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Patent Agency Ranking
公开(公告)号：US11606888B2
公开(公告)日：2023-03-14
申请号：US17352982
申请日：2021-06-21
Applicant: TDK CORPORATION
Inventor： Shuichi Takizawa , Hironori Sato , Atsushi Yoshino , Hideki Kachi
Abstract: A circuit module 2 comprises: a wiring structure 4; at least one electronic component 6a, 6b arranged on the upper surface of the wiring structure 4; an insulating resin layer 8 which is provided on the upper surface of the wiring structure 4 and in which at least one electronic component 6a, 6b is embedded; and a metal layer 10 provided on the upper surface of the insulating resin layer 8. The surface roughness of the portion S1 directly above each electronic component on the upper surface of the insulating resin layer 8 is expressed as R1. The surface roughness of the portion S2 other than the portion directly above all the electronic components on the upper surface of the insulating resin layer 8 is expressed as R2. At least one R1 satisfies the condition: R1>R2.
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公开(公告)号：US11076513B2
公开(公告)日：2021-07-27
申请号：US16284231
申请日：2019-02-25
Applicant: TDK CORPORATION
Inventor： Shuichi Takizawa , Hironori Sato , Atsushi Yoshino , Hideki Kachi
Abstract: A circuit module 2 comprises: a wiring structure 4; at least one electronic component 6a, 6b arranged on the upper surface of the wiring structure 4; an insulating resin layer 8 which is provided on the upper surface of the wiring structure 4 and in which at least one electronic component 6a, 6b is embedded; and a metal layer 10 provided on the upper surface of the insulating resin layer 8. The surface roughness of the portion S1 directly above each electronic component on the upper surface of the insulating resin layer 8 is expressed as R1. The surface roughness of the portion S2 other than the portion directly above all the electronic components on the upper surface of the insulating resin layer 8 is expressed as R2. At least one R1 satisfies the condition: R1>R2.
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公开(公告)号：US11812542B2
公开(公告)日：2023-11-07
申请号：US18104956
申请日：2023-02-02
Applicant: TDK CORPORATION
Inventor： Shuichi Takizawa , Hironori Sato , Atsushi Yoshino , Hideki Kachi
CPC classification number: H05K9/0045 , H05K1/181 , H05K5/065
Abstract: A circuit module 2 comprises: a wiring structure 4; at least one electronic component 6a, 6b arranged on the upper surface of the wiring structure 4; an insulating resin layer 8 which is provided on the upper surface of the wiring structure 4 and in which at least one electronic component 6a, 6b is embedded; and a metal layer 10 provided on the upper surface of the insulating resin layer 8. The surface roughness of the portion S1 directly above each electronic component on the upper surface of the insulating resin layer 8 is expressed as R1. The surface roughness of the portion S2 other than the portion directly above all the electronic components on the upper surface of the insulating resin layer 8 is expressed as R2. At least one R1 satisfies the condition: R1>R2.
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公开(公告)号：US09426934B2
公开(公告)日：2016-08-23
申请号：US14388924
申请日：2013-04-05
Applicant: TDK CORPORATION
Inventor： Takeshi Yokoyama , Hideki Kachi , Shinichi Tsuchiya
IPC: H05K9/00
CPC classification number: H05K9/0028
Abstract: A shield case 10 has, disposed upon a lateral plate 12, a first anchor part 123 for anchoring to a substrate, and a slit 127 which extends from a release edge part to a top plate 11, whereupon a leading end portion 127a thereof is formed upon the top plate 11.
Abstract translation: 屏蔽壳10设置在侧板12上，用于固定到基板上的第一锚固部分123和从释放边缘部分延伸到顶板11的狭缝127，由此形成前端部分127a 在顶板11上。
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公开(公告)号：US20150062809A1
公开(公告)日：2015-03-05
申请号：US14388924
申请日：2013-04-05
Applicant: TDK CORPORATION
Inventor： Takeshi Yokoyama , Hideki Kachi , Shinichi Tsuchiya
IPC: H05K9/00
CPC classification number: H05K9/0028
Abstract: A shield case 10 has, disposed upon a lateral plate 12, a first anchor part 123 for anchoring to a substrate, and a slit 127 which extends from a release edge part to a top plate 11, whereupon a leading end portion 127a thereof is formed upon the top plate 11.
Abstract translation: 屏蔽壳10设置在侧板12上，用于固定到基板上的第一锚固部分123和从释放边缘部分延伸到顶板11的狭缝127，由此形成前端部分127a 在顶板11上。
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