公开(公告)号：US12112880B2

公开(公告)日：2024-10-08

申请号：US18386205

申请日：2023-11-01

申请人： SAMSUNG ELECTRO-MECHANICS CO., LTD.

发明人： Sung Sik Shin ,  Jae Wook Lee ,  Sung Young Jo

IPC分类号： H01F27/29 ,  H01F27/28 ,  H01F27/32 ,  H01F41/04 ,  H01F41/12

CPC分类号： H01F27/29 ,  H01F27/2804 ,  H01F27/32 ,  H01F41/041 ,  H01F41/12 ,  H01F2027/2809

摘要： A coil component includes a body having one surface and the other surface, opposing each other in one direction, and one end surface connecting the one surface and the other surface to each other, a support substrate embedded in the body, a coil portion disposed on the support substrate and including a lead-out pattern exposed from the one end surface, a first insulating layer disposed on the one end surface and having one region and the other regions spaced apart from each other in the other direction crossing the one direction, an external electrode having a connection portion, disposed between the one region and the other region to be connected to the lead-out pattern, and an extension portion extending from the connection portion to the one surface, and a second insulating layer disposed on the one end surface to cover the first insulating layer and the connection portion.

公开(公告)号：US20230420175A1

公开(公告)日：2023-12-28

申请号：US18242702

申请日：2023-09-06

申请人： Murata Manufacturing Co., Ltd.

发明人： Scott Andrew PARISH ,  Lee FRANCIS

IPC分类号： H01F27/28 ,  H01F41/04 ,  H01F41/06 ,  H01F41/12

CPC分类号： H01F27/2804 ,  H01F27/2895 ,  H01F41/046 ,  H01F41/06 ,  H01F41/12 ,  H01F41/122 ,  H01F41/041 ,  H01F2027/2809 ,  H01F41/125

摘要： An embedded magnetic component device includes a magnetic core located in a cavity extending into an insulating substrate. The cavity and magnetic core are coved with a cover layer. Through holes extend through the cover layer and the insulating substrate, and are plated to define conductive vias. Metallic traces are provided at exterior surfaces of the cover layer and the insulating substrate to define upper and lower winding layers. The metallic traces and conductive vias define the respective primary and secondary side windings for an embedded transformer. At least a first isolation barrier is provided on the cover layer, and at least a third insulating layer is provided on the substrate. The second and third insulating layers provide additional insulation for the device, and define and function as a circuit board for surface mounted power electronics.

公开(公告)号：US20230335332A1

公开(公告)日：2023-10-19

申请号：US18094516

申请日：2023-01-09

申请人： ATUM CO., LTD.

发明人： Taeksoo HAN ,  Hyunchuel KIM

IPC分类号： H01F27/30 ,  H01F30/06 ,  H01F27/32 ,  H01F27/28 ,  H01F41/12 ,  B60L53/20

CPC分类号： H01F27/306 ,  H01F30/06 ,  H01F27/324 ,  H01F27/2847 ,  H01F41/12 ,  B60L53/20 ,  B60L2210/10

摘要： A transformer for an LDC of an electric vehicle includes: a plate-type primary coil for receiving current from the high voltage battery of the electric vehicle; a lower secondary coil element provided under the primary coil to supply an induced current induced by the primary coil to the electrical components of the electric vehicle; and an upper secondary coil element provided on the primary coil to supply an induced current induced by the primary coil to the electrical components of the electric vehicle, and according to this, there is an advantage of reducing the height and size of a product.

公开(公告)号：US20230296694A1

公开(公告)日：2023-09-21

申请号：US18100006

申请日：2023-01-23

申请人： Hyperion Sensors Inc.

发明人： Anselm Viswasam ,  Gerald Manuelpillai ,  Guang Zeng ,  Ilya Tchaplia ,  Nick DiPardo

IPC分类号： G01R31/62 ,  H01F41/04 ,  G01K13/00 ,  G01K1/14 ,  G01K11/32 ,  H01F27/28 ,  H01F27/40 ,  H01F41/12

CPC分类号： G01R31/62 ,  H01F41/04 ,  G01K13/00 ,  G01K1/14 ,  G01K11/32 ,  H01F27/2871 ,  H01F27/402 ,  H01F41/12 ,  H01F2027/404 ,  H01F27/323

摘要： Sensing methods and systems for transformers, and the construction thereof, are described herein. Example transformer systems and example methods for constructing a core for the system are disclosed. The example system includes a core with a bottom plate, two or more limbs mounted to the bottom plate and a top plate enclosing the core. At least one of the bottom plate, the limbs and the top plate is formed with a sensing component therein. The sensing component can be mounted to a spacer layer assembled within a stack of laminated layers. The sensing component can be mounted within a path defined within the spacer layer, for example. Methods for detecting operating conditions within the transformer are also disclosed.

公开(公告)号：US11742136B2

公开(公告)日：2023-08-29

申请号：US16919613

申请日：2020-07-02

申请人： SAMSUNG ELECTRO-MECHANICS CO., LTD.

发明人： Young Sun Kim ,  Sung Hee Kim ,  In Suk Kim

IPC分类号： H01F27/36 ,  H01F27/24 ,  H01F27/28 ,  H01F27/32 ,  H01F41/04 ,  H01F41/12

CPC分类号： H01F27/36 ,  H01F27/24 ,  H01F27/2804 ,  H01F27/324 ,  H01F41/041 ,  H01F41/12 ,  H01F2027/2809

摘要： A coil component includes a support substrate including a through-hole disposed therein; a body including the support substrate embedded therein, and having a core disposed in the through-hole of the support substrate; a coil portion disposed on the support substrate, embedded in the body, and having a plurality of turns with reference to the core as an axis on the support substrate; and a shielding pattern disposed between an internal wall of the support substrate, by which the through-hole is defined, and the core.

