公开(公告)号：US20180268998A1

公开(公告)日：2018-09-20

申请号：US15918188

申请日：2018-03-12

Applicant: TDK CORPORATION

Inventor： Shinya ONODERA ,  Koki ITO ,  Hideki KANEKO

IPC: H01G4/232 ,  H01G4/30 ,  H01G4/248

Abstract: An electronic component includes an element body and an external electrode disposed on the element body. The external electrode includes a sintered metal layer and a conductive resin layer. The conductive resin layer is formed over the sintered metal layer and the element body. An average thickness of the conductive resin layer is smaller than that of the sintered metal layer.

公开(公告)号：US20180075972A1

公开(公告)日：2018-03-15

申请号：US15695645

申请日：2017-09-05

Applicant: TDK CORPORATION

Inventor： Shinya ONODERA ,  Koki ITO ,  Hideki KANEKO

IPC: H01G4/30 ,  H01G4/005 ,  H01G4/232 ,  H01G4/018

Abstract: An electronic component includes an element body of a rectangular parallelepiped shape, an external electrode, and an insulating film. The element body includes a first principal surface as a mounting surface, and a first side surface adjacent to the first principal surface. The external electrode includes a first electrode part and a second electrode part. The first electrode part is disposed on the first principal surface. The second electrode part is disposed on the first side surface and connected to the first electrode part. The insulating film continuously covers an end edge of the first electrode part and at least a part of an end edge of the second electrode part.

公开(公告)号：US20250029788A1

公开(公告)日：2025-01-23

申请号：US18903183

申请日：2024-10-01

Applicant: TDK Corporation

Inventor： Shinya ONODERA ,  Koki ITO ,  Hideki Kaneko

IPC: H01G4/30 ,  H01G2/06 ,  H01G4/008 ,  H01G4/012 ,  H01G4/12

Abstract: An element body includes a principal surface arranged to constitute a mounting surface, an end surface, and a side surface coupling the principal surface and the end surface. An external electrode is disposed on the element body and includes a conductive resin layer. An internal conductor is disposed in the element body and is exposed to the end surface. The element body includes a ridge portion between the end surface and the side surface, the ridge portion including a first region exposed from the conductive resin layer and a second region positioned closer to the principal surface than the first region and covered with the conductive resin layer.

公开(公告)号：US20240128020A1

公开(公告)日：2024-04-18

申请号：US18474733

申请日：2023-09-26

Applicant: TDK CORPORATION

Inventor： Yuya OSHIMA ,  Junichi OTSUKA ,  Yohei TADAKI ,  Shinichi KONDO ,  Koki ITO ,  Yoji TOZAWA ,  Shigeshi OSAWA ,  Tsubasa OZAWA ,  Makoto YOSHINO

IPC: H01F41/12 ,  H01F17/00 ,  H01F27/32

CPC classification number: H01F41/12 ,  H01F17/0013 ,  H01F27/32

Abstract: In a method for manufacturing a laminated coil component, in which a laminated coil component is manufactured by laminating insulator sheets in order on which conductors having predetermined patterns are formed, the insulator sheets are laminated such that a distance in a lamination direction between a first lead-out conductor laminated first and a first coil conductor laminated next is larger than a distance in the lamination direction between a second lead-out conductor laminated last and a second coil conductor laminated immediately before the second lead-out conductor.

公开(公告)号：US20220084753A1

公开(公告)日：2022-03-17

申请号：US17523524

申请日：2021-11-10

Applicant: TDK CORPORATION

Inventor： Shinya ONODERA ,  Koki ITO ,  Hideki KANEKO

IPC: H01G4/30 ,  H01G2/06 ,  H01G4/008 ,  H01G4/012 ,  H01G4/12

Abstract: An element body includes a principal surface arranged to constitute a mounting surface and a first side surface adjacent to the principal surface. An external electrode includes a first electrode portion disposed on the principal surface and a second electrode portion disposed on the first side surface. The first electrode portion includes a sintered metal layer, a conductive resin layer formed on the sintered metal layer, and a plating layer formed on the conductive resin layer. The second electrode portion includes a first region and a second region. The first region includes a sintered metal layer and a plating layer formed on the sintered metal layer. The second region includes a sintered metal layer, a conductive resin layer formed on the sintered metal layer, and a plating layer formed on the conductive resin layer. The second region is located closer to the principal surface than the first region.

