method is for simultaneously manufacturing a plurality of electronic components each including an element body and a conductor. The electronic-component manufacturing method includes the steps of forming laminates to be the plurality of electronic components on a plurality of regions set apart from each other on a surface of a first substrate, releasing the laminates from the plurality of regions, and performing heat treatment to the laminates. The forming the laminates includes a first step of forming element-body patterns on the plurality of regions and a second step of forming conductor patterns on the plurality of regions. The element-body patterns contain a constituent material of the element bodies and are patterned for the plurality of regions. The conductor patterns contain a constituent material of the conductors and are patterned for the plurality of regions.

公开(公告)号：US20180254145A1

公开(公告)日：2018-09-06

申请号：US15906589

申请日：2018-02-27

Applicant: TDK CORPORATION

Inventor： Yuya Ishima ,  Shunji Aoki ,  Shinichi Kondo ,  Yasushi Matsuyama ,  Hajime Azuma ,  Yusuke Onezawa

IPC: H01F41/04 ,  H01F27/28 ,  G03F7/20 ,  B32B38/00 ,  B32B37/10 ,  G03F7/26

CPC classification number: H01F41/041 ,  B32B37/10 ,  B32B38/0036 ,  B32B2457/00 ,  G03F7/2022 ,  G03F7/26 ,  G03F7/70 ,  H01F27/2804 ,  H01F27/292 ,  H01F41/10 ,  H01F2027/2809

Abstract: An electronic-component manufacturing method is for simultaneously manufacturing a plurality of electronic components each including an element body and a conductor. The electronic-component manufacturing method includes the steps of forming laminates to be the plurality of electronic components on a plurality of regions set apart from each other on a surface of a first substrate, releasing the laminates from the plurality of regions, and performing heat treatment to the laminates. The forming the laminates includes a first step of forming element-body patterns on the plurality of regions and a second step of forming conductor patterns on the plurality of regions. The element-body patterns contain a constituent material of the element bodies and are patterned for the plurality of regions. The conductor patterns contain a constituent material of the conductors and are patterned for the plurality of regions.