公开(公告)号：US20180358169A1

公开(公告)日：2018-12-13

申请号：US16000669

申请日：2018-06-05

申请人： TDK CORPORATION

发明人： Tomonaga NISHIKAWA ,  Tomokazu ITO ,  Manabu YAMATANI ,  Masanori SUZUKI ,  Ikuya KOKUBO ,  Takuya TAKEUCHI

IPC分类号： H01F27/29 ,  H01F41/12 ,  H01F5/04 ,  H01F5/06

CPC分类号： H01F27/292 ,  H01F5/04 ,  H01F5/06 ,  H01F41/12

摘要： Disclosed herein is a coil component that includes: a coil part in which a plurality of conductor layers and a plurality of interlayer insulting layers are alternately laminated, the coil part having a mounting surface substantially parallel to the lamination direction and an upper surface substantially parallel to the lamination direction and positioned on an opposite side to the mounting surface; and a direction mark comprising a conductive material that covers a part of the conductor layers exposed on the upper surface.

公开(公告)号：US10062497B2

公开(公告)日：2018-08-28

申请号：US15096028

申请日：2016-04-11

申请人： HONEYWELL INTERNATIONAL INC.

发明人： Keming Chen ,  Evgeni Ganev ,  William Warr

IPC分类号： H01F17/04 ,  H01F27/28 ,  H01F41/12 ,  H01F27/30

CPC分类号： H01F27/2847 ,  H01F27/303 ,  H01F41/12

摘要： A winding system may include a plurality of metal plates including the same shape and size, such that the plates are stacked, and each of the plurality of metal plates is reversely positioned with respect to a gap pattern in an adjacent one of the plurality of metal plates. The plates are simultaneously brazed together while flow of molten brazing material is constrained by grooves formed on brazing tabs of the plates.

公开(公告)号：US20180211775A1

公开(公告)日：2018-07-26

申请号：US15878229

申请日：2018-01-23

申请人： Apple Inc.

发明人： Alexander V. Salvatti ,  Bonnie W. Tom

IPC分类号： H01F41/04 ,  H01F7/06 ,  H01F27/28 ,  H01F27/29 ,  H01F41/12 ,  H01F27/32 ,  H04R9/04

CPC分类号： H01F41/041 ,  H01F7/0289 ,  H01F7/06 ,  H01F17/0013 ,  H01F27/2804 ,  H01F27/29 ,  H01F27/323 ,  H01F41/12 ,  H01F41/122 ,  H01F2027/2809 ,  H04R1/06 ,  H04R7/10 ,  H04R9/046 ,  H04R9/047 ,  H04R31/003

摘要： A multilayer circuit structure has a number of electrically conductive trace layers, separated from each other by a number of electrically insulating layers. The thickness of any given one of the conductive trace layers is greater than the thickness of its adjacent one of the insulating layers. Also, each of the conductive trace layers is bonded to an adjacent one of the insulating layers, and is electrically joined to an adjacent one of the conductive trace layers through a gap in the adjacent one of the insulator layers that is between them. Other aspects are also described and claimed.

公开(公告)号：US20180151290A1

公开(公告)日：2018-05-31

申请号：US15818778

申请日：2017-11-21

申请人： Realtek Semiconductor Corporation

发明人： Hsiao-Tsung YEN ,  Yuh-Sheng Jean ,  Ta-Hsun Yeh

IPC分类号： H01F27/36 ,  H01F27/28 ,  H01F27/29 ,  H01F27/32 ,  H01F41/04 ,  H01F41/12

CPC分类号： H01F27/36 ,  H01F17/0006 ,  H01F27/2804 ,  H01F27/29 ,  H01F27/32 ,  H01F41/041 ,  H01F41/12 ,  H01F2017/008

摘要： An integrated inductor is disclosed herein. The integrated inductor includes a substrate, an insulation layer, and an inductor. The substrate includes a trench. At least a portion of the insulation layer is formed in the trench. The inductor is disposed in the trench, and the inductor is disposed on the insulation layer.

公开(公告)号：US09773611B2

公开(公告)日：2017-09-26

申请号：US14516151

申请日：2014-10-16

申请人： SAMSUNG ELECTRO-MECHANICS CO., LTD.

发明人： Sung Hyun Kim ,  Myoung Soon Park ,  Sung Hee Kim ,  Tae Young Kim ,  Hye Yeon Cha

IPC分类号： H01F5/00 ,  H01F27/28 ,  B29C65/00 ,  H01B13/00 ,  H01F7/06 ,  H01F41/12 ,  H01F17/00 ,  H01F17/04

CPC分类号： H01F41/12 ,  H01F17/0013 ,  H01F2017/0066 ,  H01F2017/048

摘要： A chip electronic component may include: a magnetic body having a coil conductive pattern part embedded therein; and an oxide insulating film formed on a surface of the coil conductive pattern part. Even in the case that the insulating film is formed to be thinner than an insulating film, it may prevent the coil conductive pattern part from being exposed, whereby a magnetic material and the coil conductive pattern part may not contact each other. Therefore, a waveform defect may be prevented at a high frequency.