PROCESS FOR PRODUCTION OF MULTILAYER ELECTRONIC COMPONENT

    公开(公告)号:US20190221367A1

    公开(公告)日:2019-07-18

    申请号:US16303789

    申请日:2017-07-11

    Abstract: A process for production of a multilayer electronic component having an element body wherein a functional part and a conductor part are laminated, using an ejection device wherein ink is electrically charged at an ejection part by applying a voltage and the electrically charged ink is ejected from the ejection part by an electrostatic attraction force, and including a first step of forming a green functional part by using a first ink including a functional particle as the ink, a second step of forming a green conductor part by using a second ink including a conductive particle as the ink, a step of forming a green multilayer body by repeating the first step and the second step, and a step of treating the green multilayer body to obtain the element body.

    METHOD FOR MANUFACTURING MULTILAYER ELECTRONIC COMPONENT

    公开(公告)号:US20190267192A1

    公开(公告)日:2019-08-29

    申请号:US16284677

    申请日:2019-02-25

    Abstract: A method for manufacturing a multilayer electronic component having an element body in which a functional part and a conductor part are laminated. The green multilayer body 11 is formed on the temporary holding film 62 formed on the release substrate. The green multilayer body 11 is formed by repeating the first step forming a green functional part using the first ink containing the functional particles and the second step forming the green conductor part using the second ink containing the conductive particles. The temporary holding film 62 has conductivity.

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