公开(公告)号：US20210125783A1

公开(公告)日：2021-04-29

申请号：US16097175

申请日：2017-09-20

Applicant: TDK CORPORATION

Inventor： Shinya ONODERA ,  Koki ITO ,  Hideki KANEKO

IPC: H01G4/30 ,  H01G4/012 ,  H01G4/12 ,  H01G4/008 ,  H01G2/06

Abstract: An element body includes a principal surface arranged to constitute a mounting surface and a first side surface adjacent to the principal surface. An external electrode includes a first electrode portion disposed on the principal surface and a second electrode portion disposed on the first side surface. The first electrode portion includes a sintered metal layer, a conductive resin layer formed on the sintered metal layer, and a plating layer formed on the conductive resin layer. The second electrode portion includes a first region and a second region. The first region includes a sintered metal layer and a plating layer formed on the sintered metal layer. The second region includes a sintered metal layer, a conductive resin layer formed on the sintered metal layer, and a plating layer formed on the conductive resin layer. The second region is located closer to the principal surface than the first region.

公开(公告)号：US20230377802A1

公开(公告)日：2023-11-23

申请号：US18230222

申请日：2023-08-04

Applicant: TDK CORPORATION

Inventor： Shinya ONODERA ,  Koki ITO ,  Hideki KANEKO

IPC: H01G4/30 ,  H01G2/06 ,  H01G4/008 ,  H01G4/012 ,  H01G4/12

CPC classification number: H01G4/30 ,  H01G2/065 ,  H01G4/008 ,  H01G4/012 ,  H01G4/1218

Abstract: An element body includes a principal surface arranged to constitute a mounting surface and a first side surface adjacent to the principal surface. An external electrode includes a first electrode portion disposed on the principal surface and a second electrode portion disposed on the first side surface. The first electrode portion includes a sintered metal layer, a conductive resin layer formed on the sintered metal layer, and a plating layer formed on the conductive resin layer. The second electrode portion includes a first region and a second region. The first region includes a sintered metal layer and a plating layer formed on the sintered metal layer. The second region includes a sintered metal layer, a conductive resin layer formed on the sintered metal layer, and a plating layer formed on the conductive resin layer. The second region is located closer to the principal surface than the first region.

公开(公告)号：US20230170117A1

公开(公告)日：2023-06-01

申请号：US17992292

申请日：2022-11-22

Applicant: TDK CORPORATION

Inventor： Yuya OSHIMA ,  Kenji KOMORITA ,  Takehiro ISHII ,  Kouichi KAKUDA ,  Shigeshi OSAWA ,  Yusaku ABE ,  Tsubasa OZAWA ,  Midori KISHIMOTO ,  Makoto YOSHINO ,  Koki ITO ,  Masato KUDOU

IPC: H01F5/00 ,  H01F5/04

CPC classification number: H01F5/003 ,  H01F5/04

Abstract: In a multilayer coil component, a plurality of coil conductors are stacked in a coil axis direction. A connecting conductor connects the coil conductors adjacent to each other in the coil axis direction. First, second, and third coil conductors are arranged in order in the coil axis direction. A main body portion extends in a circumferential direction of the coil axis. Pad portions are connected to the main body portion, are connected to the first coil conductor via the connecting conductor, overhang from the third coil conductor in a direction away from the coil axis when viewed from the coil axis direction, and are inclined with respect to a virtual plane orthogonal to the coil axis direction.

公开(公告)号：US20220375689A1

公开(公告)日：2022-11-24

申请号：US17881204

申请日：2022-08-04

Applicant: TDK CORPORATION

Inventor： Shinya ONODERA ,  Koki ITO ,  Hideki KANEKO

IPC: H01G4/30 ,  H01G2/06 ,  H01G4/008 ,  H01G4/012 ,  H01G4/12

Abstract: An element body includes a principal surface arranged to constitute a mounting surface and a first side surface adjacent to the principal surface. An external electrode includes a first electrode portion disposed on the principal surface and a second electrode portion disposed on the first side surface. The first electrode portion includes a sintered metal layer, a conductive resin layer formed on the sintered metal layer, and a plating layer formed on the conductive resin layer. The second electrode portion includes a first region and a second region. The first region includes a sintered metal layer and a plating layer formed on the sintered metal layer. The second region includes a sintered metal layer, a conductive resin layer formed on the sintered metal layer, and a plating layer formed on the conductive resin layer. The second region is located closer to the principal surface than the first region.